Datasheet AT9322 R2 Datasheet (Atmel)

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AT9322 R2
Multimedia USB Keyboard Hub
Technical Reference Manual
Revision 2.1
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TABLE OF CONTENTS i
Table of Contents
1.0 Introduction---------------------------------------------------------------------------------------
1
1.1 Description-----------------------------------------------------------------------------------
1
1.2 Features---------------------------------------------------------------------------------------
1
2.0 Application Block Diagram ------------------------------------------------------------------
3
3.0 Pin Assignment---------------------------------------------------------------------------------
5
4.0 System Architecture and Reference Design-------------------------------------------
9
4.1 AT9322 R2 Block Diagram ---------------------------------------------------------------
9
4.2 Sample Schematics-------------------------------------------------------------------------
10
4.3 Keyboard Hub EEPROM Sample Value----------------------------------------------
11
4.4 Sample Key Matrix Layout Table-------------------------------------------------------
16
5.0 Electrical Characteristics--------------------------------------------------------------------
17
5.1 Absolute Maximum Rating---------------------------------------------------------------
17
5.2 Recommended Operating Conditions--------------------------------------------------
17
5.3 General DC Characteristics--------------------------------------------------------------
18
5.4 DC Electrical Characteristic for 5 volts operation-----------------------------------
18
5.5 DC Electrical Characteristic for 3.3 volts operation--------------------------------
19
5.6 Crystal Oscillator Circuit Setup for Characteristics--------------------------------
19
5.7 USB Transceiver Characteristics--------------------------------------------------------
20
5.8 ESD Test Results----------------------------------------------------------------------------
24
5.9 Latch-Up Test Results---------------------------------------------------------------------
25
6.0 Mechanical Information-----------------------------------------------------------------------
27
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INTRODUCTION 1
1.0 Introduction
Description
The AT9322 R2 is an integrated USB keyboard and 2 port hub controller chip. The AT9322 R2 has a built-in default keyboard matrix, so that it can be directly connected to an 18 x 8 keyboard matrix. The keyboard matrix can be customized via an optional external 1024-byte serial EEPROM. Downstream ports can be used to connect various USB peripheral devices, such as USB printers, modems, scanners, cameras, mice, and joysticks to the system without adding external glue logic. It also supports multimedia volume control, CD/DVD Play/Pause, Stop, Eject, Mute and general purpose shortcut keys such as Internet, email and help.
This single chip integration makes the AT9322 R2 the most cost effective hub/keyboard solution available in the market.
Features
?? Fully compliant with the Universal Serial Bus Specification, version 1.1 ?? USB hub design is compliant with Universal Serial Bus Hub Specification, revision 1.1 ?? USB keyboard design is compliant with USB Device Class Definition for Human
Interface Devices (HID), Firmware Specification, version 1.1
?? Single chip integration of USB keyboard, hub, ACPI and multimedia control functions ?? Integrated USB hub supports two bus-powered downstream ports ?? Patent-pending, table-driven SCANTABLE? technology for easy customization to
different keyboard matrix up to 18x8.
?? Support rotary encoder for multimedia volume control ?? Support CD/DVD Play/Pause, Fast Forward, Rewind, Stop, Eject, Mute (up to 24 keys) ?? Additional general purpose keys for internet, email, help…shortcuts, up to 16 keys. ?? Additional 2 general purpose LEDs ?? Support ACPI compliant suspend/shutdown key ?? Built-in 3.3v voltage regulator allows single +5V operating voltage drawing directly from
USB bus. This results in reduced overall system cost.
?? Optional gang-powered control pin for downstream port. ?? Runs at 12Mhz frequency ?? Available in 64-pin LQFP package.
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APPLICATION BLOCK DIAGRAM 3
2.0 Application Block Diagram
The AT9322 R2 is a single chip which integrates USB keyboard and hub functionality. The upstream port is connected to the USB system. The downstream ports can be used for a mouse and joystick. The multimedia function keys are designed to support volume control, CD/DVD Play/Pause, Stop, Eject, Mute and general purpose shortcut keys for one key internet, email and help.
