Datasheet BC517-D Datasheet (ON Semiconductor)

Page 1
BC517
l
s
Darlington Transistors
NPN Silicon
Features
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COLLECTOR 1
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Voltage V Collector−Base Voltage V Collector−Emitter Voltage V Collector Current − Continuous I Total Power Dissipation @ TA = 25°C
Derate above T
Total Power Dissipation @ TA = 25°C
Derate above T
Operating and Storage Junction Temperature Range
= 25°C
A
= 25°C
A
TJ, T
CES
CB EB C
P
P
D
D
stg
30 Vdc 40 Vdc 10 Vdc
1.0 Adc
625
12
1.5 12
−55 to +150 °C
mW
mW/°C
W
mW/°C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
R
q
JA
R
q
JC
200 °C/W
83.3 °C/W
TO−92
CASE 29
STYLE 17
BASE
2
EMITTER 3
1
2
3
STRAIGHT LEAD
BULK PACK
MARKING DIAGRAM
BC
517
AYWWG
G
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 4
1 Publication Order Number:
A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
BC517G TO−92
(Pb−Free)
BC517RL1G TO−92
(Pb−Free)
BC517ZL1G TO−92
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD801 1/D.
5000 Units / Bulk
2000 / Tape & Ree
2000 / Ammo Pack
BC517/D
Page 2
BC517
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(I
= 2.0 mAdc, IBE = 0)
C
Collector−Base Breakdown Voltage
= 10 mAdc, IE = 0)
(I
C
Emitter−Base Breakdown Voltage
= 100 mAdc, IC = 0)
(I
E
Collector Cutoff Current
(V
= 30 Vdc)
CE
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
Emitter Cutoff Current
(VCB = 10 Vdc, IC = 0)
ON CHARACTERISTICS (Note 1)
DC Current Gain
(I
= 20 mAdc, VCE = 2.0 Vdc)
C
Collector−Emitter Saturation Voltage
(I
= 100 mAdc, IB = 0.1 mAdc)
C
Collector−Emitter Saturation Voltage
(I
= 10 mAdc, VCE = 5.0 Vdc)
C
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product (Note 2)
(I
= 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz)
C
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. = |hfe| f
2. f
T
test
V
(BR)CES
V
(BR)CBO
V
(BR)EBO
I
CES
I
CBO
I
EBO
h
V
CE(sat)
V
BE(on)
f
FE
T
30
Vdc
Vdc
40
Vdc
10
nAdc
500 nAdc
100 nAdc
100
30,000
Vdc
1.0
Vdc
1.4
MHz
200
R
S
i
n
e
n
IDEAL
TRANSISTOR
Figure 1. Transistor Noise Model
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2
Page 3
BC517
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25°C)
500
200
100
50
, NOISE VOLTAGE (nV)
20
n
e
5.0 101020 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
BANDWIDTH = 1.0 Hz R
0
S
IC = 1.0 mA
f, FREQUENCY (Hz)
10 mA
100 mA
Figure 2. Noise Voltage
200
BANDWIDTH = 10 Hz TO 15.7 kHz
100
70
IC = 10 mA
50
30
20
, TOTAL WIDEBAND NOISE VOLTAGE (nV)
T
V
10
100 mA
1.0 mA
1.0
2.0 5.0 10 20 50 100 200 500 1000 RS, SOURCE RESISTANCE (kW)
2.0
1.0
0.7
0.5
0.3
0.2
0.1
, NOISE CURRENT (pA)
n
0.07
i
0.05
0.03
0.02 10 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
BANDWIDTH = 1.0 Hz
IC = 1.0 mA
100 mA
10 mA
f, FREQUENCY (Hz)
Figure 3. Noise Current
14
12
10
8.0
6.0
4.0
NF, NOISE FIGURE (dB)
IC = 1.0 mA
2.0
0
1.0 2.0 5.0 10 20 50 100 200 500 1000
