Page 1
Silicon Schottky Diodes
• For low-loss, fast-recovery, meter protection,
bias isolation and clamping application
• Integrated diffused guard ring
• Low forward voltage
BAT64...
BAT64 BAT64-06
BAT64-02V
BAT64-02W
BAT64-04
BAT64-04T
BAT64-05
BAT64-05W
BAT64-06W
BAT64-04W
!
!
,
,
!
,
,
!
,
,
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type Package Configuration L
BAT64
BAT64-02V*
BAT64-02W
BAT64-04
BAT64-04T*
BAT64-04W
BAT64-05
BAT64-05W
BAT64-06
SOT23
SC79
SCD80
SOT23
SC75
SOT323
SOT23
SOT323
SOT23
single
single
single
series
series
series
common cathode
common cathode
common anode
(nH) Marking
S
1.8
0.6
0.6
1.8
1.6
1.4
1.8
1.4
1.8
63s
t
64
64s
S1
64s
65s
65s
66s
BAT64-06W
* Preliminary data
SOT323
common anode
1
1.4
66s
2005-10-18
Page 2
Maximum Ratings at TA = 25°C, unless otherwise specified
BAT64...
Parameter
Diode reverse voltage V
Forward current I
Non-repetitive peak surge forward current
(t ≤ 10ms)
Average forward current (50/60Hz, sinus) I
Total power dissipation
BAT64, T
BAT64-02V, BAT64-02W, T
BAT64-04, BAT64-06, T
BAT64-04W, BAT64-06W, T
BAT64-05, T
BAT64-05W, T
BAT64-04T, T
≤ 86°C
S
≤ 36°C
S
S
≤ 104°C
S
≤ tbd
≤ 121°C
S
≤ 61°C
S
≤ 111°C
S
Junction temperature T
Storage temperature T
Symbol Value Unit
R
F
I
FSM
FAV
P
tot
40 V
250 mA
800
120
mW
250
250
250
250
250
250
250
j
stg
150 °C
-55 ... 150
Thermal Resistance
Parameter
Junction - soldering point1)
BAT64
BAT64-02V, BAT64-02W
BAT64-04, BAT64-06,
BAT64-04W, BAT64-06W
BAT64-05
BAT64-05W
BAT64-04T
1
For calculation of R
please refer to Application Note Thermal Resistance
thJA
Symbol Value Unit
R
thJS
K/W
≤ 255
≤ 115
≤ 355
≤ 155
≤ 455
≤ 185
tbd
2
2005-10-18
Page 3
Electrical Characteristics at TA = 25°C, unless otherwise specified
BAT64...
Parameter
DC Characteristics
Breakdown voltage
= 10 µA
I
(BR)
Reverse current
= 30 V
V
R
= 30 V, TA = 85 °C
V
R
Forward voltage
= 1 mA
I
F
= 10 mA
I
F
= 30 mA
I
F
= 100 mA
I
F
AC Characteristics
Diode capacitance
V
= 1 V, f = 1 MHz
R
Symbol Values Unit
min. typ. max.
V
I
V
C
(BR)
R
F
T
40 - - V
-
-
270
310
370
500
-
-
320
385
440
570
2
200
350
430
520
750
- 4 6 pF
µA
mV
Reverse recovery time
I
= 10 mA, IR = 10 mA, measured IR = 1 mA ,
F
R
= 100 Ω
L
t
rr
- - 5 ns
3
2005-10-18
Page 4
BAT64...
Diode capacitance CT = ƒ (VR)
f = 1MHz
10
pF
C
T
8
7
6
5
4
3
2
1
0
0
10 20 V 30
Reverse current IR = ƒ(VR)
= Parameter
T
A
EHB00059BAT 64...
Ι
R
V
R
BAT 64... EHB00058
2
10
A
µ
T
A
1
10
0
10
-1
10
-2
10
-3
10
0102030
= 125
25
V
R
85
V
C
C
C
Forward current IF = ƒ (VF)
= Parameter
T
A
BAT 64... EHB00057
2
10
mA
Ι
F
1
10
T
0
10
-1
10
-2
10
0 0.5
A
= -40
25
85
125
Forward current IF = ƒ (TS)
BAT64W
300
mA
C
C
C
C
1
V
V
F
200
F
I
150
100
50
0
0 15 30 45 60 75 90 105 120
°C
T
150
S
4
2005-10-18
Page 5
BAT64...
Forward current IF = ƒ (TS)
BAT64-02V, BAT64-02W
300
mA
200
F
I
150
100
50
0
0 15 30 45 60 75 90 105 120
Forward current IF = ƒ (TS)
BAT64-04, BAT64-06
300
mA
200
F
I
150
100
50
°C
150
T
S
0
0 15 30 45 60 75 90 105 120
°C
T
150
S
Forward current IF = ƒ (TS)
BAT64-04W, BAT64-06W
300
mA
200
F
I
150
100
50
0
0 15 30 45 60 75 90 105 120
Forward current IF = ƒ (TS)
BAT64-05
300
mA
200
F
I
150
100
50
°C
150
T
S
0
0 15 30 45 60 75 90 105 120
°C
T
150
S
5
2005-10-18
Page 6
BAT64...
