Datasheet ATMEGA128A-AU Specification

Features

• High-performance, Low-power Atmel

• Advanced RISC Architecture

– 133 Powerful Instructions – Most Single Clock Cycle Execution
– 32 x 8 General Purpose Working Registers + Peripheral Control Registers
– Fully Static Operation
– Up to 16MIPS Throughput at 16MHz
– On-chip 2-cycle Multiplier

• High Endurance Non-volatile Memory segments

– 128Kbytes of In-System Self-programmable Flash program memory
– 4Kbytes EEPROM
– 4Kbytes Internal SRAM
– Write/Erase cycles: 10,000 Flash/100,000 EEPROM
– Data retention: 20 years at 85°C/100 years at 25°C
– Optional Boot Code Section with Independent Lock Bits

In-System Programming by On-chip Boot Program

True Read-While-Write Operation
– Up to 64Kbytes Optional External Memory Space
– Programming Lock for Software Security
– SPI Interface for In-System Programming

• QTouch

®

library support

– Capacitive touch buttons, sliders and wheels
– QTouch and QMatrix acquisition
– Up to 64 sense channels

• JTAG (IEEE std. 1149.1 Compliant) Interface

– Boundary-scan Capabilities According to the JTAG Standard
– Extensive On-chip Debug Support
– Programming of Flash, EEPROM, Fuses and Lock Bits through the JTAG Interface

• Peripheral Features

– Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes
– Two Expanded 16-bit Timer/Counters with Separate Prescaler, Compare Mode and Capture

Mode
– Real Time Counter with Separate Oscillator
– Two 8-bit PWM Channels
– 6 PWM Channels with Programmable Resolution from 2 to 16 Bits
– Output Compare Modulator
– 8-channel, 10-bit ADC

8 Single-ended Channels
7 Differential Channels

2 Differential Channels with Programmable Gain at 1x, 10x, or 200x
– Byte-oriented Two-wire Serial Interface
– Dual Programmable Serial USARTs
– Master/Slave SPI Serial Interface
– Programmable Watchdog Timer with On-chip Oscillator
– On-chip Analog Comparator

• Special Microcontroller Features

– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated RC Oscillator
– External and Internal Interrupt Sources
– Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and

Extended Standby
– Software Selectable Clock Frequency
– ATmega103 Compatibility Mode Selected by a Fuse
– Global Pull-up Disable

• I/O and Packages

– 53 Programmable I/O Lines
– 64-lead TQFP and 64-pad QFN/MLF

• Operating Voltages

– 2.7 - 5.5V ATmega128L
– 4.5 - 5.5V ATmega128

• Speed Grades

– 0 - 8MHz ATmega128L
– 0 - 16MHz ATmega128

®

AVR®8-bit Microcontroller

(1)

8-bit Atmel
Microcontroller
with 128KBytes
In-System
Programmable
Flash

ATmega128
ATmega128L

Summary

Rev. 2467XS–AVR–06/11

Pin

1
2
3
4
5
6
7

8

9
10
11
12
13
14
15
16

48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33

PEN

RXD0/(PDI) PE0

(TXD0/PDO) PE1

(XCK0/AIN0) PE2
(OC3A/AIN1) PE3
(OC3B/INT4) PE4

(OC3C/INT5) PE5

(T3/INT6) PE6

(ICP3/INT7) PE7

(SS) PB0

(SCK) PB1
(MOSI) PB2
(MISO) PB3

(OC0) PB4

(OC1A) PB5
(OC1B) PB6

PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2(ALE)
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1(RD)
PG0(WR)

64636261605958

575655545352515049

171819202122232425262728293031

32

(OC2/OC1C) PB7

TOSC2/PG3

TOSC1/PG4

RESET

VCC

GND

XTAL2

XTAL1

(SCL/INT0) PD0

(SDA/INT1) PD1

(TXD1/INT3) PD3

(ICP1) PD4

(XCK1) PD5

(T1) PD6

(T2) PD7

AVCC

GND

AREF

PF0 (ADC0)

PF1 (ADC1)

PF2 (ADC2)

PF3 (ADC3)

PF4 (ADC4/TCK)

PF5 (ADC5/TMS)

PF6 (ADC6/TDO)

PF7 (ADC7/TDI)

GND

VCC

PA0 (AD0)

PA1 (AD1)

PA2 (AD2)

Configurations

Figure 1. Pinout ATmega128

ATmega128

Overview The Atmel

2467XS–AVR–06/11

Note: The Pinout figure applies to both TQFP and MLF packages. The bottom pad under the QFN/MLF

package should be soldered to ground.

®

enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the
ATmega128 achieves throughputs approaching 1MIPS per MHz allowing the system designer to
optimize power consumption versus processing speed.

AVR® ATmega128 is a low-power CMOS 8-bit microcontroller based on the AVR

2

Block Diagram

PROGRAM
COUNTER

INTERNAL

OSCILLATOR

WATCHDOG

TIMER

STACK

POINTER

PROGRAM

FLASH

MCU CONTROL

REGISTER

SRAM

GENERAL
PURPOSE

REGISTERS

INSTRUCTION

REGISTER

TIMER/

COUNTERS

INSTRUCTION

DECODER

DATA DIR.

REG. PORTB

DATA DIR.

