Page 1
BAT54/A/C/S
PACKAGE
SOT-23
3
L4P
CONNECTION DIAGRAMS
BAT54
3
3
BAT54A
TO-236AB (Low)
1 2
MARKING
1
BAT54C
2 NC
3
1
3
BAT54S
BAT54 L4P BAT54C L43
BAT54A L42 BAT54S L44
1
2
Schottky Barrier Diode
Sourced from Process KA
Absolute Maximum Ratings* TA = 25
Sym Parameter Value Units
T
stg
T
J
W
iv
I
F
i
f
i
F(surge)
P
D
Storage Temperature -55 to +150
Operating Junction Temperature +150 OC
Working Inverse Voltage 25 V
DC Forward Current (IF) 200 mA
Recurrent Peak Forward Current (IFRM) 300 mA
Peak Forward Surge Current (IFSM) Pulse Width = 1.0 Second 600 mA
Total Power Dissipation at 25OC 230 mW
Theta (R
th j-a) (Note 1) 430
O
C unless otherwise noted
O
O
C
K/W
2
21
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
NOTES:
1) From junction to ambient mounted on a ceramic substrate of 10 mm x 8 mm x 0.6 mm
Electrical Characteristics TA = 25
O
C unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
B
I
V
Breakdown Voltage 30 V IR= 10 uA
V
Reverse Leakage 2.0 uA VR= 25 V
R
Forward Voltage 240 mV IF= 100 uA
F
320 mV IF= 1.0 mA
400 mV IF= 10 mA
500 mV IF= 30 mA
1.0 V IF= 100 mA
C
Capacitance 10 pF VR= 1.0 V
T
f = 1.0 MHz
T
Reverse Recovery Time 5.0 ns IF= IR = 10 mA
RR
IRR= 1.0 mA
RL = 100 Ohms
© 1997 Fairchild Semiconductor Corporation
Page 2
BAT54
)
)
0.001
0.0001
0.00001
F
I - FORWARD CURRENT (A)
0.000001
Forward Voltage
vs. Temper ature
0.2
0.1
0.01
75 C
100 C
25 C
o
o
-25 C
o
o
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
V - FORWARD VOLTAGE (V
vs. Reverse Bias Voltage
16
14
12
10
8
6
CAPACITANCE (pF)
4
2
012345678910
1
0.1
0.01
0.001
0.0001
0.00001
R
I - REVERSE LEAKAGE CURRENT (mA)
Capacitance
V - REVERSE BIAS VOLTAGE (V)
R
Reverse Leakage Current
vs. Temperature
o
125 C
o
100 C
o
75 C
o
25 C
0 5 10 15 20 25 30
V - REVERSE VOLTAGE (V
Page 3
SOT-23 Tape and Reel Data and Package Dimensions
SOT-23 Packaging
Config u ration: Figur e 1.0
SOT-23 Packaging Information
Packaging Option
Packaging type
Qty per Reel/Tube/Bag
Reel Size
Box Dimension (mm)
Max qty per B o x
Weight per unit (gm)
Weight per Reel (kg)
Note/Comments
Customized Label
Stan dard
(no flow code)
3,000 10,000
7" Dia
187x107x183 343x343x64
24,000 30,000
0.0082 0.0082
0.1175 0.4006
TNR
D87Z
TNR
13"
Antistatic Cover Tape
Human Readable
Label
Embossed
Carrier Tape
343mm x 342mm x 64mm
Intermediate box for L87Z Option
Packaging Description:
SOT-23
parts are shipped in tape. The carrier tape is
made from a dissipative (carbon fi lled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
3,000 units per 7" or 177cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13"
or 330cm diameter reel. This and some other opti ons are
described in the Packaging Information table.
These full reel s are individually labeled and placed inside
a standard intermediate made of recyclable corrugated
brown paper with a Fairchil d logo printing. One pizza box
contains eight reels maxi mum. And these intermediate
boxes are placed inside a labeled shipping box which
comes in different sizes depending on the number of parts
shipped.
3P 3P 3P 3P
SOT-23 Unit Orientation
Human Readable Label
Human Readable Label sample
SOT-23 Tape Leader and Trailer
Configuration: Figure 2.0
Carrier Tape
Cover Tape
Trailer Tape
300mm minimum or
75 empty pockets
Components
Human readable
Label
187mm x 107mm x 183mm
Intermediate Box for Standard Option
Leader Tape
500mm minimum or
125 empty pockets
September 1999, Rev. C
Page 4
SOT-23 Tape and Reel Data and Package Dimensions, continued
SOT-23 Embossed Carrier Tape
Confi guration: Figure 3.0
D0P0 P2
T
B0
Wc
D1
E1
W
F
E2
Tc
K0
P1
A0
User Direction of Feed
Dimensions are in millimeter
Pkg type
SOT-23
(8mm)
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
SOT-23 Reel Configuration: Figure 4.0
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
3.15
2.77
8.0
1.55
1.125
1.75
6.25
+/-0.10
+/-0.10
+/-0.3
+/-0.05
+/-0.125
+/-0.10
3.50
min
+/-0.05
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum
B0
20 deg maximum component rotation
Sketch A (Side or Front Sectional View)
Component Rotation
W1 Measured at Hub
A0
Sketch B (Top View)
Component Rotation
4.0
+/-0.1
Typical
component
cavity
center line
Typical
component
center line
Dim A
Max
4.0
+/-0.1
1.30
0.228
+/-0.013
5.2
+/-0.3
0.5mm
maximum
+/-0.10
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
0.06
+/-0.02
Dim A
max
Tape Size
8mm 7" Dia
8mm 13 " Dia
Reel
Option
Dim N
Diameter Option
7"
See detail AA
B Min
Dim C
13" Diameter Option
See detail AA
W2 max Measured at Hub
W3
Dim D
min
DETAIL AA
Dimensions are in inches and millimeters
Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
7.00
0.059
177.8
13.00
330
1.5
0.059
1.5
512 +0.020/-0.008
13 +0.5/-0.2
512 +0.020/-0.008
13 +0.5/-0.2
0.795
2.165550.331 +0.059/-0.000
20.2
0.795
4.00
20.2
100
8.4 +1.5/0
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.567
14.4
0.311 – 0.429
7.9 – 10.9
0.311 – 0.429
7.9 – 10.9
September 1999, Rev. C
Page 5
SOT-23 Tape and Reel Data and Package Dimensions, continued
SOT-23 (FS PKG Code 49)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gr am): 0.0082
September 1998, Rev. A1
Page 6
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
2
E
CMOS
TM
FACT™
FACT Quiet Series™
FAST
FASTr™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench
QFET™
QS™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. E
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