Page 1
SEMICONDUCTOR TECHNICAL DATA
Order this document
by BCP68T1/D
Motorola Preferred Device
This NPN Silicon Epitaxial Transistor is designed for use in low voltage, high current
applications. The device is housed in the SOT-223 package, which is designed for
medium power surface mount applications.
• High Current: IC = 1.0 Amp
• The SOT-223 Package can be soldered using wave or reflow.
• SOT-223 package ensures level mounting, resulting in improved thermal
conduction, and allows visual inspection of soldered joints. The formed leads
absorb thermal stress during soldering, eliminating the possibility of damage to
the die
• Available in 12 mm Tape and Reel
Use BCP68T1 to order the 7 inch/1000 unit reel.
COLLECTOR 2,4
Use BCP68T3 to order the 13 inch/4000 unit reel.
• The PNP Complement is BCP69T1
(T
MAXIMUM RATINGS
Collector-Emitter Voltage V
Collector-Base Voltage V
Emitter-Base Voltage V
Collector Current I
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Operating and Storage Temperature Range TJ, T
= 25°C unless otherwise noted)
C
Rating
(1)
BASE
1
EMITTER 3
Symbol Value Unit
CEO
CBO
EBO
C
P
D
stg
DEVICE MARKING
CA
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) R
Maximum Temperature for Soldering Purposes
Time in Solder Bath
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
θJA
T
L
MEDIUM POWER
NPN SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT
4
1
2
3
CASE 318E-04, STYLE 1
TO-261AA
25 Vdc
20 Vdc
5 Vdc
1 Adc
1.5
12
–65 to 150 °C
83.3 °C/W
260
10
Watts
mW/°C
°C
Sec
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Motorola, Inc. 1996
1
Page 2
BCP68T1
ELECTRICAL CHARACTERISTICS
Characteristics
(T
= 25°C unless otherwise noted)
A
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage
(IC = 100 µAdc, IE = 0)
Collector-Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
Emitter-Base Breakdown Voltage
(IE = 10 µAdc, IC = 0)
Collector-Base Cutoff Current
(VCB = 25 Vdc, IE = 0)
Emitter-Base Cutoff Current
(VEB = 5.0 Vdc, IC = 0)
ON CHARACTERISTICS (2)
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 Adc, VCE = 1.0 Vdc)
Collector-Emitter Saturation Voltage
(IC = 1.0 Adc, IB = 100 mAdc)
Base-Emitter On Voltage
(IC = 1.0 Adc, VCE = 1.0 Vdc)
DYNAMIC CHARACTERISTICS
Current-Gain — Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc)
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
Symbol Min Typ Max Unit
V
(BR)CES
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
h
FE
V
CE(sat)
V
BE(on)
f
T
25 — — Vdc
20 — — Vdc
5.0 — — Vdc
— — 10 µAdc
— — 10 µAdc
50
85
60
— — 0.5 Vdc
— — 1.0 Vdc
— 60 — MHz
—
—
—
—
375
—
—
300
200
100
, DC CURRENT GAIN
FE
h
10
TYPICAL ELECTRICAL CHARACTERISTICS
TJ = 125°C
= 25°C
= –55°C
VCE = 1.0 V
IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain
300
200
100
70
50
T
30
1000100101.0
f , CURRENT-GAIN-BANDWIDTH PRODUCT (MHz)
VCE = 10 V
TJ = 25
°
C
f = 30 MHz
IC, COLLECTOR CURRENT (mA)
100010010 200
Figure 2. Current-Gain-Bandwidth Product
2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Page 3
TYPICAL ELECTRICAL CHARACTERISTICS
BCP68T1
1.0
TJ = 25°C
V
@ IC/IB = 10
BE(sat)
V
@ VCE = 1.0 V
BE(on)
V
@ IC/IB = 10
CE(sat)
IC, COLLECTOR CURRENT (mA)
100010010
V, VOLTAGE (VOLTS)
0.8
0.6
0.4
0.2
0
1.0
Figure 3. “On” Voltage
25
20
15
, CAPACITANCE (pF)
ob
C
10
5.0
0 5.0 10 15 20
VR, REVERSE VOLTAGE (VOLTS)
TJ = 25°C
, CAPACITANCE (pF)
ib
C
°
, TEMPERATURE COEFFICIENT (mV/ C)
VB
θ
R
80
70
60
50
40
30
–0.8
–1.2
–1.6
–2.0
–2.4
–2.8
TJ = 25°C
0
1.0 2.0 3.0 4.0
VR, REVERSE VOLTAGE (VOLTS)
5.0
Figure 4. Capacitance
R
for V
θ
VB
BE
100101.0
IC, COLLECTOR CURRENT (mA)
1000
Figure 5. Capacitance
1.0
0.8
0.6
IC= 10 mA = 100 mA
0.4
, COLLECTOR VOLTAGE (V)
CE
0.2
V
0
Figure 6. Base-Emitter T emperature Coefficient
= 50 mA
101.00.10.01
IB, BASE CURRENT (mA)
Figure 7. Saturation Region
TJ = 25°C
= 1000 mA
= 500 mA
100
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
Page 4
BCP68T1
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.079
2.0
0.091
2.3
0.079
2.0
0.059
1.5
SOT-223
SOT-223 POWER DISSIPATION
The power dissipation of the SOT-223 is a function of the
collector pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
ture of the die, R
junction to ambient, and the operating temperature, TA.