REG. PORTE

DATA DIR.

REG. PORTA

DATA DIR.

REG. PORTD

DATA REGISTER

PORTB

DATA REGISTER

PORTE

DATA REGISTER

PORTA

DATA REGISTER

PORTD

TIMING AND

CONTROL

OSCILLATOR

OSCILLATOR

INTERRUPT

UNIT

EEPROM

SPI

USART0

STATUS

REGISTER

Z

Y

X

ALU

PORTB DRIVERS

PORTE DRIVERS

PORTA DRIVERS

PORTF DRIVERS

PORTD DRIVERS

PORTC DRIVERS

PB0 - PB7PE0 - PE7

PA0 - PA7PF0 - PF7

RESET

VCC

AGND

GND

AREF

XTAL1

XTAL2

CONTROL

LINES

+

-

ANALOG

COMPARATOR

PC0 - PC7

8-BIT DATA BUS

AVCC

USART1

CALIB. OSC

DATA DIR.

REG. PORTC

DATA REGISTER

PORTC

ON-CHIP DEBUG

JTAG TAP

PROGRAMMING

LOGIC

PEN

BOUNDARY-

SCAN

DATA DIR.

REG. PORTF

DATA REGISTER

PORTF

ADC

PD0 - PD7

DATA DIR.

REG. PORTG

DATA REG.

PORTG

PORTG DRIVERS

PG0 - PG4

TWO-WIRE SERIAL

INTERFACE

Figure 2. Block Diagram

ATmega128

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3

ATmega128

The Atmel® AVR® core combines a rich instruction set with 32 general purpose working regis­ters. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two
independent registers to be accessed in one single instruction executed in one clock cycle. The
resulting architecture is more code efficient while achieving throughputs up to ten times faster
than conventional CISC microcontrollers.

The ATmega128 provides the following features: 128Kbytes of In-System Programmable Flash
with Read-While-Write capabilities, 4Kbytes EEPROM, 4Kbytes SRAM, 53 general purpose I/O
lines, 32 general purpose working registers, Real Time Counter (RTC), four flexible Timer/Coun­ters with compare modes and PWM, 2 USARTs, a byte oriented Two-wire Serial Interface, an 8­channel, 10-bit ADC with optional differential input stage with programmable gain, programma­ble Watchdog Timer with Internal Oscillator, an SPI serial port, IEEE std. 1149.1 compliant
JTAG test interface, also used for accessing the On-chip Debug system and programming and
six software selectable power saving modes. The Idle mode stops the CPU while allowing the
SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down
mode saves the register contents but freezes the Oscillator, disabling all other chip functions
until the next interrupt or Hardware Reset. In Power-save mode, the asynchronous timer contin­ues to run, allowing the user to maintain a timer base while the rest of the device is sleeping.
The ADC Noise Reduction mode stops the CPU and all I/O modules except Asynchronous
Timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the
Crystal/Resonator Oscillator is running while the rest of the device is sleeping. This allows very
fast start-up combined with low power consumption. In Extended Standby mode, both the main
Oscillator and the Asynchronous Timer continue to run.

Atmel offers the QTouch
functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers
robust sensing and includes fully debounced reporting of touch keys and includes Adjacent Key
Suppression
QTouch Suite toolchain allows you to explore, develop and debug your own touch applications.

®

(AKS™) technology for unambiguous detection of key events. The easy-to-use

®

library for embedding capacitive touch buttons, sliders and wheels

ATmega103 and ATmega128 Compatibility

The device is manufactured using Atmel’s high-density nonvolatile memory technology. The On­chip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial
interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program
running on the AVR core. The boot program can use any interface to download the application
program in the application Flash memory. Software in the Boot Flash section will continue to run
while the Application Flash section is updated, providing true Read-While-Write operation. By
combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip,
the Atmel ATmega128 is a powerful microcontroller that provides a highly flexible and cost effec­tive solution to many embedded control applications.

The ATmega128 device is supported with a full suite of program and system development tools
including: C compilers, macro assemblers, program debugger/simulators, in-circuit emulators,
and evaluation kits.

The ATmega128 is a highly complex microcontroller where the number of I/O locations super­sedes the 64 I/O locations reserved in the AVR instruction set. To ensure backward compatibility
with the ATmega103, all I/O locations present in ATmega103 have the same location in
ATmega128. Most additional I/O locations are added in an Extended I/O space starting from $60
to $FF, (i.e., in the ATmega103 internal RAM space). These locations can be reached by using
LD/LDS/LDD and ST/STS/STD instructions only, not by using IN and OUT instructions. The relo­cation of the internal RAM space may still be a problem for ATmega103 users. Also, the
increased number of interrupt vectors might be a problem if the code uses absolute addresses.
To solve these problems, an ATmega103 compatibility mode can be selected by programming
the fuse M103C. In this mode, none of the functions in the Extended I/O space are in use, so the
internal RAM is located as in ATmega103. Also, the Extended Interrupt vectors are removed.

2467XS–AVR–06/11

4

ATmega128

The ATmega128 is 100% pin compatible with ATmega103, and can replace the ATmega103 on
current Printed Circuit Boards. The application note “Replacing ATmega103 by ATmega128”
describes what the user should be aware of replacing the ATmega103 by an ATmega128.