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PIN ASSIGNMENT 5
3.0 Pin Assignment
The AT9322 R2 is packed in a 64-pin Quad Flat Package (LQFP). The following figure shows the signal names for each of the pins on the chip of a LQFP package. The table on the following page describes each of the pin signals.
SCAN_C2
SCAN_C7
SCAN_C6
SCAN_C5
SCAN_C4
SCAN_C3
SCAN_C1
SCAN_R8
SCAN_R7
SCAN_R6
SCAN_R5
SCAN_R4
SCAN_R3
SCAN_R10
SCAN_R9
SCAN_C8
RSTN
XTAL_1
XTAL_2
GNDAP
VCCAP
USB_DP
USB_DM
USB1_DP
USB1_DM
USB2_DP
MUTEKEYN
SLEEPKEYN
MODEKEYN
DESCSELET2
USB2_DM
SCROLL_LOCK
16
14 15
10 11 12
7 8
9
5 6
2
3
4
1
13
61 60 59 58
57
56 55 54 53 52 51 50 496264 63
DESCSELET0
CAPSLOCK NUM_LOCK
LED2 LED1
DP1OVCR DP2PWRUP DP2OVRCR
GANGPWRN
AIN
GNDK
VCC3K
BIN
DESCSELET1
SCAN_R1
SCAN_R2
33
35 34
39
38 37
42 41
40
44 43
47 46
45
48
36
20 21 22 23 24 25 26 27 28 29 30 31 321917 18
VHV
V33
WAKUPKYN
SHUTDKYN
SCAN_M2 SCAN_M1
SCAN_M0 SCAN_R18 SCAN_R17
SCAN_R16
SCAN_R15 SCAN_R14
SCAN_R13
GNDIO
SCAN_R12 SCAN_R11
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PIN ASSIGNMENT 6
Table 3-1. Pin Descriptions
Pin # Pin Name IO Type Driving Capability Description
1 GNDIO GND Ground 2 VHV 5V Power Supply 5V input 3 VCC33 Regulator 3.3V Output 4 WAKUPKYN INPUT, PULL UP ACPI wakeup key 5 SHUTDKYN INPUT, PULL UP ACPI shutdown key 6 SCAN_M2 INPUT,OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line
(dedicated for mm/shortcut keys)
7 SCAN_M1 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line
(dedicated for mm/shortcut keys)
8 SCAN_M0 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line
(dedicated for
mm/shortcut keys) 9 SCAN_R18 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 10 SCAN_R17 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 11 SCAN_R16 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 12 SCAN_R15 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 13 SCAN_R14 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 14 SCAN_R13 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 15 SCAN_R12 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 16 SCAN_R11 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 17 SCAN_R10 INPUT,PULL UP,PULL DOWN 16mA, 50KOhm Row/Scan Line 18 SCAN_R9
INPUT,PULL UP,PULL DOWN
16mA, 50KOhm Row/Scan Line 19 SCAN_C8 INPUT,PULL UP 2.5K Ohm Column line 20 SCAN_C7 INPUT,PULL UP 2.5K Ohm Column line 21 SCAN_C6 INPUT,PULL UP 2.5K Ohm Column line 22 SCAN_C5 INPUT,PULL UP 2.5K Ohm Column line 23 SCAN_C4 INPUT,PULL UP 2.5K Ohm Column line 24 SCAN_C3 INPUT,PULL UP 2.5K Ohm Column line 25 SCAN_C2 INPUT,PULL UP 2.5K Ohm Column line 26 SCAN_C1 INPUT,PULL UP 2.5K Ohm Column line 27 SCAN_R8 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 28 SCAN_R7 