Pin 2 is in electrical contact with the mounting base.
1
2
3
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
BD539
BD539A
Collector-base voltage
Collector-emitter voltage (see Note 1)
Emitter-base voltageV
Continuous collector currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)P
Operating free air temperature rangeT
Operating junction temperature rangeT
Storage temperature rangeT
Lead temperature 3.2 mm from case for 10 secondsT
NOTES: 1. These values apply when the base-emitter diode is open circuited.
2. Derate linearly to 150°C case temperature at the rate of 0.36 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
BD539, BD539A, BD539B, BD539C, BD539D
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
current transfer ratio
Small signal forward
current transfer ratio
= 30 mA
I
C
IB = 0
(see Note 4)
V
= 40 V
CE
= 60 V
V
CE
= 80 V
V
CE
= 100 V
V
CE
= 120 V
V
CE
V
= 30 V
CE
= 60 V
V
CE
= 90 V
V
CE
= 5 VIC= 01mA
V
EB
V
= 4 V
CE
= 4 V
V
CE
= 4 V
V
CE
I
= 125 mA
B
= 375 mA
I
B
= 1 A
I
B
= 4 VIC= 3 A(see Notes 4 and 5)1.25V
V
CE
= 10 VIC= 0.5 Af = 1 kHz20
V
CE
= 10 VIC= 0.5 Af = 1 MHz3
V
CE
V
BE
V
BE
V
BE
V
BE
V
BE
I
B
I
B
I
B
I
C
I
C
I
C
I
C
I
C
I
C
= 0
= 0
= 0
= 0
= 0
= 0
= 0
= 0
= 0.5 A
= 1 A
= 3 A
= 1 A
= 3 A
= 5 A
NOTES: 4. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
40
60
80
100
120
40
30
12
0.2
0.2
0.2
0.2
0.2
0.3
0.3
0.3
0.25
0.8
1.5
V
mA
mA
V
thermal characteristics
PARAMETERMINTYPMAXUNIT
R
R
Junction to case thermal resistance2.78°C/W
θJC
Junction to free air thermal resistance62.5°C/W
θJA
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONS
Turn-on timeIC = 1 A
t
on
t
Turn-off time2µs
off
†
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
V
BE(off)
= -4.3 V
I
B(on)
= 30 Ω
R
L
= 0.1 A
†
I
= -0.1 A
B(off)
= 20 µs, dc ≤ 2%
t
p
PRODUCT INFORMATION
MINTYPMAXUNIT
0.5µs
2
Page 3
BD539, BD539A, BD539B, BD539C, BD539D
NPN SILICON POWER TRANSISTORS
TYPICAL CHARACTERISTICS
JUNE 1973 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
1000
VCE = 4 V
tp = 300 µs, duty cycle < 2%
100
- DC Current Gain
FE
h
10
0·010·11·010
IC - Collector Current - A
TC = 25°C
TC = 80°C
Figure 1. Figure 2.
TCS631AH
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
BASE CURRENT
10
1·0
0·1
- Collector-Emitter Saturation Voltage - V
V
IC = 100 mA
IC = 300 mA
IC = 1 A
CE(sat)
IC = 3 A
0·01
0·11·0101001000
IB - Base Current - mA
TCS631AB
BASE-EMITTER VOLTAGE
vs
COLLECTOR CURRENT
1·0
VCE = 4 V
TC = 25°C
0·9
0·8
0·7
- Base-Emitter Voltage - V
BE
V
0·6
0·5
0·010·11·010
IC - Collector Current - A
Figure 3.
TCS631AC
PRODUCT INFORMATION
3
Page 4
BD539, BD539A, BD539B, BD539C, BD539D
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
10
1·0
- Collector Current - A
0·1
C
I
BD539
BD539A
BD539B
BD539C
0·01
1·0101001000
BD539D
VCE - Collector-Emitter Voltage - V
SAS631AI
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
50
40
30
20
- Maximum Power Dissipation - W
tot
10
P
0
0255075100125150
TC - Case Temperature - °C
TIS631AC
PRODUCT INFORMATION
4
Figure 5.
Page 5
BD539, BD539A, BD539B, BD539C, BD539D
Version 1, 18.0 mm. Version 2, 17.6 mm.
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97
0,61
10,4
10,0
123
1,70
1,07
2,74
2,34
5,28
4,88
2,95
2,54
6,1
3,5
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
14,1
12,7
0,64
0,41
2,90
2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
5
Page 6
BD539, BD539A, BD539B, BD539C, BD539D
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.