ATmega103 Compatibility Mode

By programming the M103C fuse, the Atmel
ATmega103 regards to RAM, I/O pins and interrupt vectors as described above. However, some
new features in ATmega128 are not available in this compatibility mode, these features are
listed below:

• One USART instead of two, Asynchronous mode only. Only the eight least significant bits of
the Baud Rate Register is available.

• One 16 bits Timer/Counter with two compare registers instead of two 16-bit Timer/Counters
with three compare registers.

• Two-wire serial interface is not supported.

• Port C is output only.

• Port G serves alternate functions only (not a general I/O port).

• Port F serves as digital input only in addition to analog input to the ADC.

• Boot Loader capabilities is not supported.

• It is not possible to adjust the frequency of the internal calibrated RC Oscillator.

• The External Memory Interface can not release any Address pins for general I/O, neither
configure different wait-states to different External Memory Address sections.

In addition, there are some other minor differences to make it more compatible to ATmega103:

• Only EXTRF and PORF exists in MCUCSR.

• Timed sequence not required for Watchdog Time-out change.

• External Interrupt pins 3 - 0 serve as level interrupt only.

• USART has no FIFO buffer, so data overrun comes earlier.

®

ATmega128 will be compatible with the

Unused I/O bits in ATmega103 should be written to 0 to ensure same operation in ATmega128.

Pin Descriptions

VCC Digital supply voltage.

GND Ground.

Port A (PA7..PA0) Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The

Port A output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port A pins are tri-stated when a reset condition becomes active,
even if the clock is not running.

Port A also serves the functions of various special features of the ATmega128 as listed on page

72.

Port B (PB7..PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The

Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,
even if the clock is not running.

Port B also serves the functions of various special features of the ATmega128 as listed on page

73.

2467XS–AVR–06/11

5

ATmega128

Port C (PC7..PC0) Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The

Port C output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port C pins are tri-stated when a reset condition becomes active,
even if the clock is not running.

Port C also serves the functions of special features of the Atmel

page 76. In ATmega103 compatibility mode, Port C is output only, and the port C pins are not tri-

stated when a reset condition becomes active.

Note: The ATmega128 is by default shipped in ATmega103 compatibility mode. Thus, if the parts are not

programmed before they are put on the PCB, PORTC will be output during first power up, and until
the ATmega103 compatibility mode is disabled.

Port D (PD7..PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The

Port D output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,
even if the clock is not running.

Port D also serves the functions of various special features of the ATmega128 as listed on page

77.

®

AVR®ATmega128 as listed on

Port E (PE7..PE0) Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The

Port E output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port E pins are tri-stated when a reset condition becomes active,
even if the clock is not running.

Port E also serves the functions of various special features of the ATmega128 as listed on page

80.

Port F (PF7..PF0) Port F serves as the analog inputs to the A/D Converter.

Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins
can provide internal pull-up resistors (selected for each bit). The Port F output buffers have sym­metrical drive characteristics with both high sink and source capability. As inputs, Port F pins
that are externally pulled low will source current if the pull-up resistors are activated. The Port F
pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the
JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will
be activated even if a Reset occurs.

The TDO pin is tri-stated unless TAP states that shift out data are entered.

Port F also serves the functions of the JTAG interface.

In ATmega103 compatibility mode, Port F is an input Port only.

Port G (PG4..PG0) Port G is a 5-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The

Port G output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port G pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port G pins are tri-stated when a reset condition becomes active,
even if the clock is not running.

2467XS–AVR–06/11

Port G also serves the functions of various special features.

The port G pins are tri-stated when a reset condition becomes active, even if the clock is not
running.

6

ATmega128

In ATmega103 compatibility mode, these pins only serves as strobes signals to the external
memory as well as input to the 32kHz Oscillator, and the pins are initialized to PG0 = 1, PG1 = 1,
and PG2 = 0 asynchronously when a reset condition becomes active, even if the clock is not
running. PG3 and PG4 are oscillator pins.

RESET

Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running. The minimum pulse length is given in Table 19 on page

50. Shorter pulses are not guaranteed to generate a reset.

XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.

XTAL2 Output from the inverting Oscillator amplifier.

AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally con-

nected to V

, even if the ADC is not used. If the ADC is used, it should be connected to V

CC

CC

through a low-pass filter.

AREF AREF is the analog reference pin for the A/D Converter.

PEN PEN is a programming enable pin for the SPI Serial Programming mode, and is internally pulled

high . By holding this pin low during a Power-on Reset, the device will enter the SPI Serial Pro­gramming mode. PEN

has no function during normal operation.

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7

ATmega128

Resources A comprehensive set of development tools, application notes, and datasheets are available for

download on http://www.atmel.com/avr.

Note: 1.

Data Retention Reliability Qualification results show that the projected data retention failure rate is much less

than 1 PPM over 20 years at 85°C or 100 years at 25°C

About Code Examples

This datasheet contains simple code examples that briefly show how to use various parts of the
device. These code examples assume that the part specific header file is included before compi­lation. Be aware that not all C compiler vendors include bit definitions in the header files and
interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation
for more details.

For I/O registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”
instructions must be replaced with instructions that allow access to extended I/O. Typically
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.

