
Product Catalog > Diodes > Switching Diodes >
Part Number BAS20
product family SMALL SIGNAL DIODES
package type SOT-23
VRM(PRV) 200V
Ifsm 0.5A
IF(AV) 200mA
@Vf 1.25V
@If 200mA
Trr 50nS
IR 100nA
@VR 200V
Package Qty Tape : 3K/Reel, 30k/Box, 120K/Ctn;
This product is listed under the following categories where you may find similar products:
Diodes
Switching Diodes

MCC
Micro Commercial Components
BAS19
TM
THRU
BAS21
Features
Ideally Suited for Automatic Insertion
150
o
C Junction Temperature
Fast Switching speed
Epitaxial Planar Die Construction
Mechanical Data
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Weight: 0.008 grams ( approx.)
Continuous
MCC Part
Number
Marking
Reverse
Voltage
V (V)
R
BAS19 JP 100 120
BAS20 JR 150 200
BAS21 JS 200 250
Maximum Ratings @ 25oC Unless Otherwise Specified
Parameter Symbol Value Unit
Non-re
etitive Peak
Forward Surge Current @ t=1s
Average Rectified Forward Current
Forward DC Current at T
Repetitive Peak Forward Current
Power Dissipation up to T
Thermal Resistance Junction to
amb
amb
t=1us
=25oC
=25oC
I
FSM
I
F(AV
I
FRM
P
R
Ambient
T
Operating & Storage Temperature
,T
Repetitive
I
F
tot
q
JA
-65~150
STG
Peak
Reverse
Voltage
V (V)
RRM
2.5
0.5
(1)
200
(2)
200
625 mA
250 mW
430
A
mA
mA
o
C/W
o
C
Small
Signal Diodes
250mW
SOT-23
.079
2.000
Top View
1
mm
A
D
B
C
F
E
G
K
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .110 .120 2.80 3.04
B .083 .098 2.10 2.64
C .047 .055 1.20 1.40
D .035 .041 .89 1.03
E .070 .081 1.78 2.05
F .018 .024 .45 .60
G .0005 .0039 .013 .100
H .035 .044 .89 1.12
J .003 .007 .085 .180
K .015 .020 .37 .51
Suggested Solder
.035
.900
H
DIMENSIONS
Pad Layout
.800
3
2
Notes: (1) Measured under pulse conditions;
Pulse time = t
(2) Device on fiberglass substrate,
See layout on next page
<= 0.3ms
p
1 of 3
.
.950
7
.037
.950

BAS19 thru BAS21
MCC
Electrical Characteristics (T
= 25°C unless otherwise noted)
J
Parameter Symbol Test Condition Min Typ Max Unit
Forward Voltage V
Leakage Current I
Dynamic Forward Resistance r
Capacitance C
Reverse Recovery Time
(1)Device on fiberglass substrate, see layout (SOT-23).
(see figures) t
F
R
f
tot
rr
IF= 100mA — — 1.0 V
IF= 200mA — — 1.25 V
VR= V
VR= V
Rmax
; Tj= 150°C — — 100 µA
Rmax
— — 100 nA
IF= 10mA — 5 — Ω
VR= 0
f = 1MHz
IF= 30mA, I
R =
30mA
Irr= 3mA, RL= 100Ω
—— 5pF
— — 50 ns
Test Circuit and Waveforms(BAS19, BAS20, BAS21)
Micro Commercial Components
TM
Ω
Test circuit
Input Signal - total pulse duration tp(tot) = 2µs
- duty factor δ = 0.0025
- rise time of reverse pulse t
= 0.6ns
r
- reverse pulse duration tp= 100ns
Oscilloscope - rise time t
= 0.35ns
r
- cicuit capitance* C < 1pF
*C = oscilloscope input capactitance + parasitic capacitance
Layout for R
ΘJA
test
Thickness: Fiberglass 0.059 in. (1.5 mm)
Copper leads 0.012 in. (0.3 mm)
0.59 (15)
0.03 (0.8 )
0.47 (12)
0.30 (7.5 )
0.12 (3)
.04 (1)
.08 (2)
.04 (1)
.08 (2)
Input signal
Waveforms; IR = 3 mA
Output signal
0.2 (5)
2 of 3
0.06 (1.5)
Dimensions in inches (millimeters)
0.20 (5.1)

MCC
Micro Commercial Components
Ordering Information
Device Packing
(Part Number)-TP Tape&Reel;3Kpcs/Reel
TM
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