Datasheet BDT61C, BDT61B, BDT61A, BDT61 Datasheet (Power Innovations)

Page 1
BDT60, BDT60A, BDT60B and BDT60C
50 W at 25°C Case Temperature
BDT61, BDT61A, BDT61B, BDT61C
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997Copyright © 1997, Power Innovations Limited, UK
TO-220 PACKAGE
(TOP VIEW)
4 A Continuous Collector Current
Minimum h
of 750 at 1.5 V, 3 A
FE
B C E
Pin 2 is in electrical contact with the mounting base.
1 2 3
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATING SYMBOL VALUE UNIT
BDT61
Collector-base voltage (I
Collector-emitter voltage (I
Emitter-base voltage V Continuous collector current I Continuous base current I Continuous device dissipation at (or below) 25°C case temperature (see Note 1) P Continuous device dissipation at (or below) 25°C free air temperature (see Note 2) P Operating junction temperature range T Storage temperature range T Operating free-air temperature range T
NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.4 W/°C.
2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
E
= 0)
= 0)
B
BDT61A BDT61B BDT61C BDT61 BDT61A BDT61B BDT61C
V
V
CBO
CEO
EBO
C B tot tot
j
stg
A
MDTRACA
60
80 100 120
60
80 100 120
5 V 4 A
0.1 A 50 W
2 W
-65 to +150 °C
-65 to +150 °C
-65 to +150 °C
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters.
1
Page 2
BDT61, BDT61A, BDT61B, BDT61C NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BDT61
V
(BR)CEO
I
CEO
I
CBO
I
EBO
h
V
CE(sat)
V
BE(on)
V
Collector-emitter breakdown voltage
Collector-emitter cut-off current
Collector cut-off current
Emitter cut-off current Forward current
FE
transfer ratio Collector-emitter saturation voltage Base-emitter voltage Parallel diode
EC
forward voltage
= 30 mA IB = 0 (see Note 3)
I
C
V
= 30 V
CE
= 40 V
V
CE
= 50 V
V
CE
= 60 V
V
CE
V
= 60 V
CB
= 80 V
V
CB
= 100 V
V
CB
= 120 V
V
CB
= 30 V
V
CB
= 40 V
V
CB
= 50 V
V
CB
= 60 V
V
CB
= 5 V IC= 0 5 mA
V
EB
= 3 V IC= 1.5 A (see Notes 3 and 4) 750
V
CE
= 6 mA IC= 1.5 A (see Notes 3 and 4) 2.5 V
I
B
= 3 V IC= 1.5 A (see Notes 3 and 4) 2.5 V
V
CE
= 1.5 A IB = 0 2 V
I
E
I
= 0
B
= 0
I
B
= 0
I
B
= 0
I
B
I
= 0
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
= 0
I
E
T
= 150°C
C
= 150°C
T
C
= 150°C
T
C
= 150°C
T
C
NOTES: 3. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle 2%.
4. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
BDT61A BDT61B BDT61C BDT61 BDT61A BDT61B BDT61C BDT61 BDT61A BDT61B BDT61C BDT61 BDT61A BDT61B BDT61C
60
80 100 120
0.5
0.5
0.5
0.5
0.2
0.2
0.2
0.2
2.0
2.0
2.0
2.0
V
mA
mA
thermal characteristics
PARAMETER MIN TYP MAX UNIT
R R
Junction to case thermal resistance 2.5 °C/W
θJC
Junction to free air thermal resistance 62.5 °C/W
θJA
resistive-load-switching characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS
Turn-on time IC = 2 A
t
on
t
Turn-off time 4.5 µs
off
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
V
BE(off)
= -5 V
I
B(on)
R
L
= 8 mA
= 20
I
= -8 mA
B(off)
= 20 µs, dc 2%
t
p
PRODUCT INFORMATION
MIN TYP MAX UNIT
1 µs
2
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BDT61, BDT61A, BDT61B, BDT61C
NPN SILICON POWER DARLINGTONS
TYPICAL CHARACTERISTICS
AUGUST 1993 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
COLLECTOR CURRENT
20000
10000
1000
- Typical DC Current Gain
FE
h
VCE = 3 V tp = 300 µs, duty cycle < 2%
100
0·5 5·01·0
IC - Collector Current - A
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
TCS110AD
TC = -40°C TC = 25°C TC = 100°C
COLLECTOR CURRENT
2·0
tp = 300 µs, duty cycle < 2% IB = IC / 100
1·5
1·0
0·5
- Collector-Emitter Saturation Voltage - V
CE(sat)
V
0
0·5 5·01·0
IC - Collector Current - A
vs
Figure 1. Figure 2.
TCS110AB
TC = -40°C TC = 25°C TC = 100°C
BASE-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT
3·0
TC = -40°C TC = 25°C TC = 100°C
2·5
2·0
1·5
- Base-Emitter Saturation Voltage - V 1·0
BE(sat)
V
IB = IC / 100 tp = 300 µs, duty cycle < 2%
0·5
0·5 5·01·0
IC - Collector Current - A
Figure 3.
TCS110AC
PRODUCT INFORMATION
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BDT61, BDT61A, BDT61B, BDT61C NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
10
1·0
- Collector Current - A
0·1
C
I
SAFE OPERATING AREA
SAS110AB
BDT61 BDT61A BDT61B BDT61C
0.01 1·0 10 100 1000
VCE - Collector-Emitter Voltage - V
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
60
50
40
30
20
TIS110AA
- Maximum Power Dissipation - W
tot
P
10
0
0 25 50 75 100 125 150
TC - Case Temperature - °C
PRODUCT INFORMATION
4
Figure 5.
Page 5
BDT61, BDT61A, BDT61B, BDT61C
Version 1, 18.0 mm. Version 2, 17.6 mm.
NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97 0,61
10,4 10,0
1 2 3
1,70 1,07
2,74 2,34
5,28 4,88
2,95 2,54
6,1 3,5
4,70 4,20
1,32 1,23
6,6 6,0
15,90 14,55
14,1 12,7
0,64 0,41
2,90 2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab. B. Mounting tab corner profile according to package version. C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
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BDT61, BDT61A, BDT61B, BDT61C NPN SILICON POWER DARLINGTONS
AUGUST 1993 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1997, Power Innovations Limited
PRODUCT INFORMATION
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