Capacitive touch sensing

The Atmel QTouch Library provides a simple to use solution to realize touch sensitive interfaces
on most Atmel AVR microcontrollers. The QTouch Library includes support for the QTouch and
QMatrix acquisition methods.

Touch sensing can be added to any application by linking the appropriate Atmel QTouch Library
for the AVR Microcontroller. This is done by using a simple set of APIs to define the touch chan­nels and sensors, and then calling the touch sensing API’s to retrieve the channel information
and determine the touch sensor states.

The QTouch Library is FREE and downloadable from the Atmel website at the following location:

www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the
Atmel QTouch Library User Guide - also available for download from the Atmel website.

2467XS–AVR–06/11

8

ATmega128

Instruction Set Summary

Mnemonics Operands Description Operation Flags #Clocks

ARITHMETIC AND LOGIC INSTRUCTIONS

ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1

ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1

ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2

SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1

SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1

SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1

SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1

SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2

AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1

ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1

OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1

ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1

EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1

COM Rd One’s Complement Rd ← $FF − Rd Z,C,N,V 1

NEG Rd Two’s Complement Rd ← $00 − Rd Z,C,N,V,H 1

SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1

CBR Rd,K Clear Bit(s) in Register Rd ← Rd • ($FF - K) Z,N,V 1

INC Rd Increment Rd ← Rd + 1 Z,N,V 1

DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1

TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1

CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1

SER Rd Set Register Rd ← $FF None 1

MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z,C 2

MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z,C 2

MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z,C 2
FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2
FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z,C 2
FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2

BRANCH INSTRUCTIONS

RJMP k Relative Jump PC ← PC + k + 1 None 2

IJMP Indirect Jump to (Z) PC ← Z None 2

JMP k Direct Jump PC ← kNone3

RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3

ICALL Indirect Call to (Z) PC ← ZNone3

CALL k Direct Subroutine Call PC ← kNone4

RET Subroutine Return PC ← STACK None 4

RETI Interrupt Return PC ← STACK I 4

CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1 / 2 / 3

CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1

CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1

CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1

SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1 / 2 / 3

SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1 / 2 / 3

SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1 / 2 / 3

SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1 / 2 / 3

BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1 / 2

BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1 / 2

BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1 / 2

BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1 / 2

BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1 / 2

BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1 / 2

BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1 / 2

BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1 / 2

BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1 / 2

BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1 / 2

BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1 / 2

BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1 / 2

BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1 / 2

BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1 / 2

BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1 / 2

BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1 / 2

BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1 / 2

BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1 / 2

2467XS–AVR–06/11

9

ATmega128

Instruction Set Summary (Continued)

Mnemonics Operands Description Operation Flags #Clocks

BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1 / 2

BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1 / 2

DATA TRANSFER INSTRUCTIONS

MOV Rd, Rr Move Between Registers Rd ← Rr None 1

MOVW Rd, Rr Copy Register Word

LDI Rd, K Load Immediate Rd ← KNone1

LD Rd, X Load Indirect Rd ← (X) None 2

LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2

LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2

LD Rd, Y Load Indirect Rd ← (Y) None 2

LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2

LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2

LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2

LD Rd, Z Load Indirect Rd ← (Z) None 2

LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2

LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2

LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2

LDS Rd, k Load Direct from SRAM Rd ← (k) None 2

ST X, Rr Store Indirect (X) ← Rr None 2

ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2

ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2

ST Y, Rr Store Indirect (Y) ← Rr None 2

ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2

ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2

STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2

ST Z, Rr Store Indirect (Z) ← Rr None 2

ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2

ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2

STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2

STS k, Rr Store Direct to SRAM (k) ← Rr None 2

LPM Load Program Memory R0 ← (Z) None 3

LPM Rd, Z Load Program Memory Rd ← (Z) None 3

LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3

ELPM Extended Load Program Memory R0 ← (RAMPZ:Z) None 3

ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3

ELPM Rd, Z+ Extended Load Program Memory and Post-Inc Rd ← (RAMPZ:Z), RAMPZ:Z ← RAMPZ:Z+1 None 3

SPM Store Program Memory (Z) ← R1:R0 None -

IN Rd, P In Port Rd ← PNone1

OUT P, Rr Out Port P ← Rr None 1

PUSH Rr Push Register on Stack STACK ← Rr None 2

POP Rd Pop Register from Stack Rd ← STACK None 2

BIT AND BIT-TEST INSTRUCTIONS

SBI P,b Set Bit in I/O Register I/O(P,b) ← 1None2

CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0None2

LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1

LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1

ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1

ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1

ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1

SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1

BSET s Flag Set SREG(s) ← 1 SREG(s) 1

BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1

BST Rr, b Bit Store from Register to T T

BLD Rd, b Bit load from T to Register Rd(b) ← TNone1

SEC Set Carry C ← 1C1

CLC Clear Carry C ← 0 C 1

SEN Set Negative Flag N ← 1N1

CLN Clear Negative Flag N ← 0 N 1

SEZ Set Zero Flag Z ← 1Z1

CLZ Clear Zero Flag Z ← 0 Z 1

SEI Global Interrupt Enable I ← 1I1

CLI Global Interrupt Disable I ← 0 I 1

SES Set Signed Test Flag S ← 1S1

CLS Clear Signed Test Flag S ← 0 S 1

Rd+1:Rd ← Rr+1:Rr

← Rr(b) T 1

None 1

2467XS–AVR–06/11

10

ATmega128

Instruction Set Summary (Continued)

