Pin 2 is in electrical contact with the mounting base.
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATINGSYMBOLVALUEUNIT
BD239
Collector-emitter voltage (R
Collector-emitter voltage (I
= 100 Ω)
BE
= 30 mA)
C
Emitter-base voltageV
Continuous collector currentI
Peak collector current (see Note 1)I
Continuous base currentI
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)P
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)P
Unclamped inductive load energy (see Note 4)½LI
Operating junction temperature rangeT
Storage temperature rangeT
Lead temperature 3.2 mm from case for 10 secondsT
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.24 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I
= 0, RS = 0.1 Ω, VCC = 20 V.
V
BE(off)
BD239A
BD239B
BD239C
BD239
BD239A
BD239B
BD239C
V
V
CER
CEO
EBO
C
CM
B
tot
tot
stg
L
C
j
2
B(on)
MDTRACA
55
70
90
115
45
60
80
100
5V
2A
4A
0.6A
30W
2W
32mJ
-65 to +150°C
-65 to +150°C
250°C
= 0.4 A, RBE = 100 Ω,
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
Page 2
BD239, BD239A, BD239B, BD239C
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
BD239
V
(BR)CEO
I
CES
I
CEO
I
EBO
h
V
CE(sat)
V
h
|hfe|
Collector-emitter
breakdown voltage
Collector-emitter
cut-off current
Collector cut-off
current
Emitter cut-off
current
Forward current
FE
transfer ratio
Collector-emitter
saturation voltage
Base-emitter
BE
voltage
Small signal forward
fe
current transfer ratio
Small signal forward
current transfer ratio
= 30 mA
I
C
IB = 0
(see Note 5)
V
= 55 V
CE
= 70 V
V
CE
= 90 V
V
CE
= 115 V
V
CE
VCE= 30 V
= 60 V
V
CE
= 5 VIC= 01µA
V
EB
VCE = 4 V
= 4 V
V
CE
= 0.2 AIC= 1 A(see Notes 5 and 6)0.7V
I
B
= 4 VIC= 1 A(see Notes 5 and 6)1.3V
V
CE
= 10 VIC= 0.2 Af = 1 kHz20
V
CE
= 10 VIC= 0.2 Af = 1 MHz3
V
CE
V
BE
V
BE
V
BE
V
BE
I
B
I
B
I
C
I
C
= 0
= 0
= 0
= 0
= 0
= 0
= 0.2 A
= 1 A
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
resistive-load-switching characteristics at 25°C case temperature
PARAMETERTEST CONDITIONS
Turn-on timeIC = 200 mA
t
on
t
Turn-off time0.8µs
off
†
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
V
BE(off)
= -3.4 V
I
B(on)
= 150 Ω
R
L
= 20 mA
†
I
= -20 mA
B(off)
= 20 µs, dc ≤ 2%
t
p
MINTYPMAXUNIT
0.3µs
PRODUCT INFORMATION
2
Page 3
BD239, BD239A, BD239B, BD239C
NPN SILICON POWER TRANSISTORS
TYPICAL CHARACTERISTICS
JUNE 1973 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
1000
VCE = 4 V
tp = 300 µs, duty cycle < 2%
100
- DC Current Gain
FE
h
10
0·010·11·0
IC - Collector Current - A
TC = 25°C
TC = 80°C
Figure 1. Figure 2.
TCS631AG
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
BASE CURRENT
10
1·0
0·1
- Collector-Emitter Saturation Voltage - V
CE(sat)
V
0·01
0·11·0101001000
IB - Base Current - mA
TCS631AE
IC = 100 mA
IC = 300 mA
IC = 1 A
BASE-EMITTER VOLTAGE
vs
COLLECTOR CURRENT
1·0
VCE = 4 V
TC = 25°C
0·9
0·8
0·7
- Base-Emitter Voltage - V
BE
V
0·6
0·5
0·010·11·0
IC - Collector Current - A
Figure 3.
TCS631AF
PRODUCT INFORMATION
3
Page 4
BD239, BD239A, BD239B, BD239C
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
100
10
1·0
- Collector Current - A
C
I
0·1
0·01
1·0101001000
VCE - Collector-Emitter Voltage - V
SAFE OPERATING AREA
tp = 300 µs, d = 0.1 = 10%
tp = 1 ms, d = 0.1 = 10%
tp = 10 ms, d = 0.1 = 10%
DC Operation
BD239
BD239A
BD239B
BD239C
SAS631AE
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
40
30
20
10
- Maximum Power Dissipation - W
tot
P
0
0255075100125150
TC - Case Temperature - °C
TIS631AB
PRODUCT INFORMATION
4
Figure 5.
Page 5
BD239, BD239A, BD239B, BD239C
Version 1, 18.0 mm. Version 2, 17.6 mm.
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97
0,61
10,4
10,0
123
1,70
1,07
2,74
2,34
5,28
4,88
2,95
2,54
6,1
3,5
4,70
4,20
1,32
1,23
6,6
6,0
15,90
14,55
14,1
12,7
0,64
0,41
2,90
2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
5
Page 6
BD239, BD239A, BD239B, BD239C
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.