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 29 SCAN_R6 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 30 SCAN_R5 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 31 SCAN_R4 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 32 SCAN_R3 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 33 SCAN_R2 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 34 SCAN_R1 INPUT/OUTPUT,PULL DOWN 16mA, 50KOhm Row/Scan Line 35 BIN INPUT
Rotary encoder input ‘B’
36 VCC3K Kernel 3.3V Input +3V power supply 37 GNDK Kernel Ground Ground 38 AIN INPUT Rotary encoder input ‘A’ 39 GANGPWRN OUTPUT 8mA Port 1 power/Gang power
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PIN ASSIGNMENT 7
enable (gang mode)
40 DP2OVRCUR INPUT,PULL UP 50KOhm Port 2 over current –
low
active
41 DP2PWRUP OUTPUT 8mA Downstream port 2
power enable – low active
42 DP1OVRCUR INPUT,PULL UP 50KOhm Port 1 over current –
low
active
43 LED1 OUTPUT 8mA Additional LED 1 –
low
active – open drain
44 LED2 OUTPUT 8mA Additional LED 2 –
low
active – open drain
45 NUM_LOCK OUTPUT 16mA Num lock LED – low
active – open drain
46 CAPSLOCK OUTPUT 16mA Cap Lock LED – low
active – open drain 47 DESCSELET0 INPUT 48 DESCSELET1 INPUT 49 DESCSELET2 INPUT 50 MODEKEYN INPUT Fn Key 51 USB2_DM INPUT/OUTPUT 16mA
USB downstream port 2
D­52 USB2_DP INPUT/OUTPUT 16mA
USB downstream port 2
D+ 53 USB1_DM INPUT/OUTPUT 16mA
USB downstream port 1
D­54 USB1_DP INPUT/OUTPUT 16mA USB downst
ream port 1
D+ 55 USB_DM INPUT/OUTPUT 16mA USB upstream D­56 USB_DP INPUT/OUTPUT 16mA USB upstream D+ 57 VCCAP Analog 3.3V Input Analog VCC 58 GNDAP Analog Ground Analog ground) 59 XTAL_2 OUTPUT 12MHz crystal output 60 XTAL_1 INPUT 12MHz Crystal input 61 RSTN INPUT Reset – low active 62 MUTEKEYN INPUT,PULL UP 50KOhm Mute key, low active 63 SLEEPKEYN INPUT,PULL UP 50KOhm ACPI
(Sleep/wakeup/power
down) – low active 64 SCROLL_LOCK OUTPUT 16mA Scroll_lock LED output –
low active –open drain
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 9
4.0 System Architecture and Reference Design
4.1 AT9322 R2 Block Diagram
AT9322 Block Diagram
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 10
4.2 Sample Schematics
R10 15K
JP1
HEADER 10
1 2 3 4 5 6 7 8 9
10
VCC3.3
SCAN_R17
SCAN_R4
J2
RIGHT
GND DM DP OUT_A FGND
C29
0.1UF
U3
24C08 or compatible
1 2 3 4 5
6
7
8
A0 A1 A2 GND SDA
SCL
WP
VCC
C32
0.1UF
AT MICRO AT9322 A
AT9322 USB KEYBOARD-HUB CONTROLLER
A4
1 1
Title
Size Document Number Rev
Date: Sheet of
R14 470
R5 15K
SCAN_R10
SCAN_C6
SCAN_R14
VCC3.3
SCAN_R4
SCAN_C4
SCAN_R18
SCAN_R8
SCAN_R5
J1
1 2 3 4 5
VCC DATA­DATA+ GND FGND1
SCAN_R9
C9
1UF
SCAN_R3
C24
39PF
F8
FB
F7
FB
VCC3.3
SCAN_R18
C20
150UF
SCAN_C7
R26
100K
SCAN_C4
SCAN_R10
D2
LED
C34
150UF
SCAN_R16
F2
FB
SCAN_C8
SCAN_R17