Mnemonics Operands Description Operation Flags #Clocks

SEV Set Twos Complement Overflow. V ← 1V1

CLV Clear Twos Complement Overflow V ← 0 V 1

SET Set T in SREG T ← 1T1

CLT Clear T in SREG T ← 0 T 1

SEH Set Half Carry Flag in SREG H ← 1H1
CLH Clear Half Carry Flag in SREG H ← 0 H 1

MCU CONTROL INSTRUCTIONS

NOP No Operation None 1

SLEEP Sleep (see specific descr. for Sleep function) None 1

WDR Watchdog Reset (see specific descr. for WDR/timer) None 1
BREAK Break For On-chip Debug Only None N/A

2467XS–AVR–06/11

11

ATmega128

Ordering Information

Speed (MHz) Power Supply Ordering Code

ATmega128L-8AU

8 2.7 – 5.5V

ATmega128L-8AUR
ATmega128L-8MU
ATmega128L-8MUR

ATmega128-16AU

16 4.5 – 5.5V

ATmega128-16AUR
ATmega128-16MU
ATmega128-16MUR

ATmega128L–8AN

8 3.0 – 5.5V

ATmega128L–8ANR
ATmega128L–8MN
ATmega128L–8MNR

ATmega128–16AN

16 4.5 – 5.5V

ATmega128–16ANR
ATmega128–16MN
ATmega128–16MNR

(1)

(3)

(3)

(3)

(3)

(3)

(3)

(3)

(3)

Package

64A
64A
64M1
64M1

64A
64A
64M1
64M1

64A
64A
64M1
64M1

64A
64A
64M1
64M1

Notes: 1. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also

Halide free and fully Green.

2. The device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.

3. Tape and Reel

(2)

Operation Range

Industrial

o

C to 85oC)

(-40

Extended

(-40°C to 105°C)

Package Type

64A 64-lead, 14 x 14 x 1.0mm, Thin Profile Plastic Quad Flat Package (TQFP)

64M1 64-pad, 9 x 9 x 1.0mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)

2467XS–AVR–06/11

12

Packaging Information

2325 Orchard Parkway
San Jose, CA 95131

TITLE

DRAWING NO.

R

REV.

64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,

0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)

C

64A

2010-10-20

PIN 1 IDENTIFIER

0°~7°

PIN 1

L

C

A1

A2 A

D1

D

e

E1 E

B

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

Notes:

1.This package conforms to JEDEC reference MS-026, Variation AEB.

2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.

3. Lead coplanarity is 0.10 mm maximum.

A – – 1.20

A1 0.05 – 0.15

A2 0.95 1.00 1.05

D 15.75 16.00 16.25

D1 13.90 14.00 14.10 Note 2

E 15.75 16.00 16.25

E1 13.90 14.00 14.10 Note 2

B 0.30 – 0.45

C 0.09 – 0.20

L 0.45 – 0.75

e 0.80 TYP

64A

ATmega128

2467XS–AVR–06/11

13

64M1

D

Marked Pin# 1 ID

ATmega128

E

SEATING PLANE

C

TOP VIEW

K

L

D2

Pin #1 Corner

1
2
3

E2

K

b

e

BOTTOM VIEW

Notes:

1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD.

2. Dimension and tolerance conform to ASMEY14.5M-1994.

2325 Orchard Parkway

R

San Jose, CA 95131

TITLE

64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm,

5.40 mm Exposed Pad, Micro Lead Frame Package (MLF)

Option A

Option B

Option C

Pin #1
Triangle

Pin #1
Chamfer
(C 0.30)

Pin #1
Notch
(0.20 R)

A1

A

0.08

C

SIDE VIEW

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

A 0.80 0.90 1.00

A1 – 0.02 0.05

b 0.18 0.25 0.30

D

D2 5.20 5.40 5.60

E

E2 5.20 5.40 5.60

e 0.50 BSC

L 0.35 0.40 0.45

K 1.25 1.40 1.55

MIN

8.90 9.00 9.10

8.90 9.00 9.10

NOM

MAX

DRAWING NO.

2010-10-19

64M1

NOTE

REV.

H

2467XS–AVR–06/11

14

ATmega128

Errata The revision letter in this section refers to the revision of the ATmega128 device.

ATmega128 Rev. F to M

• First Analog Comparator conversion may be delayed

• Interrupts may be lost when writing the timer registers in the asynchronous timer

• Stabilizing time needed when changing XDIV Register

• Stabilizing time needed when changing OSCCAL Register

• IDCODE masks data from TDI input

• Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request

1. First Analog Comparator conversion may be delayed

If the device is powered by a slow rising V
take longer than expected on some devices.

Problem Fix/Workaround

When the device has been powered or reset, disable then enable theAnalog Comparator
before the first conversion.

2. Interrupts may be lost when writing the timer registers in the asynchronous timer

The interrupt will be lost if a timer register that is synchronous timer clock is written when the
asynchronous Timer/Counter register (TCNTx) is 0x00.

