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Page 2
DATA SH EET
ook, halfpage
DISCRETE SEMICONDUCTORS
M3D088
BAS116
Low-leakage diode
Product data sheet
Supersedes data of 1999 May 26
2003 Dec 12
Page 3
NXP SemiconductorsProduct data sheet
Low-leakage diodeBAS116
FEATURES
• Plastic SMD package
• Low leakage current: typ. 3 pA
• Switching time: typ. 0.8 µs
• Continuous reverse voltage: max. 75 V
• Repetitive peak reverse voltage: max. 85 V
• Repetitive peak forward current: max. 500 mA.
APPLICATION
• Low leakage current applications in surface mounted
circuits.
DESCRIPTION
Epitaxial medium-speed switching diode with a low
leakage current in a small SOT23 plastic SMD packa ge .
Based on square wave currents; Tj = 25 °C prior to surge.
10
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
MBG704
2
10
3
10
tp (µs)
4
10
2003 Dec 124
Page 6
NXP SemiconductorsProduct data sheet
Low-leakage diodeBAS116
mlb754
I
(nA)
2
10
R
10
(1)
1
−1
10
−2
10
−3
10
(2)
500
100
150200
(°C)
T
j
(1) Maximum values.
(2) Typical values.
VR = 75 V.
Fig.5Reverse current as a function of junction
temperature.
MBG526
C
(pF)
2
d
handbook, halfpage
1
0
01020155
VR (V)
f = 1 MHz; Tj = 25 °C.
Fig.6Diode capacitance as a function of reverse
voltage; typical values.
handbook, full pagewidth
R = 50
Ω
S
V = V I x R
RF S
I
F
D.U.T.
SAMPLING
OSCILLOSCOPE
Ω
R = 50
i
MGA881
t
r
10%
V
R
90%
input signal
t
p
t
I
F
t
rr
t
(1)
output signal
(1) IR = 1 mA.
Fig.7 Reverse recovery time test circuit and waveforms.
2003 Dec 125
Page 7
NXP SemiconductorsProduct data sheet
3
Low-leakage diodeBAS116
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leadsSOT2
D
3
A
A
1
12
e
1
b
p
e
w
M
B
E
H
E
detail X
AB
Q
L
p
X
v
M
A
c
012 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
1.1
mm
0.9
OUTLINE
VERSION
SOT23TO-236AB
max.
0.1
b
cD
p
0.48
0.15
0.38
0.09
IEC JEDEC JEITA
3.0
2.8
E
1.4
1.2
REFERENCES
1.9
e
e
0.95
H
L
Qwv
1
2.5
2.1
p
E
0.55
0.45
0.15
0.45
0.2
0.1
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
2003 Dec 126
Page 8
NXP SemiconductorsProduct data sheet
Low-leakage diodeBAS116
DATA SHEET STATUS
DOCUMENT
STATUS
Objective data sheetDevelopmentThis document contains data from the objective specification for product
Preliminary data sheetQualificationThis document contains data from the preliminary specification.
Product data sheetProductionThis document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this do cument was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be su itable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveya nce or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
the device. Limiting values are stress ratings only an d
operation of the device at these or any other conditions
2003 Dec 127
60134) may cause permanent damage to
Page 9
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
The information presented in this documen t d oes not form part of any quotation or contract, is believed t o be a ccur ate a nd reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industri al or intellectual property rights.
Printed in The Netherlands R76/04/pp8 Date of release: 2003 Dec 12 Document order number: 9397 750 12391
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