Y1
12MHZ
C23
47P
C19
47P
R8
1M
R27 100K
VCC3.3
U1
AT9322
26 25 24 23 22 21 20 19
34 33 32 31 30 29 28 27 18 17 16 15 14 13 12 11 10
9
36
57
3
56
55
54
53
52
5164
46
45
60
59
61
39
37
58
48
47
8 7 6
2
42
40 41
38
35
63 62
43
44
1
50
49
4 5
SCAN_C1 SCAN_C2 SCAN_C3 SCAN_C4 SCAN_C5 SCAN_C6 SCAN_C7 SCAN_C8
SCAN_R1 SCAN_R2 SCAN_R3 SCAN_R4 SCAN_R5 SCAN_R6 SCAN_R7 SCAN_R8 SCAN_R9 SCAN_R10 SCAN_R11 SCAN_R12 SCAN_R13 SCAN_R14 SCAN_R15 SCAN_R16 SCAN_R17 SCAN_R18
VCC3K
VCCAP
VCC3.3
USB_DP
USB_DM
USB1_DP
USB1_DM
USB2_DP
USB2_DMSCR_LOCK#
CAP_LOCK#
NUM_LOCK#
XTAL_1
XTAL_2
RESET#
GANGPWRN
GNDK
GNDAP
E2P_DATA
E2P_CLK
SCAN_M0 SCAN_M1 SCAN_M2
VHV
DP1_OVRCUR#
DP2_OVRCUR#
DP2_PWR#
A_IN
B_IN
SLEEP# MUTE#
LED1#
LED2#
GNDIO
MODEKEYN
NC
WAKUPKYN SHUTDKYN
SCAN_R15
SCAN_R1
C25
0.1UF
R4 15K
R23 47K
SCAN_C1
SCAN_R14
SCAN_C8
SCAN_R2
SCAN_R5
R7 39
SCAN_R7
F1 FB
SCAN_R12
C20
0.1UF
R6
15K
SCAN_C3
C11
0.1UF
D3LED
R11 39
VCC3.3
C21
0.1UF
SCAN_R13
R13 470
R25
470K
R17 39
C10 10UF
R1 39 R2
1.5K
SCAN_R1
C22
39PF
R15
470
VCC3.3
SCAN_C3
VCC
SCAN_R6
U2
2526 or compatible
1 2 3 4 5
6
7
8
ENA# FLGA# FLGB# ENB# OUTB
GND
IN
OUTA
SCAN_R3
C15
47P
SCAN_R15
C17
47P
VCC
R9 39
SCAN_R7
C26
0.1UF
D4LED
J3
LEFT
GND DM DP OUT_A FGND
SCAN_R9
VCC3.3
JP2
HEADER 18
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18
Disclaimer: This schematic is for reference only. AT Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
F4
FB
R16 39
C33
0.1UF
SCAN_R6
F3
FB
SCAN_C1
SCAN_C5
SCAN_R13
VCC
SCAN_R8
SCAN_R11
C36
0.1U
SCAN_C7
R12 39
C31
0.1UF
VCC
VCC
C14
0.1UF
SCAN_C2
SCAN_C2
R3 39
C37
0.1U
SCAN_C6
SCAN_R12
SCAN_R16
SCAN_C5
SCAN_R2
SCAN_R11
R24
47K
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 11
4.3. AT9322 R2 Keyboard Hub EEPROM Sample Value
Offset Hex value Description
00 00,07 Configuration Byte 1 bit 0 : Individual power.
Byte 1 bit 1 : Wakeup on any key. Byte 1 bit 2 : Select SelfPower change by HID
feature. Byte 1 bit 3 : Enable disconnect on power change. Byte 1 bit 4 : Disable Hub(keyboard only). Byte 1 bit 5 : Enable Volume Up/Down Keys
(Disable rotary encoder). Byte 1 bit 6 : Enable Split Report (16 bits - id3, 8 -
id1) Byte 1 bit 7 : Enable Port Error
02 B1,C3 LoByte : Pointer to Hub device descriptor 000h ROM address
HiByte : Xfer end address + 1
04 1C,35 LoByte : Pointer to Hub configuration descriptor 000h ROM
address HiByte : Xfer end address + 1 (config+interface+endpoint)
06 C3,CC LoByte : Pointer to HUB Class descriptor (0x29) 000h ROM
address HiByte : Xfer end address + 1
08 CC,DE LoByte : Pointer to Keyboard device descriptor 000h ROM
address HiByte : Xfer end address + 1
0A 35,57 LoByte : Pointer to Keyboard configuration descriptor
HiByte : Xfer end address + 1 000h ROM address (config+interface0+HID0+endpoint1+interface1+HID1+endpoint2)