Problem Fix/Workaround

Always check that the asynchronous Timer/Counter register neither have the value 0xFF nor
0x00 before writing to the asynchronous Timer Control Register (TCCRx), asynchronous
Timer Counter Register (TCNTx), or asynchronous Output Compare Register (OCRx).

, the first Analog Comparator conversion will

CC

3. Stabilizing time needed when changing XDIV Register

After increasing the source clock frequency more than 2% with settings in the XDIV register,
the device may execute some of the subsequent instructions incorrectly.

Problem Fix / Workaround

The NOP instruction will always be executed correctly also right after a frequency change.
Thus, the next 8 instructions after the change should be NOP instructions. To ensure this,
follow this procedure:

1.Clear the I bit in the SREG Register.

2.Set the new pre-scaling factor in XDIV register.

3.Execute 8 NOP instructions

4.Set the I bit in SREG
This will ensure that all subsequent instructions will execute correctly.
Assembly Code Example:

CLI ; clear global interrupt enable

OUT XDIV, temp ; set new prescale value

NOP ; no operation

NOP ; no operation

NOP ; no operation

NOP ; no operation

NOP ; no operation

NOP ; no operation

NOP ; no operation

NOP ; no operation

2467XS–AVR–06/11

15

ATmega128

SEI ; set global interrupt enable

4. Stabilizing time needed when changing OSCCAL Register

After increasing the source clock frequency more than 2% with settings in the OSCCAL reg­ister, the device may execute some of the subsequent instructions incorrectly.

Problem Fix / Workaround

The behavior follows errata number 3., and the same Fix / Workaround is applicable on this
errata.

5. IDCODE masks data from TDI input

The JTAG instruction IDCODE is not working correctly. Data to succeeding devices are
replaced by all-ones during Update-DR.

Problem Fix / Workaround

– If ATmega128 is the only device in the scan chain, the problem is not visible.
– Select the Device ID Register of the ATmega128 by issuing the IDCODE instruction

or by entering the Test-Logic-Reset state of the TAP controller to read out the
contents of its Device ID Register and possibly data from succeeding devices of the
scan chain. Issue the BYPASS instruction to the ATmega128 while reading the
Device ID Registers of preceding devices of the boundary scan chain.

– If the Device IDs of all devices in the boundary scan chain must be captured

simultaneously, the ATmega128 must be the fist device in the chain.

6. Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt
request.

Reading EEPROM by using the ST or STS command to set the EERE bit in the EECR reg­ister triggers an unexpected EEPROM interrupt request.

Problem Fix / Workaround

Always use OUT or SBI to set EERE in EECR.

2467XS–AVR–06/11

16

ATmega128

Datasheet
Revision

Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.

History

Rev. 2467X-06/11 1. Corrected typos in “Ordering Information” on page 12.

Rev. 2467W-05/11 1. Added Atmel QTouch Library Support and QTouch Sensing Capability Features.

2. Updated “DC Characteristics” on page 318.
to 85kΩ.

3. Updated “Ordering Information” on page 12 to include Tape & Reel devices.

Rev. 2467V-02/11 1. Updated the literature number (2467) that accidently changed in rev U.

2. Editing update according to the Atmel new style guide. No more space betweeen the
numbers and their units.

3. Reorganized the swapped chapters in rev U: 8-bit Timer/Counter 0, 16-bit TC1 and
TC3, and 8-bit TC2 with PWM.

R

maximum value changed from 60kΩ

RST

Rev. 2467U-08/10 1. Updated “Ordering Information” on page 12. Added Ordering information for Appen-

dix A ATmega128/L 105°C.

Rev. 2467T-07/10 1. Updated the “USARTn Control and Status Register B – UCSRnB” on page 189.

2. Added a link from “Minimizing Power Consumption” on page 47 to “System Clock

and Clock Options” on page 35.

3. Updated use of Technical Terminology in datasheet

4. Corrected formula in Table 133, “Two-wire Serial Bus Requirements,” on page 322

5. Note 6 and Note 7 below Table 133, “Two-wire Serial Bus Requirements,” on page 322
have been removed

Rev. 2467S-07/09 1. Updated the “Errata” on page 15.

2. Updated the TOC with the newest template (version 5.10).

3. Added note “Not recommended from new designs“ from the front page.

4. Added typical I

318.

values for Active and Idle mode in “DC Characteristics” on page

CC

Rev. 2467R-06/08 1. Removed “Not recommended from new designs“ from the front page.

2467XS–AVR–06/11

17

Rev. 2467Q-05/08 1. Updated “Preventing EEPROM Corruption” on page 24.

Removed sentence “If the detection level of the internal BOD does not match the needed
detection level, and external low V

2. Updated Table 85 on page 196 in “Examples of Baud Rate Setting” on page 193.

Remomved examples of frequencies above 16MHz.

3. Updated Figure 114 on page 238.

Inductor value corrected from 10mH to 10µH.

4. Updated description of “Version” on page 253.

5. ATmega128L removed from “DC Characteristics” on page 318.

6. Added “Speed Grades” on page 320.

7. Updated “Ordering Information” on page 12.

Pb-Plated packages are no longer offered, and the ordering information for these packages
are removed.

There will no longer exist separate ordering codes for commercial operation range, only
industrial operation range.

