MOQ = Minimum Order Quantity, consisting of 4 packing units.
For new design, please refer to the B3292xE/F data sheet.
Further intermediate capacitance values on request.
MOQ = Minimum Order Quantity, consisting of 4 packing units.
For new design, please refer to the B3292xE/F data sheet.
Further intermediate capacitance values on request.
Max. operating temperature T
Dissipation factor tan δ (in 10-3)
at 20 °C (upper limit values)
op,max
+110 °C
CR≤0.1 µF 0.1µF<CR≤2.2 µF CR>2.2 µF
at
1 kHz1.01.02.0
100 kHz5.0
Insulation resistance R
ins
or time constant τ = CR R
ins
CR≤0.33 µFCR>0.33 µF
100 000 MΩ 30 000 s
at 20 °C, rel. humidity ≤ 65%
(minimum as-delivered values)
DC test voltage2121 V, 2 s
Passive flammability category
B
to IEC 40 (CO) 752
Maximum continuous DC voltage V
Maximum continuous AC voltage V
630 V
DC
310 V (50/60 Hz)
AC
Rated AC voltage (IEC 60384-14)305 V (50/60 Hz)
Operating AC voltage Vopat high
temperature
TA≤ 110 °CVop= V
AC
TA≤ 110 °CVop= 1.25 VAC(1000 h)
Damp heat test56 days / 40 °C / 93% relative humidity
Limit values after damp heat testCapacitance change ∆C/C≤ 5%
Dissipation factor change ∆ tan δ ≤ 0.5 10-3(at 1 kHz)
Insulation resistance R
ins
or time constant τ = CR R
≤ 1.0 10-3(at 10 kHz)
≥ 50% of minimum
ins
as-delivered values
(continuously)
Important notes at the end of this document.
Page 6 of 18Please read Cautions and warnings and
Page 7
B32921C/D ... B32926C/D
X2 / 305 V AC
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/µs.
Note:
The values of dV/dt and k0provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt and k0values
Lead spacing10 mm15 mm22.5 mm27.5 mm37.5 mm
dV/dt in V/µs47534017012080
k0in V2/µs40850029240014620010320068800
Impedance Z versus frequency f
(typical values)
Important notes at the end of this document.
Page 7 of 18Please read Cautions and warnings and
Page 8
B32921C/D ... B32926C/D
X2 / 305 V AC
Mounting guidelines
1Soldering
1.1Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature235 ±5 °C
Soldering time2.0 ±0.5 s
Immersion depth2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspectionWetting of wire surface by new solder ≥90%, free-flowing solder
1.2Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
SeriesSolder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm)
260 ±5 °C10 ±1 s
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
(lead spacing ≤ 7.5 mm)
MKP
uncoated (lead spacing ≤ 10 mm)
MKT
insulated (B32559)
5 ±1 s
< 4 s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Important notes at the end of this document.
Page 8 of 18Please read Cautions and warnings and
Page 9
B32921C/D ... B32926C/D
X2 / 305 V AC
Immersion depth2.0 +0/0.5 mm from capacitor body or seating plane
ShieldHeat-absorbing board, (1.5 ±0.5) mm thick, between capacitor
body and liquid solder
Evaluation criteria:
Visual inspectionNo visible damage
∆C/C
0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
Important notes at the end of this document.
Page 9 of 18Please read Cautions and warnings and
Page 10
B32921C/D ... B32926C/D
X2 / 305 V AC
1.3General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature T
. Long exposure to temperatures above this type-related temperature limit
max
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 °C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 °C
MKT 160 °C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following measures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Important notes at the end of this document.
Page 10 of 18Please read Cautions and warnings and
Page 11
B32921C/D ... B32926C/D
X2 / 305 V AC
2Cleaning
To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below:
TypeEthanol,
isopropanol,
n-propanol
n-propanol-water
mixtures,
water with surface
Solvent from
table A (see
next page)
Solvent from
table B (see
next page)
tension-reducing
tensides (neutral)
MKT
SuitableUnsuitableIn part suitable Unsuitable
(uncoated)
MKT, MKP, MFP
SuitableSuitable
(coated/boxed)
Even when suitable solvents are used, a reversible change of the electrical characteristics may
occur in uncoated capacitors immediately after they are washed. Thus it is always recommended
to dry the components (e.g. 4 h at 70 °C) before they are subjected to subsequent electrical testing.
Table A
Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection)
Trifluoro-trichloroethane
Mixtures of trifluoro-trichloro-ethane with ethanol and
isopropanol
Manufacturers' designations for unsuitable cleaning solvents (selection)
Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons Manufacturer
Freon TMC; Freon TA; Freon TCDu Pont
Arklone EICI
Kaltron 113 MDD; Kaltron 113 MDKKali-Chemie
Flugene 113 CMRhone-Progil
Important notes at the end of this document.
Page 11 of 18Please read Cautions and warnings and
Page 12
B32921C/D ... B32926C/D
X2 / 305 V AC
3Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 °C.
Caution:
Consult us first if you wish to embed uncoated types!
Important notes at the end of this document.
Page 12 of 18Please read Cautions and warnings and
Page 13
B32921C/D ... B32926C/D
X2 / 305 V AC
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
TopicSafety informationReference chapter
"General technical
information"
Storage conditions Make sure that capacitors are stored within the
specified range of time, temperature and humidity
4.5
"Storage conditions"
conditions.