0C 47,50 LoByte : Pointer to Keyboard HID descriptor (0x21) Interface 0
HiByte : Xfer end address + 1 000h ROM address
0E 70,B1 LoByte : Pointer to Keyboard Report descriptor (0x22) Interface 0
HiByte : Xfer end address + 1 000h ROM address
10 60,69 LoByte : Pointer to Keyboard HID descriptor (0x21) Interface 1
HiByte : Xfer end address + 1 000h ROM address
12 54,02 LoByte : Pointer to Keyboard Report descriptor (0x22) Interface 1
HiByte : Xfer end address + 1 start in 200h ROM address, end in 300h ROM address
14 02,06 LoByte : Pointer to string descriptor (index 0) 300h ROM
address HiByte : Xfer end address + 1
16 06,12 LoByte : Pointer to string descriptor (index 1) 300h ROM
address HiByte : Xfer end address + 1
18 12,3A LoByte : Pointer to string descriptor (index 2) 300h ROM
address
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 12
HiByte : Xfer end address + 1
1A 3A,42 LoByte : Pointer to string descriptor (index 3) 300h ROM
address HiByte : Xfer end address + 1
1C 09,02,19,00,01,01,02,E0,32 Config Desc. 1 interface, self powered, remote wakeup, 100 mA
Total bytes returned : 0x19
25 09,04,00,00,01,09,00,00,02 Hub interface descriptor, interface 0. Class code 0x9, Sub Class 02
2E 07,05,81,03,01,00,FF Hub endpoint descriptor
35 09,02,22,00,01,01,02,E0,32 Keybrd Config Desc. 1 interfaces, Self powered, remote wakeup,
100 mA Total bytes returned : 0x22
3E 09,04,00,00,01,03,01,01,02 Keyboard interface descriptor, interface 0. Class code 0x3.Boot
subclass 47 09,21,10,01,00,01,22,41,00 Keyboard HID 1.1 descriptor , Country code=00 50 07,05,81,03,08,00,0A Keyboard endpoint descriptor 57 09,04,01,00,01,03,00,00,02 Added Key interface descriptor, interface 1. Class code 0x3.
subclass 02, (KB 1 interface, Added key Not Used) 60 09,21,10,01,00,01,22,AE,00 Added Key HID 1.1 descriptor, Country code=00 69 07,05,82,03,04,00,FF Added Key endpoint descriptor 70 05,01,09,06,A1,01,05,07,
19,E0,29,E7,15,00,25,01,
75,01,95,08,81,02,95,01, 75,08,81,01,95,05,75,01, 05,08,19,01,29,05,91,02, 95,01,75,03,91,01,95,06, 75,08,15,00,26,FF,00,05,
07,19,00,2A,FF,00,81,00,
C0
Keyboard report descriptor
B1 12,01,10,01,09,00,00,08,
8F,05,13,92,01,00,01,02,
00,01
Hub device descriptor, version 1. 1, change VID,PID
Device version 1
12 Descriptor length
01 Device Descriptor
10 01 USB Version 1.1
09 Hub class
00 Sub-class
00 Device Protocol
08 Maximum packet size
VV VV Vender ID – Hub Vender ID (058F)
PP PP Product ID - Hub Product ID (9213)
01 00 Device release number
01 Index of Manufacturer string descriptor
02 Index of Product string descriptor
00 Index of serial number string descriptor – no serial number
01 Number of configuration
C3 09,29,03,0C,00,16,64,02,FF Hub class descriptor.
