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BAR42FILM
®
SMALL SIGNAL SCHOTTKY DIODE
Table 1: Main Product Characteristics
I
F(AV)
V
RRM
T
j
(max) 0.33 and 0.40 V
V
F
FEATURES AND BENEFITS
■ Very small conduction losses
■ Negligible switching losses
■ Low forward voltage drop
■ Surface mount device
DESCRIPTION
Genral purpose metal to silicon diodes featuring
very low turn-on voltage and fast switching.
0.1 A
30 V
150°C
BAR43FILM
K
A
BAR42FILM
BAR43FILM
K
A1
BAR43CFILM
Table 2: Order Codes
Part Number Marking
BAR42FILM D94
BAR43FILM D95
BAR43AFILM DB1
BAR43CFILM DB2
BAR43SFILM DA5
A
Nc
K
A1
A2
K
A2
SOT23-3L
A
BAR43AFILM
A1
K2
BAR43ASFILM
K1
A
K1
K2
A2
K2
A2
A1
K1
K2
K1
Table 3: Absolute Ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(AV)
I
FSM
P
T
T
T
Note 1: for double diodes, P
dPtot
------------- --
* : thermal runaway condition for a diode on its own heatsink
dTj
April 2005
Repetitive peak reverse voltage 30 V
Continuous forward current 0.1 A
Surge non repetitive forward current tp = 10ms sinusoidal 0.75 A
Power dissipation (note 1) T
tot
Maximum storage temperature range -65 to + 150 °C
stg
Maximum operating junction temperature * 150 °C
j
Maximum temperature for soldering during 10s 260 °C
L
is the total dissipation of both diodes.
tot
1
--------------- ----------->
Rth j a
–()
REV. 3
= 25°C 250 mW
amb
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Table 4: Thermal Resistance
Symbol Parameter Value Unit
R
th(j-a)
(*) Mounted on epoxy board with recommended pad layout.
Junction to ambient (*) 500 °C/W
Table 5: Static Electrical Characteristics
Symbol Parameter Tests conditions Min. Typ Max. Unit
V
I
R
V
F
Pulse test: * tp = 5 ms, δ < 2%
Breakdown voltage Tj = 25°C IR = 100µA 30 V
BR
T
= 25°C
*
Reverse leakage current
**
Forward voltage drop
** tp = 380 µs, δ < 2%
j
T
= 100°C
j
Tj = 25°C
BAR42
BAR43
ALL
= V
V
R
I
= 10mA
F
= 50mA
I
F
I
= 2mA
F
I
= 15mA
F
I
= 100mA
F
RRM
0.35 0.40
0.50 0.65
0.26 0.33
500 nA
100
0.45
1
Table 6: Dynamic Characteristics (Tj = 25°C)
Symbol Parameter Tests conditions Min. Typ. Max. Unit
µA
V
= 25°C VR = 1V F = 1 MHz
C Junction capacitance
t
Reverse recovery time
rr
η Detection efficiency
T
j
= 10 mA IR = 10 mA
I
F
T
= 25°C Irr = 1 mA RL = 100 Ω
j
C
= 300 pF F = 45 MHz
L
T
= 25°C Vi = 2 V RL = 50 Ω
j
Figure 1: Forward voltage drop versus forward
current (typical values, low level)
I (A)
FM
2.00E-2
1.80E-2
1.60E-2
1.40E-2
1.20E-2
1.00E-2
8.00E-3
6.00E-3
4.00E-3
2.00E-3
0.00E+0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
T =50°C
j
T =100°C
j
T =25°C
V (V)
FM
j
7pF
5ns
80 %
Figure 2: Forward voltage drop versus forward
current (typical values, high level)
I (A)
FM
5E-1
1E-1
T =100°C
j
T =50°C
1E-2
1E-3
j
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
T =25°C
j
V (V)
FM
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BAR42FILM / BAR43FILM
Figure 3: Reverse leakage current versus
reverse voltage applied (typical values)
I (µA)
R
1E+2
T =100°C
j
1E+1
1E+0
1E-1
1E-2
0 5 10 15 20 25 30
T =50°C
j
T =25°C
j
V (V)
R
Figure 5: Junction capacitance versus reverse
voltage applied (typical values)
C(pF)
10
5
F=1MHz
T =25°C
j
Figure 4: Reverse leakage current versus
junction temperature
I (µA)
R
1E+4
V =30V
1E+3
1E+2
1E+1
1E+0
1E-1
1E-2
R
V (V)
R
0 25 50 75 100 125 150
Figure 6: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy FR4 with recommended pad
layout, e(Cu)=35µm)
Z/R
th(j-a) th(j-a)
1.00
δ = 0.5
δ = 0.2
δ = 0.1
0.10
2
V (V)
1
12 5102030
R
Figure 7: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm)
R (°C/W)
th(j-a)
350
P=0.25W
300
250
200
150
0 5 10 15 20 25 30 35 40 45 50
S(CU)(mm²)
Single pulse
0.01
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2
t (s)
p
δ
=tp/T
T
tp
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Figure 8: SOT23-3L Package Mechanical Data
A
E
e
B
L
H
e1
S
A1
c
D
Figure 9: Foot Print Dimensions (in millimeters)
0.95 0.61
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A 0.89 1.4 0.035 0.055
A1 0 0.1 0 0.004
B 0.3 0.51 0.012 0.02
c 0.085 0.18 0.003 0.007
D 2.75 3.04 0.108 0.12
e 0.85 1.05 0.033 0.041
e1 1.7 2.1 0.067 0.083
E 1.2 1.6 0.047 0.063
H 2.1 2.75 0.083 0.108
L 0.6 typ. 0.024 typ.
S 0.35 0.65 0.014 0.026
1.26
0.73
3.25
Table 7: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
BAR42FILM D94
BAR43FILM D95
BAR43AFILM DB1
SOT23-3L 0.01 g 3000 Tape & reel
BAR43CFILM DB2
BAR43SFILM DA5
■ Epoxy meets UL94, V0
Table 8: Revision History
Date Revision Description of Changes
Aug-2001 2B Last update.
16-Apr-2005 3 Layout update. No content change.
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by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
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