Datasheet BAT54ALT1 Datasheet (Motorola)

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Page 1

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SEMICONDUCTOR TECHNICAL DATA

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by BAT54ALT1/D

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These Schottky barrier diodes are designed for high speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand held and portable applications where space is limited.

• Extremely Fast Switching Speed

• Low Forward Voltage — 0.35 Volts (Typ) @ IF = 10 mAdc

(BR)R

F F F

F F

F FRM FSM

CATHODE

1 2

CATHODE

ANODE

MAXIMUM RATINGS

Reverse Voltage V Forward Power Dissipation

@ TA = 25°C

Derate above 25°C Forward Current (DC) I Junction Temperature T Storage Temperature Range T

(TJ = 125°C unless otherwise noted)

Rating Symbol Value Unit

stg

DEVICE MARKING

BAT54ALT1 = B6

ELECTRICAL CHARACTERISTICS (T

Characteristic Symbol Min Typ Max Unit

Reverse Breakdown Voltage (IR = 10 µA) V Total Capacitance (VR = 1.0 V, f = 1.0 MHz) C Reverse Leakage (VR = 25 V) I Forward Voltage (IF = 0.1 mAdc) V Forward Voltage (IF = 30 mAdc) V Forward Voltage (IF = 100 mAdc) V Reverse Recovery Time

(IF = IR = 10 mAdc, I Forward Voltage (IF = 1.0 mAdc) V Forward Voltage (IF = 10 mAdc) V Forward Current (DC) I Repetitive Peak Forward Current I Non–Repetitive Peak Forward Current (t < 1.0 s) I

Preferred devices are Motorola recommended choices for future use and best overall value.

Thermal Clad is a registered trademark of the Bergquist Company .

= 1.0 mAdc) Figure 1

R(REC)

= 25°C unless otherwise noted) (EACH DIODE)



Motorola Preferred Device

30 VOLTS

SCHOTTKY BARRIER

DETECTOR AND SWITCHING

CASE 318–08, STYLE 12

30 Volts

225

1.8 200 Max mA 125 Max °C

–55 to +150 °C

30 — — Volts — 7.6 10 pF — 0.5 2.0 µAdc — 0.22 0.24 Vdc — 0.41 0.5 Vdc — 0.52 1.0 Vdc — — 5.0 ns

— 0.29 0.32 Vdc — 0.35 0.40 Vdc — — 200 mAdc — — 300 mAdc — — 600 mAdc

DIODES

SOT–23 (TO–236AB)

mW/°C

REV 3

 Motorola, Inc. 1997

5–1Motorola Small–Signal Transistors, FETs and Diodes Device Data

Page 2

BAT54ALT1

820

Ω

+10 V

0.1 µF

2 k

100

0.1

10%

Ω

PULSE

GENERATOR

100

125°C

1.0

, FORWARD CURRENT (mA)

0.1

0.0 0.1

OUTPUT

150°C

DUT

50 Ω INPUT

SAMPLING

OSCILLOSCOPE

Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA.

Notes: 2. Input pulse is adjusted so I Notes: 3. tp » t

R(peak)

90%

INPUT SIGNAL

is equal to 10 mA.

OUTPUT PULSE

(IF = IR = 10 mA; measured

at i

R(REC)

Figure 1. Recovery Time Equivalent Test Circuit

1000

TA = 150°C

100

1.0

0.1

, REVERSE CURRENT (

85°C

25°C

0.2 0.3 0.4

VF, FORWARD VOLTAGE (VOLTS)

–40°C

–55°C

0.5

0.6

0.001

0.01

5101520

VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward V oltage Figure 3. Leakage Current

R(REC)

= 1 mA)

TA = 125°C

TA = 25°C

= 1 mA

TA = 85°C

5–2

, TOTAL CAP ACITANCE (pF)

2 0

51015 30

VR, REVERSE VOLTAGE (VOLTS)

2520

Figure 4. T otal Capacitance

Motorola Small–Signal Transistors, FETs and Diodes Device Data

Page 3

BAT54ALT1

INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection

0.037

0.95

0.035

0.9

SOT–23 POWER DISSIP ATION

The power dissipation of the SOT–23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T die, R ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT–23 package, PD can be calculated as follows:

The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 225 milliwatts.

The 556°C/W for the SOT–23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT–23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.

, the maximum rated junction temperature of the

J(max)

, the thermal resistance from the device junction to

θJA

PD =

150°C – 25°C

556°C/W

J(max)

θJA

– T

= 225 milliwatts

interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.

0.037

0.95

0.079

2.0

0.031

0.8

inches

SOT–23

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C.

• The soldering temperature and time shall not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient shall be 5°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied during

cooling.

* Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.

5–3Motorola Small–Signal Transistors, FETs and Diodes Device Data

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BAT54ALT1

P ACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

INCHES

DIMAMIN MAX MIN MAX

0.1102 0.1197 2.80 3.04

B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11 D 0.0150 0.0200 0.37 0.50 G 0.0701 0.0807 1.78 2.04 H 0.0005 0.0040 0.013 0.100

J 0.0034 0.0070 0.085 0.177

K 0.0180 0.0236 0.45 0.60

L 0.0350 0.0401 0.89 1.02 S 0.0830 0.0984 2.10 2.50 V 0.0177 0.0236 0.45 0.60

STYLE 12:

PIN 1. CATHODE

2. CATHODE

3. ANODE

MILLIMETERS

CASE 318–08

ISSUE AE

SOT–23 (TO–236AB)

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

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P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488

Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://motorola.com/sps

5–4

– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, T ai Po, N.T., Hong Kong. 852–26629298

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Motorola Small–Signal Transistors, FETs and Diodes Device Data

Mfax is a trademark of Motorola, Inc.

BAT54AL T1/D