09 Descriptor length
29 Hub Descriptor
03 Number of downstream port – one keyboard and 2 external
ports
0C 00 Individual Over-current, compound device, gang power
switch
16 Power good wait time 16hx2 mS
64 Maximum current required (100 mA)
02 Port 1 is not removable
FF Port power control mask
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 13
CC 12,01,10,01,00,00,00,08,
8F,05,72,94,01,00,01,02,
00,01
Keyboard device descriptor, version 1.1, change VID,PID Device version 1 12 Descriptor length 01 Device Descriptor 10 01 USB Version 1.1 00 Class defined in interface descriptor 00 Sub-class 00 Device Protocol 08 Maximum packet size VV VV Vender ID –Keyboard Vender ID (058F) PP PP Product ID - Keyboard Product ID (9472) 01 00 Device release number 01 Index of Manufacturer string descriptor 02 Index of Product string descriptor 00 Index of serial number string descriptor – no serial number 01 Number of configuration
DE 00,00,
00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00,
Spare bytes for expanding the Key report descriptor
100 39,2C,4E,3A,3B,3C,3D,3E,
3F,40,41,42,43,53,47,5F,
60,61,56,5C,5D,5E,57,59,
5A,5B,62,63,58,44,45,46,
34,35,4D,31,1D,1B,06,19,
05,11,10,36,37,38,4C,55,
24,25,26,27,2D,2E,2A,2B,
14,1A,08,15,17,1C,18,0C,
12,13,2F,30,28,51,04,16,
07,09,0A,0B,0D,0E,0F,33,
32,4A,52,4B,48,50,4F,49, 00,89,E0,E4,E8,E2,E6,54, 8B,E3,00,00,67,88,00,8A,
E1,87,00,00,E5,66,E7,65,
64,29,1E,1F,20,21,22,23, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00,
Keyboard Matrix 8x18
190 60,61,56,5C,5D,5E,57,59,
5A,5B,62,63,58,44,45,46, 34,35,4D,31,1D,1B,06,19,
05,11,62,36,63,54,4C,55, 5F,60,61,55,2D,2E,2A,2B, 14,1A,08,15,17,1C,5C,5D,
5E,56,2F,30,58,4E,04,16,
07,09,0A,0B,59,5A,5B,57,
32,4A,4B,4B,48,4A,4D,49,
00,89,E4,E4,E8,E2,E6,54, 8B,E3,00,00,67,88,00,8A,
E1,87,00,00,E5,66,E7,65,
64,29,1E,1F,20,21,22,23,
00,00,00,00,00,00,00,00,
Keyboard Matrix 8x14
200 00,00,00,00,00,00,00,00,
00,00,00,00,00,00,00,00,
Spare bytes for expanding the Added Key report descriptor
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 14
00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00,
00,00,00,00,
254 05,0C,09,01,A1,01,85,01,
09,E0,15,E8,25,18,75,07,
95,01,81,06,15,00,25,01,
75,01,09,E2,81,06,C0,05,
01,09,80,A1,01,85,02,19,
81,29,83,15,00,25,01,75, 01,95,03,81,06,75,05,95,
01,81,01,C0,05,0C,09,01,
A1,01,85,03,95,01,75,01,
15,00,25,01,0A,21,02,81, 06,0A,8A,01,81,06,09,B7, 81,06,09,CD,81,06,09,E9, 81,06,09,EA,81,06,0A,92,
01,81,06,0A,24,02,81,06, 0A,8A,01,81,06,0A,23,02,
81,06,0A,21,02,81,06,0A,
26,02,81,06,0A,27,02,81,
06,09,E2,81,06,09,00,81,
06,09,00,81,06,95,01,75, 08,81,01,05,08,09,19,75,
01,91,02,09,2A,91,02,95,
01,75,06,91,01,C0,
Added Key report descriptor (KB 1 interface, Added key Not Used)
302 04,03,09,04 Lang ID array, (index 0), change string 306 0C,03,
41,00,4C,00,43,00,4F,00,52,00,
Leng,Str_desc, (index 1) Manufacturer, A,L,C,O,R
312 28,03,
41,00,55,00,39,00,34,00, 33,00,32,00,20,00,4B,00, 65,00,79,00,62,00,6F,00, 61,00,72,00,64,00,20,00,
48,00,75,00,62,00,
Leng, Str_desc (index 2), change string Product, A,T,9,3,2,2, ,K,e,y,b,o,a,r,d, ,H,u,b
33A 08,03,31,00,32,00,33,00 Leng,Str_desc (Serial number, index 3), change string
1,2,3
342 00,00,00,00,00,00,00,00,
00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00,
Spare bytes
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 15
00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00, 00,00,00,00,00,00,00,00,
00,00,00,00,00,00,
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SYSTEM ARCHITECTURE AND REFERENCE DESIGN 16
4.4 Sample Key Matrix Layout Table
This table is a sample key matrix. The AT9322 R2 can also mask this matrix as default without an external EEPROM.
