Datasheet BAS116H.115 Specification

Page 1
Important notice
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Page 2
SOD123F
21
sym001
12
BAS116H
Low leakage switching diode
Rev. 3 — 31 May 2011 Product data sheet

1. Product profile

1.1 General description

Low leakage switching diode, encapsulated in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

Small and flat lead SMD plastic packageLow leakage currentExcellent coplanarity and improved thermal behaviorAEC-Q101 qualified

1.3 Applications

General-purpose switching

1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
I
F
I
R
V
R
t
rr
[1] Pulse test: tp 300 s; 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] When switched from I

2. Pinning information

Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode 2 anode
forward current
[1][2]
--215mA reverse current VR= 75 V - 0.003 5.0 nA reverse voltage - - 75 V reverse recovery time
= 10 mA to IR=10mA; RL= 100 ; measured at IR=1mA.
F
[1]
[3]
-0.83.0s
[1] The marking bar indicates the cathode.
Page 3
NXP Semiconductors

3. Ordering information

Table 3. Ordering information
Type number Package
BAS116H - plastic surface-mounted package; 2 leads SOD123F

4. Marking

Table 4. Marking codes
Type number Marking code
BAS116H B1

5. Limiting values

Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
RRM
V
R
I
F
I
FRM
I
FSM
P
tot
BAS116H
Low leakage switching diode
Name Description Version
repetitive peak reverse voltage
reverse voltage - 75 V forward current repetitive peak forward
current non-repetitive peak forward
current
total power dissipation T
square wave tp=1s-4A
=1ms - 1 A
t
p
=1s - 0.5 A
t
p
25 C
amb
-85V
[1][2]
-215mA
-500mA
[3]
[1][4]
-375mW
[5]
T
j
T
amb
T
stg
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Pulse test: t
=25C prior to surge.
[3] T
j
[4] Reflow soldering is the only recommended soldering method. [5] Soldering point of cathode tab.
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 2 of 10
junction temperature - 150 C ambient temperature 65 +150 C storage temperature 65 +150 C
300 s; 0.02.
p
Page 4
NXP Semiconductors

6. Thermal characteristics

Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from junction to ambient
R
th(j-sp)
thermal resistance from junction to solder point
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point of cathode tab.

7. Characteristics

Table 7. Characteristics
=25C unless otherwise specified.
T
amb
Symbol Parameter Conditions Min Typ Max Unit
V
F
I
R
C
d
t
rr
[1] Pulse test: tp 300 s; 0.02. [2] When switched from I
forward voltage
reverse current VR= 75 V - 0.003 5.0 nA
diode capacitance VR=0V; f=1MHz -2-pF reverse recovery time
Low leakage switching diode
in free air
IF= 1 mA - - 0.90 V
=10mA - - 1.00 V
I
F
=50mA - - 1.10 V
I
F
= 150 mA - - 1.25 V
I
F
=75V; Tj= 150 C- 3 80.0nA
V
R
= 10 mA to IR=10mA; RL= 100 ; measured at IR=1mA.
F
[1][2]
--330K/W
[3]
--70K/W
[1]
[2]
-0.83.0s
BAS116H
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 3 of 10
Page 5
NXP Semiconductors
mlb752
300
0
100
200
I
F
(mA)
0 1.60.8 1.20.4
V
F
(V)
(1) (2) (3)
mbg704
10
1
10
2
I
FSM
(A)
10
1
tp (μs)
110
4
10
3
10 10
2
10
2
150 200
500
mlb754
100
10
1
10
1
10
2
10
3
I
R
(nA)
T
j
(°C)
(1)
(2)
mbg526
01020155
V
R
(V)
2
0
1
C
d
(pF)
BAS116H
Low leakage switching diode
(1) T (2) T (3) T
= 150 C; typical values
amb
=25C; typical values
amb
=25C; maximum values
amb
Fig 1. Forward current as a function of forward
voltage
VR=75V
Fig 2. Non-repetitive peak forward current as a
Based on square wave currents T
=25C; prior to surge
j
function of pulse duration; maximum values
T
=25C; f = 1 MHz
amb
(1) Maximum values (2) Typical values
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 4 of 10
temperature
Fig 3. Reverse current as a function of junction
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
Page 6
NXP Semiconductors
t
rr
(1)
+ I
F
t
output signal
t
r
t
p
t
10 %
90 %
V
R
input signal
V = V
R + IF × RS
RS = 50
Ω
I
F
D.U.T.
R
i
= 50
Ω
SAMPLING
OSCILLOSCOPE
mga881
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2

8. Test information

=1mA
(1) I
R
Fig 5. Reverse recovery time test circuit and waveforms

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
BAS116H
Low leakage switching diode

9. Package outline

Fig 6. Package outline SOD123F

10. Packing information

Table 8. Packing methods
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 5 of 10
The -xxx numbers are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
BAS1 16H SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
[1] For further information and the availability of packing methods, see Section 14.
Page 7
NXP Semiconductors
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD123F
sod123f_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
2.9
2.8
4.4
1.62.1
1.2
(2×)
1.1
(2×)
1.1
(2×)
1.2
(2×)
Dimensions in mm

11. Soldering

BAS116H
Low leakage switching diode
Reflow soldering is the only recommended soldering method.
Fig 7. Reflow soldering footprint SOD123F
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 6 of 10
Page 8
NXP Semiconductors
Low leakage switching diode
BAS116H

12. Revision history

Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAS1 16H v.3 20110531 Product data sheet - BAS1 16H v.2 Modifications:
BAS1 16Hv.2 20091214 Product data sheet - BAS116H v.1 BAS1 16Hv.1 20050411 Product data sheet - -
Section 1 “Product profile”: updated.
Table 5 and 6: updated.
Table 7: V
values changed from mV to V.
F
Figure 2: updated.
Section 8.1 “Quality information”: added.
Figure 7: updated.
Section 13 “Legal information”: updated.
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 7 of 10
Page 9
NXP Semiconductors
BAS116H
Low leakage switching diode

13. Legal information

13.1 Data sheet status

Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have changed si nce this docum ent was pub lished and may dif fer in case of multiple devices. The latest product statu s
information is available on the Internet at URL http://www.nxp.com.
[1][2]
Product status
[3]
Definition

13.2 Definitions

Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
In no event shall NXP Semiconductors be lia ble for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonabl y be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is ope n for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
, unless otherwise
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 8 of 10
Page 10
NXP Semiconductors
BAS116H
Low leakage switching diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BAS116H All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 31 May 2011 9 of 10
Page 11
NXP Semiconductors

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Packing information . . . . . . . . . . . . . . . . . . . . . 5
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
BAS116H
Low leakage switching diode
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 May 2011
Document identifier: BAS116H
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