Reset Protection circuit can be used.“

CC

ATmega128

8. Updated “Errata” on page 15:

Merged errata description for rev.F to rev.M in “ATmega128 Rev. F to M”.

Rev. 2467P-08/07 1. Updated “Features” on page 1.

2. Added “Data Retention” on page 8.

3. Updated Table 60 on page 133 and Table 95 on page 235.

4. Updated “C Code Example

5. Updated Figure 114 on page 238.

6. Updated “XTAL Divide Control Register – XDIV” on page 36.

7. Updated “Errata” on page 15.

8. Updated Table 34 on page 76.

9. Updated “Slave Mode” on page 166.

(1)

” on page 176.

Rev. 2467O-10/06 1. Added note to “Timer/Counter Oscillator” on page 43.

2. Updated “Fast PWM Mode” on page 124.

2467XS–AVR–06/11

3. Updated Table 52 on page 104, Table 54 on page 104, Table 59 on page 133, Table 61

on page 134, Table 64 on page 156, and Table 66 on page 157.

4. Updated “Errata” on page 15.

18

Rev. 2467N-03/06 1. Updated note for Figure 1 on page 2.

2. Updated “Alternate Functions of Port D” on page 77.

3. Updated “Alternate Functions of Port G” on page 84.

4. Updated “Phase Correct PWM Mode” on page 100.

5. Updated Table 59 on page 133, Table 60 on page 133.

6. Updated “Bit 2 – TOV3: Timer/Counter3, Overflow Flag” on page 141.

7. Updated “Serial Peripheral Interface – SPI” on page 162.

8. Updated Features in “Analog to Digital Converter” on page 230

9. Added note in “Input Channel and Gain Selections” on page 243.

10. Updated “Errata” on page 15.

ATmega128

Rev. 2467M-11/04 1. Removed “analog ground”, replaced by “ground”.

2. Updated Table 11 on page 40, Table 114 on page 285, Table 128 on page 303, and

Table 132 on page 321. Updated Figure 114 on page 238.

3. Added note to “Port C (PC7..PC0)” on page 6.

4. Updated “Ordering Information” on page 12.

Rev. 2467L-05/04 1. Removed “Preliminary” and “TBD” from the datasheet, replaced occurrences of ICx

with ICPx.

2. Updated Table 8 on page 38, Table 19 on page 50, Table 22 on page 56, Table 96 on

page 242, Table 126 on page 299, Table 128 on page 303, Table 132 on page 321, and
Table 134 on page 323.

3. Updated “External Memory Interface” on page 25.

4. Updated “Device Identification Register” on page 253.

5. Updated “Electrical Characteristics” on page 318.

6. Updated “ADC Characteristics” on page 325.

7. Updated “Typical Characteristics” on page 333.

8. Updated “Ordering Information” on page 12.

Rev. 2467K-03/04 1. Updated “Errata” on page 15.

2467XS–AVR–06/11

19

ATmega128

Rev. 2467J-12/03 1. Updated “Calibrated Internal RC Oscillator” on page 41.

Rev. 2467I-09/03 1. Updated note in “XTAL Divide Control Register – XDIV” on page 36.

2. Updated “JTAG Interface and On-chip Debug System” on page 48.

3. Updated values for V

4. Updated “Test Access Port – TAP” on page 246 regarding JTAGEN.

5. Updated description for the JTD bit on page 255.

6. Added a note regarding JTAGEN fuse to Table 118 on page 288.

7. Updated R

8. Added a proposal for solving problems regarding the JTAG instruction IDCODE in

“Errata” on page 15.

values in “DC Characteristics” on page 318.

PU

(BODLEVEL = 1) in Table 19 on page 50.

BOT

Rev. 2467H-02/03 1. Corrected the names of the two Prescaler bits in the SFIOR Register.

2. Added Chip Erase as a first step under “Programming the Flash” on page 315 and

“Programming the EEPROM” on page 316.

3. Removed reference to the “Multipurpose Oscillator” application note and the “32kHz
Crystal Oscillator” application note, which do not exist.

4. Corrected OCn waveforms in Figure 52 on page 125.

5. Various minor Timer1 corrections.

6. Added information about PWM symmetry for Timer0 and Timer2.

7. Various minor TWI corrections.

8. Added reference to Table 124 on page 291 from both SPI Serial Programming and Self
Programming to inform about the Flash Page size.

9. Added note under “Filling the Temporary Buffer (Page Loading)” on page 280 about
writing to the EEPROM during an SPM Page load.

10. Removed ADHSM completely.

11. Added section “EEPROM Write During Power-down Sleep Mode” on page 24.

12. Updated drawings in “Packaging Information” on page 13.

Rev. 2467G-09/02 1. Changed the Endurance on the Flash to 10,000 Write/Erase Cycles.

Rev. 2467F-09/02 1. Added 64-pad QFN/MLF Package and updated “Ordering Information” on page 12.

2467XS–AVR–06/11

20

ATmega128

2. Added the section “Using all Locations of External Memory Smaller than 64 Kbyte”

on page 32.

3. Added the section “Default Clock Source” on page 37.

4. Renamed SPMCR to SPMCSR in entire document.

5. When using external clock there are some limitations regards to change of frequency.
This is descried in “External Clock” on page 42 and Table 131, “External Clock

Drive,” on page 320.