Forward current IF = ƒ (TS)
BAT64-05W
300
mA
200
F
I
150
100
50
0
0 15 30 45 60 75 90 105 120
Permissible Puls Load R
thJS
= ƒ (tp)
BAT64-02V, BAT64-02W
3
10
K/W
2
10
thJS
R
10
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
-4
10
-3
10
-2
s
t
0
10
P
1
10
0
10
-1
10
°C
150
T
S
10
-6
10
-5
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAT64-02V, BAT64-02W
2
10
FDC
/I
Fmax
I
1
10
0
10
-6
10
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-5
10
-4
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAT64-04W, BAT64-06W
3
10
K/W
2
10
thJS
R
1
10
0.5
0.2
0.1
0.05
10
0.02
0.01
0.005
D = 0
-3
10
-2
s
10
0
tP
0
10
-1
-3
10
-2
s
t
0
10
P
10
10
-6
10
-5
10
-4
6
2005-10-18
Page 7
BAT64...
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAT64-04W, BAT64-06W
2
10
-
FDC
/I
Fmax
I
1
10
0
10
10
-6
10
-5
10
-4
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-3
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAT64-05W
3
10
K/W
2
10
thJS
R
1
10
0.5
0.2
0.1
0.05
10
0.02
0.01
0.005
D = 0
-3
10
-2
s
10
0
tP
0
10
-1
-2
s
10
0
10
10
-6
10
-5
10
-4
tP
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAT64-05W
2
10
-
FDC
/I
Fmax
I
1
10
0
10
10
-6
10
-5
10
-4
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-3
10
-2
s
t
0
10
p
7
2005-10-18
Page 8
Package Outline
Foot Print
Package SC75
±0.2
1.6
+0.1
0.2
-0.05
A
0.2
0.10
+0.1
-0.05
0.5
M
3
1 2
0.5
0.4
0.1 MAX.
±0.2
1.6
MAX.
10˚
0.20MA
0.7
0.15
±0.1
±0.1
±0.1
0.8
MAX.
10˚
BAT64...
Marking Layout
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.65
1.15
0.65
Manufacturer
Type code BCR108T
0.4
0.50.5
Example
4
0.45
0.2 MAX.
Pin 1
1.75
1.4
8
8
1.8
0.9
2005-10-18
Page 9
Package Outline
Foot Print
Package SC79
±0.1
0.8
2
Cathode
marking
1
0.3
±0.05
±0.1
1.6
0.55
MAX.
˚
10
±0.04
M
A0.2
0.13
+0.05
-0.03
A
MAX.
˚
10
±0.1
1.2
±0.05
0.2
BAT64...
Marking Layout
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.35
Date code
Type code
Laser marking
0.35
0.35
2003, July
BAR63-02V
Cathode marking
Example
Cathode
marking
4
1.96
1.33
8
0.4
0.93
9
0.2
0.66
2005-10-18
Page 10
Package Outline
Foot Print
Cathode
marking
Package SCD80
0.2MA
±0.1
0.8
2
MAX.
˚
±0.1
10
1.7
1
±0.05
0.3
0.7
0.13
±0.1
+0.05
-0.03
˚
±1.5
˚
7
BAT64...
A
±0.1
1.3
±0.05
0.2
Marking Layout
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.45
Date code
Type code
Laser marking
0.35
0.35
2003, July
BAR63-02W
Cathode marking
Example
Cathode
marking
4
1.45
8
2.5
0.4
0.9
10
0.2
0.7
2005-10-18
Page 11
BAT64...
Data Code marking for discrete packages with
one digit (SCD80, SC79) CES-Code
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04 d s D S d s D S d s D S
05etETetETetET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09j yJYj yJYj y JY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
62
11
2005-10-18
Page 12
Package Outline
Foot Print
Package SOT23
±0.1
2.9
12
1)
+0.1
0.4
-0.05
1.9
0.25MBC
1) Lead width can be 0.6 max. in dambar area
B
3
C
0.95
0.8
0.15 MIN.
±0.15
2.4
0.2
±0.1
1
0.1 MAX.
10˚ MAX.
0.08...0.15
0...8˚
M
A
±0.1
1.3
10˚ MAX.
A
BAT64...
Marking Layout
12
Pin 1
s
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.8 1.2
Manufacturer
Date code (Year/Month)
Type code
4
0.9
0.9 0.91.3
EH
Example
0.2
s
2003, July
37
BCW66
Pin 1
3.15
2.13
12
2.65
8
1.15
2005-10-18
Page 13
Package Outline
Package SOT323
±0.2
2
0.3
+0.1
-0.05
3x
M
0.1
3
0.1 MAX.
0.1
0.9
BAT64...
±0.1
A
Foot Print
Marking Layout
12
0.650.65
0.6
1.6
0.8
0.65
0.65
±0.1
2.1
0.1 MIN.
M
0.2 A
0.15
+0.1
-0.05
±0.1
1.25
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
Pin 1
Manufacturer
Date code (Year/Month)
Type code
4
2.15
2005, June
BCR108W
Example
0.2
8
2.3
1.1
13
2005-10-18
Page 14
BAT64...
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
14
2005-10-18
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