Pin 2 is in electrical contact with the mounting base.
1
2
3
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
BDT61
Collector-base voltage (I
Collector-emitter voltage (I
Emitter-base voltageV
Continuous collector currentI
Continuous base currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 1)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 2)P
Operating junction temperature rangeT
Storage temperature rangeT
Operating free-air temperature rangeT
NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.4 W/°C.
2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
E
= 0)
= 0)
B
BDT61A
BDT61B
BDT61C
BDT61
BDT61A
BDT61B
BDT61C
V
V
CBO
CEO
EBO
C
B
tot
tot
j
stg
A
MDTRACA
60
80
100
120
60
80
100
120
5V
4A
0.1A
50W
2W
-65 to +150°C
-65 to +150°C
-65 to +150°C
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
BDT61, BDT61A, BDT61B, BDT61C
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
BDT61
V
(BR)CEO
I
CEO
I
CBO
I
EBO
h
V
CE(sat)
V
BE(on)
V
Collector-emitter
breakdown voltage
Collector-emitter
cut-off current
Collector cut-off
current
Emitter cut-off
current
Forward current
FE
transfer ratio
Collector-emitter
saturation voltage
Base-emitter
voltage
Parallel diode
EC
forward voltage
= 30 mAIB = 0(see Note 3)
I
C
V
= 30 V
CE
= 40 V
V
CE
= 50 V
V
CE
= 60 V
V
CE
V
= 60 V
CB
= 80 V
V
CB
= 100 V
V
CB
= 120 V
V
CB
= 30 V
V
CB
= 40 V
V
CB
= 50 V
V
CB
= 60 V
V
CB
= 5 VIC= 05mA
V
EB
= 3 VIC= 1.5 A(see Notes 3 and 4)750
V
CE
= 6 mAIC= 1.5 A(see Notes 3 and 4)2.5V
I
B
= 3 VIC= 1.5 A(see Notes 3 and 4)2.5V
V
CE
= 1.5 AIB = 02V
I
E
I
= 0
B
= 0
I
B
= 0
I
B
= 0
I
B
I
= 0
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
T
= 150°C
C
= 150°C
T
C
= 150°C
T
C
= 150°C
T
C
NOTES: 3. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
4. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONS
Turn-on timeIC = 2 A
t
on
t
Turn-off time4.5µs
off
†
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
V
BE(off)
= -5 V
I
B(on)
R
L
= 8 mA
= 20 Ω
†
I
= -8 mA
B(off)
= 20 µs, dc ≤ 2%
t
p
PRODUCT INFORMATION
MINTYPMAXUNIT
1µs
2
Page 3
BDT61, BDT61A, BDT61B, BDT61C
NPN SILICON POWER DARLINGTONS
TYPICAL CHARACTERISTICS
AUGUST 1993 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
COLLECTOR CURRENT
20000
10000
1000
- Typical DC Current Gain
FE
h
VCE = 3 V
tp = 300 µs, duty cycle < 2%
100
0·55·01·0
IC - Collector Current - A
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
TCS110AD
TC = -40°C
TC = 25°C
TC = 100°C
COLLECTOR CURRENT
2·0
tp = 300 µs, duty cycle < 2%
IB = IC / 100
1·5
1·0
0·5
- Collector-Emitter Saturation Voltage - V
CE(sat)
V
0
0·55·01·0
IC - Collector Current - A
vs
Figure 1. Figure 2.
TCS110AB
TC = -40°C
TC = 25°C
TC = 100°C
BASE-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT
3·0
TC = -40°C
TC = 25°C
TC = 100°C
2·5
2·0
1·5
- Base-Emitter Saturation Voltage - V
1·0
BE(sat)
V
IB = IC / 100
tp = 300 µs, duty cycle < 2%
0·5
0·55·01·0
IC - Collector Current - A
Figure 3.
TCS110AC
PRODUCT INFORMATION
3
Page 4
BDT61, BDT61A, BDT61B, BDT61C
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
10
1·0
- Collector Current - A
0·1
C
I
SAFE OPERATING AREA
SAS110AB
BDT61
BDT61A
BDT61B
BDT61C
0.01
1·0101001000
VCE - Collector-Emitter Voltage - V
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
60
50
40
30
20
TIS110AA
- Maximum Power Dissipation - W
tot
P
10
0
0255075100125150
TC - Case Temperature - °C
PRODUCT INFORMATION
4
Figure 5.
Page 5
BDT61, BDT61A, BDT61B, BDT61C
Version 1, 18.0 mm. Version 2, 17.6 mm.
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97
0,61
10,4
10,0
123
1,70
1,07
2,74
2,34
5,28
4,88
2,95
2,54
6,1
3,5
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
14,1
12,7
0,64
0,41
2,90
2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
5
Page 6
BDT61, BDT61A, BDT61B, BDT61C
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.