Using the values provided on the data sheet for the SOT-223
package, PD can be calculated as follows:
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 1.5 watts.
PD =
The 83.3°C/W for the SOT-223 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 1.5 watts. There are
other alternatives to achieving higher power dissipation from
the SOT-223 package. One is to increase the area of the
collector pad. By increasing the area of the collector pad, the
, the maximum rated junction tempera-
J(max)
, the thermal resistance from the device
θJA
T
PD =
150°C – 25°C
83.3°C/W
J(max)
R
θJA
– T
A
= 1.5 watts
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.15
3.8
0.248
6.3
inches
mm
0.059
1.5
0.091
2.3
0.059
1.5
power dissipation can be increased. Although the power
dissipation can almost be doubled with this method, area is
taken up on the printed circuit board which can defeat the
purpose of using surface mount technology . A graph of R
versus collector pad area is shown in Figure 8.
160
Board Material = 0.0625
140
120
°
to Ambient ( C/W)
100
JA
θ
R , Thermal Resistance, Junction
80
0.0 0.2 0.4 0.6 0.8 1.0
G-10/FR-4, 2 oz Copper
0.8 Watts
*Mounted on the DPAK footprint
″
1.25 Watts*
A, Area (square inches)
Figure 8. Thermal Resistance versus Collector
Pad Area for the SOT-223 Package (Typical)
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Us ing a
board material such as Thermal Clad, an aluminum core board,
the power dissipation can be doubled using the same footprint.
θJA
TA = 25°C
1.5 Watts
4
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Page 5
SOLDER STENCIL GUIDELINES
BCP68T1
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
TYPICAL SOLDER HEA TING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 9 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SOT-223 package should be
the same as the pad size on the printed circuit board, i.e., a
1:1 registration.
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200
150
100
STEP 1
PREHEA T
ZONE 1
“RAMP”
DESIRED CURVE FOR HIGH
°
C
°
C
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
STEP 2
VENT
“SOAK”
MASS ASSEMBLIES
150°C
100°C
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
ZONES 3 & 6
160
°
140
Figure 9. T ypical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
STEP 4
HEATING
“SOAK”
C
°
C
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
170
°
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
STEP 6
VENT
C
T
MAX
STEP 7
COOLING
205
°
TO
219
°
C
PEAK AT
SOLDER
JOINT
5
Page 6
BCP68T1
P ACKAGE DIMENSIONS
0.08 (0003)
S
123
L
H
A
F
4
B
D
G
J
C
M
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIMAMIN MAX MIN MAX
0.249 0.263 6.30 6.70
B 0.130 0.145 3.30 3.70
C 0.060 0.068 1.50 1.75
D 0.024 0.035 0.60 0.89
F 0.115 0.126 2.90 3.20
G 0.087 0.094 2.20 2.40
H 0.0008 0.0040 0.020 0.100
J 0.009 0.014 0.24 0.35
K 0.060 0.078 1.50 2.00
L 0.033 0.041 0.85 1.05
M 0 10 0 10
____
S 0.264 0.287 6.70 7.30
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERS
CASE 318E–04
ISSUE H
TO-261AA
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 3–14–2 T atsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315
Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://motorola.com/sps
6
– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, T ai Po, N.T., Hong Kong. 852–26629298
◊
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Mfax is a trademark of Motorola, Inc.
BCP68T1/D
Loading...