Datasheet BAV103 Datasheet (Fairchild Semiconductor)

BAV103
General Description:
A General Purpose diode that couples high forward conductance fast switching speed and high blocking voltages in a glass leadless LL-34 Surface Mount package.
Placement of the Expansion Gap has no relationship to the location of the Cathode Terminal which is indicated by the first color band.
Expansion Gap
High Voltage, General Purpose Diode
Absolute Maximum Ratings* TA = 25
Sym Parameter Value Units
O
C unless otherwise noted
GREEN
ORANGE
T
stg
T
P
D
Linear Derating Factor from T R
OJA
W
iv
I
O
I
F
i
f
i
F(surge)
Storage Temperature -65 to +200 Operating Junction Temperature -65 to +200 OC Total Power Dissipation at TA = 25OC 500 mW
= 25OC 3.33 mW/OC
A
Thermal Resistance Junction-to-Ambient 350 OC/W Working Inverse Voltage 200 V Average Rectified Current 200 mA DC Forward Current (IF) 500 mA Recurrent Peak Forward Current 600 mA
Peak Forward Surge Current (IFSM) Pulse Width = 1.0 second 1.0 Amp
Pulse Width = 1.0 microsecond 4.0 Amp
O
C
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
Electrical Characteristics TA = 25
O
C unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
B
Breakdown Voltage 250 V IR= 100 uA
V
I
V
C T
© 1997 Fairchild Semiconductor Corporation
Reverse Leakage 100 nA VR= 200 V
R
Forward Voltage 1.00 V IF= 100 mA
F
Capacitance 5.0 pF VR= 0.0 V,f = 1.0 MHz
T
Reverse Recovery Time 50 ns IF= IR 30 mA IRR= 1.0 mA
RR
100 uA VR= 200 V TA = 150OC
1.25 V IF= 200 mA
RL = 100 Ohms
THE PLACEMENT OF THE EXPANSION GAP HAS NO RELATIONSHIP TO THE LOCATION OF THE CATHODE TERMINAL OF THE DEVICE. THE EXPANSION GAP & CATHODE BAND CAN BE ON THE SAME TERMINAL OR AT OPPOSITE TERMINALS OF THE DIODE.
TERMINALS:
DUMET (ALLOY 47)
0.059 (1.499)
0.055 (1.397)
0.138 (3.505)
0.130 (3.302)
0.104 (2.64)
EXPANSION GAP
REFERENCE
GLASS SLEEVE
0.020 (0.50)
0.014 (0.35)
LL-34
JEDEC (AC VERSION)
Fairchild Semiconductor's Criteria
5-MAR-98
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ Bottomless™ CoolFET™ CROSSVOL T™ DenseTrench™ DOME™ EcoSPARK™ E2CMOS EnSigna
TM
TM
FACT™ FACT Quiet Series™
FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MICROWIRE™ OPTOLOGIC™
OPTOPLANAR™ PACMAN™ POP™ PowerTrench
QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER SMART ST ART™ Stealth™
SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ UltraFET
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS P ATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORA TION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. H2
Loading...