Pin 2 is in electrical contact with the mounting base.
3
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
BD745
Collector-base voltage (I
Collector-emitter voltage (I
E
= 0)
= 0)
B
Emitter-base voltageV
Continuous collector currentI
Peak collector current (see Note 1)I
Continuous base currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)P
Unclamped inductive load energy (see Note 4)½LI
Operating free air temperature rangeT
Operating junction temperature rangeT
Storage temperature rangeT
Lead temperature 3.2 mm from case for 10 secondsT
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.92 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 28 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I
= 0, RS = 0.1 Ω, VCC = 20 V.
V
BE(off)
BD745A
BD745B
BD745C
BD745
BD745A
BD745B
BD745C
V
V
CBO
CEO
EBO
C
CM
B
tot
tot
A
stg
L
C
j
2
B(on)
50
70
90
110
45
60
80
100
5V
20A
25A
7A
115W
3.5W
90mJ
-65 to +150°C
-65 to +150°C
-65 to +150°C
260°C
= 0.4 A, RBE = 100 Ω,
MDTRAA
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
BD745, BD745A, BD745B, BD745C
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
BD745
V
(BR)CEO
Collector-emitter
breakdown voltage
= 30 mAIB = 0(see Note 5)
I
C
BD745A
BD745B
BD745C
I
CBO
I
CEO
I
EBO
h
V
CE(sat)
V
|hfe|
Collector cut-off
current
Collector cut-off
current
Emitter cut-off
current
Forward current
FE
transfer ratio
Collector-emitter
saturation voltage
Base-emitter
BE
voltage
Small signal forward
h
fe
current transfer ratio
Small signal forward
current transfer ratio
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
45
60
80
100
40
20
V
0.1
0.1
0.1
0.1
mA
5
5
5
5
0.1
0.1
mA
150
5
1
3
1
3
V
V
thermal characteristics
PARAMETERMINTYPMAXUNIT
R
R
Junction to case thermal resistance1.1°C/W
θJC
Junction to free air thermal resistance35.7°C/W
θJA
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONS
Delay time
t
d
t
Rise time350ns
r
Storage time500ns
t
s
Fall time400ns
t
f
†
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
I
C
V
BE(off)
= 5 A
= -4.2 V
I
B(on)
R
= 6 Ω
L
= 0.5 A
†
I
= -0.5 A
B(off)
= 20 µs, dc ≤ 2%
t
p
PRODUCT INFORMATION
MINTYPMAXUNIT
20ns
2
Page 3
BD745, BD745A, BD745B, BD745C
NPN SILICON POWER TRANSISTORS
TYPICAL CHARACTERISTICS
AUGUST 1978 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
100
- DC Current Gain
FE
h
VCE = 4 V
tp = 300 µs, duty cycle < 2%
10
0·11·010 100
IC - Collector Current - A
TC = 125°C
TC = 25°C
TC = -55°C
Figure 1. Figure 2.
TCS635AE
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT
10
I
C
= 10
I
B
tp = 300µs, duty cycle < 2%
1·0
0·1
- Collector-Emitter Saturation Voltage - V
CE(sat)
V
0·01
0·11·010100
IC - Collector Current - A
TCS635AF
TC = -55°C
TC = 25°C
TC = 125°C
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
100
10
1·0
- Collector Current - A
C
I
0·1
BD745
BD745A
BD745B
0·01
1·0101001000
BD745C
VCE - Collector-Emitter Voltage - V
SAS635AC
tp = 1 ms,
d = 0.1 = 10%
tp = 10 ms,
d = 0.1 = 10%
tp = 50 ms,
d = 0.1 = 10%
DC Operation
PRODUCT INFORMATION
Figure 3.
3
Page 4
BD745, BD745A, BD745B, BD745C
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
120
100
80
60
40
- Maximum Power Dissipation - W
tot
P
20
vs
CASE TEMPERATURE
TIS635AB
0
0255075100125150
TC - Case Temperature - °C
Figure 4.
PRODUCT INFORMATION
4
Page 5
BD745, BD745A, BD745B, BD745C
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93
4,1
ø
4,0
12,2 MAX.
1,30
1,10
12
15,2
14,7
11,1
10,8
4,90
4,70
1,37
3,95
4,15
16,2 MAX.
31,0 TYP.
18,0 TYP.
3
1,17
0,78
0,50
2,50 TYP.
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the mounting tab.
PRODUCT INFORMATION
MDXXAW
5
Page 6
BD745, BD745A, BD745B, BD745C
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.