FlammabilityAvoid external energy, such as fire or electricity
(passive flammability), avoid overload of the
5.3
"Flammability"
capacitors (active flammability) and consider the
flammability of materials.
Resistance to
vibration
Do not exceed the tested ability to withstand
vibration. The capacitors are tested to
5.2
"Resistance to vibration"
IEC 60068-2-6.
EPCOS offers film capacitors specially designed
for operation under more severe vibration regimes
such as those found in automotive applications.
Consult our catalog "Film Capacitors for
Automotive Electronics".
Important notes at the end of this document.
Page 13 of 18Please read Cautions and warnings and
Page 14
B32921C/D ... B32926C/D
X2 / 305 V AC
Topic
Safety informationReference chapter
"Mounting guidelines"
SolderingDo not exceed the specified time or temperature
1 "Soldering"
limits during soldering.
CleaningUse only suitable solvents for cleaning capacitors. 2 "Cleaning"
Embedding of
capacitors in
finished assemblies
When embedding finished circuit assemblies in
plastic resins, chemical and thermal influences
must be taken into account.
3 "Embedding of
capacitors in finished
assemblies"
Caution: Consult us first, if you also wish to
embed other uncoated component types!
Important notes at the end of this document.
Page 14 of 18Please read Cautions and warnings and
Page 15
B32921C/D ... B32926C/D
X2 / 305 V AC
Symbols and terms
SymbolEnglishGerman
αHeat transfer coefficientWärmeübergangszahl
α
C
Temperature coefficient of capacitanceTemperaturkoeffizient der Kapazität
ACapacitor surface areaKondensatoroberfläche
β
C
Humidity coefficient of capacitanceFeuchtekoeffizient der Kapazität
CCapacitanceKapazität
C
∆V/∆tVoltage change per time intervalSpannungsänderung pro Zeitintervall
EActivation energy for diffusionAktivierungsenergie zur Diffusion
ESLSelf-inductanceEigeninduktivität
ESREquivalent series resistanceErsatz-Serienwiderstand
fFrequencyFrequenz
f
1
Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f
2
Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
f
r
F
D
Resonant frequencyResonanzfrequenz
Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
F
T
Derating factorDeratingfaktor
iCurrent (peak)Stromspitze
I
C
Category current (max. continuous
Kategoriestrom (max. Dauerstrom)
current)
Important notes at the end of this document.
Page 15 of 18Please read Cautions and warnings and
QHeat energyWärmeenergie
ρDensity of water vapor in airDichte von Wasserdampf in Luft
RUniversal molar constant for gasesAllg. Molarkonstante für Gas
ROhmic resistance of discharge circuitOhmscher Widerstand des
Entladekreises
R
i
R
ins
R
P
R
S
Internal resistanceInnenwiderstand
Insulation resistanceIsolationswiderstand
Parallel resistanceParallelwiderstand
Series resistanceSerienwiderstand
Sseverity (humidity test)Schärfegrad (Feuchtetest)
tTimeZeit
TTemperatureTemperatur
τTime constantZeitkonstante
tan δDissipation factorVerlustfaktor
tan δ
D
Dielectric component of dissipation
Dielektrischer Anteil des Verlustfaktors
factor
tan δ
tan δ
T
A
T
max
T
min
t
OL
T
op
T
R
T
ref
t
SL
V
AC
P
S
Parallel component of dissipation factor Parallelanteil des Verlfustfaktors
Series component of dissipation factorSerienanteil des Verlustfaktors
Ambient temperatureUmgebungstemperatur
Upper category temperatureObere Kategorietemperatur
Lower category temperatureUntere Kategorietemperatur
Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Operating temperatureBeriebstemperatur
Rated temperatureNenntemperatur
Reference temperatureReferenztemperatur
Reference service lifeReferenz-Lebensdauer
AC voltageWechselspannung
Important notes at the end of this document.
Page 16 of 18Please read Cautions and warnings and
Page 17
B32921C/D ... B32926C/D
X2 / 305 V AC
SymbolEnglishGerman
V
V
C
C,RMS
Category voltageKategoriespannung
Category AC voltage(Sinusförmige)
Kategorie-Wechselspannung
V
CD
V
ch
V
DC
V
FB
V
i
V
o
V
op
V
p
V
pp
V
R
R
V
RMS
Corona-discharge onset voltageTeilentlade-Einsatzspannung
Charging voltageLadespannung
DC voltageGleichspannung
Fly-back capacitor voltageSpannung (Flyback)
Input voltageEingangsspannung
Output voltageAusgangssspannung
Operating voltageBetriebsspannung
Peak pulse voltageImpuls-Spitzenspannung
Peak-to-peak voltage ImpedanceSpannungshub
Rated voltageNennspannung
Amplitude of rated AC voltageAmplitude der Nenn-Wechselspannung
(Sinusoidal) alternating voltage,
(Sinusförmige) Wechselspannung
root-mean-square value
V
SC
V
sn
S-correction voltageSpannung bei Anwendung "S-correction"
Snubber capacitor voltageSpannung bei Anwendung
"Beschaltung"
ZImpedanceScheinwiderstand
Lead spacingRastermaß
Important notes at the end of this document.
Page 17 of 18Please read Cautions and warnings and
Page 18
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as bindingstatements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association
(ZVEI).
MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 18 of 18
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