6. Added a sub section regarding OCD-system and power consumption in the section

“Minimizing Power Consumption” on page 47.

7. Corrected typo (WGM-bit setting) for:

“Fast PWM Mode” on page 98 (Timer/Counter0).
“Phase Correct PWM Mode” on page 100 (Timer/Counter0).
“Fast PWM Mode” on page 151 (Timer/Counter2).
“Phase Correct PWM Mode” on page 152 (Timer/Counter2).

8. Corrected Table 81 on page 191 (USART).

9. Corrected Table 102 on page 259 (Boundary-Scan)

10. Updated Vil parameter in “DC Characteristics” on page 318.

Rev. 2467E-04/02 1. Updated the Characterization Data in Section “Typical Characteristics” on page 333.

2. Updated the following tables:

Table 19 on page 50, Table 20 on page 54, Table 68 on page 157, Table 102 on page 259,

and Table 136 on page 328.

3. Updated Description of OSCCAL Calibration Byte.

In the data sheet, it was not explained how to take advantage of the calibration bytes for
2MHz, 4MHz, and 8MHz Oscillator selections. This is now added in the following sections:

Improved description of “Oscillator Calibration Register – OSCCAL” on page 41 and “Cali-

bration Byte” on page 289.

Rev. 2467D-03/02 1. Added more information about “ATmega103 Compatibility Mode” on page 5.

2. Updated Table 2, “EEPROM Programming Time,” on page 22.

3. Updated typical Start-up Time in Table 7 on page 37, Table 9 and Table 10 on page 39,

Table 12 on page 40, Table 14 on page 41, and Table 16 on page 42.

2467XS–AVR–06/11

4. Updated Table 22 on page 56 with typical WDT Time-out.

5. Corrected description of ADSC bit in “ADC Control and Status Register A – ADCSRA”

on page 244.

21

ATmega128

6. Improved description on how to do a polarity check of the ADC differential results in

“ADC Conversion Result” on page 241.

7. Corrected JTAG version numbers in “JTAG Version Numbers” on page 256.

8. Improved description of addressing during SPM (usage of RAMPZ) on “Addressing

the Flash During Self-Programming” on page 278, “Performing Page Erase by SPM”
on page 280, and “Performing a Page Write” on page 280.

9. Added not regarding OCDEN Fuse below Table 118 on page 288.

10. Updated Programming Figures:

Figure 135 on page 290 and Figure 144 on page 301 are updated to also reflect that AVCC

must be connected during Programming mode. Figure 139 on page 297 added to illustrate
how to program the fuses.

11. Added a note regarding usage of the PROG_PAGELOAD and PROG_PAGEREAD
instructions on page 307.

12. Added Calibrated RC Oscillator characterization curves in section “Typical Charac-

teristics” on page 333.

13. Updated “Two-wire Serial Interface” section.

More details regarding use of the TWI Power-down operation and using the TWI as master
with low TWBRR values are added into the data sheet. Added the note at the end of the “Bit

Rate Generator Unit” on page 203. Added the description at the end of “Address Match Unit”
on page 204.

14. Added a note regarding usage of Timer/Counter0 combined with the clock. See

“XTAL Divide Control Register – XDIV” on page 36.

Rev. 2467C-02/02 1. Corrected Description of Alternate Functions of Port G

Corrected description of TOSC1 and TOSC2 in “Alternate Functions of Port G” on page 84.

2. Added JTAG Version Numbers for rev. F and rev. G

Updated Table 100 on page 256.

3 Added Some Preliminary Test Limits and Characterization Data

Removed some of the TBD's in the following tables and pages:

Table 19 on page 50, Table 20 on page 54, “DC Characteristics” on page 318, Table 131 on
page 320, Table 134 on page 323, and Table 136 on page 328.

4. Corrected “Ordering Information” on page 12.

5. Added some Characterization Data in Section “Typical Characteristics” on page 333..

2467XS–AVR–06/11

6. Removed Alternative Algortihm for Leaving JTAG Programming Mode.

See “Leaving Programming Mode” on page 315.

7. Added Description on How to Access the Extended Fuse Byte Through JTAG Pro­gramming Mode.

22

ATmega128

See “Programming the Fuses” on page 317 and “Reading the Fuses and Lock Bits” on page

317.

2467XS–AVR–06/11

23

Atmel Corporation

2325 Orchard Parkway
San Jose, CA 95131
USA

Tel: [phone]
Fax: [phone]

www.atmel.com

Atmel Asia Limited

Unit 1-5 & 16, 19/F
BEA Tower, Millennium City 5
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Kwun Tong, Kowloon
HONG KONG
Tel: [phone]

Atmel Munich GmbH

Business Campus
Parkring 4
D-85748 Garching b. Munich
GERMANY

Tel: [phone]
Fax: [phone]

Atmel Japan

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1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
JAPAN

Tel: [phone]
Fax: [phone]

Fax: [phone]

© 2011 Atmel Corporation. All rights reserved.

®

Atmel

, Atmel logo and combinations thereof, AVR®, QTouch®, QMatrix®, AVR Studio® and others are registered trademarks or trade-

marks of Atmel Corporation or its subsidiaries. Windows

®

and others are registered trademarks of Microsoft Corporation in U.S. and

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any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL

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2467XS–AVR–06/11