Datasheet BAS16TT1 Datasheet (ON Semiconductor)

BAS16TT1

Preferred Device

Advance Information

Silicon Switching Diode

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MAXIMUM RATINGS (T

Rating Symbol Max Unit

Continuous Reverse Voltage V
Recurrent Peak Forward Current I
Peak Forward Surge Current

Pulse Width = 10 ms

= 25°C)

A

R

F

I

FM(surge)

75 V
200 mA
500 mA

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Power Dissipation,

TA = 25°C

Operating and Storage Junction

T emperature Range

Thermal Resistance,

Junction to Ambient

(1) Device mounted on FR–4 glass epoxy printed circuit board using the

minimum recommended footpad.

(1)

P

TJ, T

R

D

stg

θ

JA

150 mW

–55 to

+150

833 °C/W

°C

3

CATHODE

3

1

CASE 463

SOT–416/SC–75

STYLE 2

DEVICE MARKING

A6

1

ANODE

2

This document contains information on a new product. Specifications and information
herein are subject to change without notice.

 Semiconductor Components Industries, LLC, 2000

March, 2000 – Rev . 0

1 Publication Order Number:

ORDERING INFORMATION

Device Package Shipping

BAS16TT1 SOT–416

Preferred devices are recommended choices for future use
and best overall value.

3000 / Tape & Reel

BAS16TT1/D

BAS16TT1

ELECTRICAL CHARACTERISTICS (T

Characteristic Symbol Min Max Unit

Forward Voltage

(I

= 1.0 mA)

F

(I

= 10 mA)

F

(I

= 50 mA)

F

(I

= 150 mA)

F

Reverse Current

= 75 V)

(V

R

(V

= 75 V, TJ = 150°C)

R

(V

= 25 V, TJ = 150°C)

R

Capacitance

(V

= 0, f = 1.0 MHz)

R

Reverse Recovery Time

(I

= IR = 10 mA, RL = 50 Ω) (Figure 1)

F

Stored Charge

(I

= 10 mA to VR = 6.0 V, RL = 500 Ω) (Figure 2)

F

Forward Recovery Voltage

(I

= 10 mA, tr = 20 ns) (Figure 3)

F

= 25°C unless otherwise noted)

A

V

F

I

R

C

D

t

rr

—
—
—
—

—
—
—

715

866
1000
1250

1.0
50
30

— 2.0 pF

— 6.0 ns

mV

QS — 45 PC

V

FR

— 1.75 V

µA

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2

BAS16TT1

1

ns MAX

500 Ω

10%

t

t

t

if

rr

DUTY CYCLE = 2%

90%

V

F

I

rr

100 ns

Figure 1. Reverse Recovery Time Equivalent Test Circuit

DUT BAW62

500 Ω

D1 243 pF 100 KΩ

10%

20 ns MAX

V

C

V

CM

t

Qa

VCM+

C

DUT

50 Ω

OSCILLOSCOPE
R ≥ 10 MΩ
C ≤ 7 pF

DUTY CYCLE = 2%

90%

V

f

t

400 ns

Figure 2. Recovery Charge Equivalent T est Circuit

120 ns

V

90%

10%

t

2 ns MAX

V

1 KΩ 450 Ω

V

fr

50 ΩDUT

DUTY CYCLE = 2%

Figure 3. Forward Recovery V oltage Equivalent Test Circuit

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3

BAS16TT1

100

10

I

FO

WA

D

CU

ENT

A)

TA = 150°C

(m

10

RR

R

1.0

R
,

F

0.1

0.2 0.4

TA = 125°C

TA = 85°C

TA = 55°C

TA = 25°C

, REVERSE VOLTAGE (VOL TS)

V

R

TA = 85°C

TA = –40°C

0.6 0.8 1.0

, FORWARD VOLTAGE (VOLTS)

V

F

TA = 25°C

1.2

, REVERSE CURRENT (µA)

R

I

0.001

1.0

0.1

0.01

0

10 20 30 40

Figure 4. Forward Voltage Figure 5. Leakage Current

0.68

0.64

0.60

50

, DIODE CAPACITANCE (pF)

D

C

0.56

0.52
0

2468

V

, REVERSE VOLTAGE (VOL TS)

R

Figure 6. Capacitance

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4

BAS16TT1

INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection

0.5 min. (3x)

TYPICAL
SOLDERING PATTERN

Unit: mm

0.5 min. (3x)

SOT–416/SC–75 POWER DISSIPATION

The power dissipation of the SOT–416/SC–75 is a
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by T
junction temperature of the die, R

, the maximum rated

J(max)

, the thermal

JA

θ

resistance from the device junction to ambient; and the
operating temperature, TA. Using the values provided on
the data sheet, PD can be calculated as follows.

PD =

J(max)

A

R

θ

JA

T

– T

The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values

interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.

0.5

1

1.4

into the equation for an ambient temperature T

of 25°C,

A

one can calculate the power dissipation of the device which
in this case is 150 milliwatts.

PD =

150°C – 25°C

625°C/W

= 150 milliwatts

The 625°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 150 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, a higher power dissipation can be
achieved using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.

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• The soldering temperature and time should not exceed
260°C for more than 10 seconds.

• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.

• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied
during cooling

* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.

5

BAS16TT1

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.

The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.

The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.

200°C

150°C

100°C

50°C

STEP 1

PREHEAT

ZONE 1
“RAMP”

DESIRED CURVE FOR HIGH

TIME (3 TO 7 MINUTES TOTAL) T

STEP 2

VENT

“SOAK”

MASS ASSEMBLIES

ZONES 2 & 5

150°C

100°C

DESIRED CURVE FOR LOW

STEP 3

HEATING

“RAMP”

160°C

MASS ASSEMBLIES

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

140°C

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

170°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

Figure 7. T ypical Solder Heating Profile

STEP 6

VENT

MAX

STEP 7

COOLING

205° TO 219°C

PEAK AT

SOLDER JOINT

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6

S

D

3 PL

0.20 (0.008) B

M

J

–A–

3

BAS16TT1

P ACKAGE DIMENSIONS

SC–75 (SC–90, SOT–416)

CASE 463–01

ISSUE B

2

G

–B–

1

0.20 (0.008) A

K

C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

DIM MIN MAX MIN MAX

A 0.70 0.80 0.028 0.031
B 1.40 1.80 0.055 0.071
C 0.60 0.90 0.024 0.035
D 0.15 0.30 0.006 0.012
G 1.00 BSC 0.039 BSC
H ––– 0.10 ––– 0.004

J 0.10 0.25 0.004 0.010
K 1.45 1.75 0.057 0.069
L 0.10 0.20 0.004 0.008
S 0.50 BSC 0.020 BSC

INCHESMILLIMETERS

L

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

H

STYLE 2:

PIN 1. ANODE

2. N/C

3. CATHODE

STYLE 3:

PIN 1. ANODE

2. ANODE

3. CATHODE

STYLE 4:

PIN 1. CATHODE

2. CATHODE

3. ANODE

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7

BAS16TT1

Thermal Clad is a trademark of the Bergquist Company .

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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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BAS16TT1/D