RS, SOURCE RESISTANCE (kW)
BANDWIDTH = 10 Hz TO 15.7 kHz
10 mA
100 mA
Figure 4. Total Wideband Noise Voltage
Figure 5. Wideband Noise Figure
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3
Page 4
BC517
SMALL−SIGNAL CHARACTERISTICS
20
10
7.0
5.0
C, CAPACITANCE (pF)
3.0
2.0
0.04
200k
100k
70k 50k
30k 20k
10k
, DC CURRENT GAIN
FE
7.0k
h
5.0k
3.0k
2.0k
5.0
TJ = 25°C
C
ibo
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Capacitance
TJ = 125°C
25°C
−55°C
7.0 10 20 30 50 70 100 200 300 IC, COLLECTOR CURRENT (mA)
VCE = 5.0 V
4.0 VCE = 5.0 V
f = 100 MHz
= 25°C
T
J
2.0
1.0
C
obo
0.8
0.6
0.4
|, SMALL−SIGNAL CURRENT GAIN
fe
|h
0.2
0.5 1.0 2.0 0.5 10 20 50 100 200 500 IC, COLLECTOR CURRENT (mA)
Figure 7. High Frequency Current Gain
3.0 TJ = 25°C
2.5
500
IC =
2.0
1.5
1.0
, COLLECTOR−EMITTER VOLTAGE (VOLTS)
CE
V
0.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000
50 mA 250 mA 500 mA
10 mA
IB, BASE CURRENT (mA)
V, VOLTAGE (VOLTS)
Figure 8. DC Current Gain
1.6
TJ = 25°C
1.4
V
@ IC/IB = 1000
BE(sat)
1.2
V
@ VCE = 5.0 V
BE(on)
1.0
0.8 V
CE(sat)
@ IC/IB = 1000
0.6
5.0
7.0 10 20 30 50 70 100 200 300 500 IC, COLLECTOR CURRENT (mA)
Figure 10. “On” Voltages
−1.0
−2.0
−3.0
−4.0
−5.0
, TEMPERATURE COEFFICIENTS (mV/ C)°
V
θ
R
−6.0
5.0 7.0 10 20 30 50 70 100 200 300 500
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4
Figure 9. Collector Saturation Region
*APPLIES FOR IC/IB hFE/3.0
*R
FOR V
q
qVB FOR V
CE(sat)
VC
BE
IC, COLLECTOR CURRENT (mA)
25°C TO 125°C
−55°C TO 25°C
25°C TO 125°C
−55°C TO 25°C
Figure 11. Temperature Coefficients
Page 5
1.0
a
0.7 D = 0.5
0.5
0.2
0.3
0.2
0.1
0.1
0.07
0.05
0.03
RESISTANCE (NORMALIZED)
0.02
0.05
SINGLE PULSE
SINGLE PULSE
BC517
Z Z
q
JC(t)
q
JA(t)
= r(t) • R = r(t) • R
T T
J(pk)
J(pk)
− TC = P
− TA = P
q
JC
q
JA
(pk)
(pk)
Z
q
JC(t)
Z
q
JA(t)
0.01
, COLLECTOR CURRENT (mA) I
2.0 5.01.00.50.20.1
1.0k 700
500
T
300
200
TA = 25°C
= 25°C
C
100
70 50
30
C
20
CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT
10
0.4
0.6 1.0 2.0 4.0 6.0 10 20 VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 13. Active Region Safe Operating Area
20 5010 200 500100 1.0k 2.0k 5.0k 10k
t, TIME (ms)
Figure 12. Thermal Response
1.0 ms
100 ms
1.0 s
40
Design Note: Use of Transient Thermal Resistance Dat
FIGURE A
t
P
P
P
t
1
1/f
DUTYCYCLE + t1f +
PEAK PULSE POWER = P
P
P
t
1
t
P
P
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Page 6
BC517
TO−92 (TO−226)
PACKAGE DIMENSIONS
CASE 29−1 1
ISSUE AM
SEATING PLANE
R
T
SEATING PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−−
MILLIMETERSINCHES
N
A
B
BENT LEAD
TAPE & REEL
AMMO PACK
P
K
XX
G
D
J
V
1
C
SECTION X−X
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 −−− N 2.04 2.66 P 1.50 4.00 R 2.93 −−− V 3.43 −−−
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
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BC517/D
6
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