Table 4-1. Sample AT9322 R2 Key Matrix
H1 H2 H3 H4 H5 H6 H7 H8 V1 ? Left V2 Alt-Left Japan Alt-Right Japan V3 Ctrl-Left Caps-Lock Ctrl-Right r Korea-Right V4 Korea-Left
Shift-Right
Japan Shift-Left
V5 Z A Back-Space
`~ Enter Home ? 4
Tab
V6 X S += 1! ]} ?8 5 Q V7 F3 F5 Print-Screen Pause F11 F9 F7 F1 V8 Esc F4 F12 Scroll-Lock
F10 F8 F6 F2
V9 M J 7& 6^ U K ,< Y
V10 N H 8* 5% I L .> T V11 B G 9( 4$ O ;: ?/ R V12 V F 0) 3# P ‘” Space-Bar E V13 C D -_ 2@ [{ Pg Up 9 ? 6 W V14 Page-Up Page-DN \(UK) | ? - * Pg Dn 3 Ins 0 V15 Home End \| ? + / ?2 . Del V16 Insert Del ? ? ? Num Lock End 1 Enter (Pad) V17 ? Right V18 <> Japan Japan Rev.Key Brazil
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ELECTRICAL CHARACTERISTICS 17
5.0 Electrical Characteristics
5.1 Absolute Maximum Ratings
SYMBOL PARAMETER RATING UNITS
VCC Power Supply -0.3 to 6.0 V
VIN Input Voltage -0.3 to VCC+0.3 V
V
OUT
Output Voltage -0.3 to VCC+0.3 V
V
cc5
Power Supply for Dual
Oxide Cells
-0.6 to 6.0 V
V
in5
Power Supply for Dual
Oxide Cells
-0.3 to V
cc5
+0.3 V
V
OUT
Output Voltage -0.3 to V
cc5
+0.3 V
T
STG
Storage Temperature -55 to 150
O
C
5.2 Recommended Operating Conditions
SYMBOL PARAMETER MIN TYP MAX UNITS
VCC Power Supply 3.0 3.3 3.6 V
VIN Input Voltage 0 - VCC V
Commercial Power Supply
for Dual Oxide Cells
4.75 5.0 5.25
O
C
Industrial Power Supply
for Dual Oxide Cells
4.5 5.0 5.5 V
V
CC5
V
IN5
Input Voltage 0 - V
cc5
V
Commercial Junction
Operating Temperature
0 25 115
OC
T
j
Industrial Junction
Operating Temperature
-40 25 125
OC
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ELECTRICAL CHARACTERISTICS 18
5.3 General DC Characteristics
SYMBOL
PARAMETER CONDITIONS MIN TYP MAX UNITS
IIL Input leakage current no pull-up or pull-down
-1 1
?A
IOZ Tri-state leakage current -1 1
?A
C
IN3
3.3 Input capacitance 2.8
?F
C
OUT3
3.3 Output capacitance 2.7 4.9
?F
C
BID3
3.3V Bi-directional buffer capacitance
2.7 4.9
?F
C
IN5
5V Input capacitance 2.7 5.6
?F
C
OUT5
5V Output capacitance
?F
C
BID5
5V Bi-directional buffer
capacitance
2.7 5.6
?F
5.4 DC Electrical Characteristics for 5 volts operation
( Under Recommended Operating Conditions and VCC=4.5v ~ 5.25v , Tj= 0OC to +115OC )
SYMBOL
PARAMETER CONDITIONS MIN TYP MAX UNITS
VIL Input Low Voltage CMOS 0.3*VCC V
VIH Input High Voltage CMOS 0.7*V
CC
V
VIL Input Low Voltage TTL 0.8 V
VIH Input High Voltage TTL 2.0 V
Vt-
Schmitt trigger negative
going threshold voltage
CMOS 1.78 V
Vt+
Schmitt trigger positive
going threshold voltage
CMOS 3.20 V
Vt-
Schmitt trigger negative
going threshold voltage
TTL 1.10 V
Vt+
Schmitt trigger positive
going threshold voltage
TTL 1.90 V
VOL Output low voltage IOL=2, 4, 8, 12, 16, 24 mA 0.4 V
VOH Output high voltage IOH=2, 4, 8, 12, 16, 24 mA 3.5 V
RI Input Pull-up/down
resistance
VIL=0
V
or VIH=VCC 50
K?
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ELECTRICAL CHARACTERISTICS 19
5.5 DC Electrical Characteristics for 3.3 volts operation
( Under Recommended Operating Conditions and VCC=3.0v ~ 3.6v , Tj = 0OC to +115OC )
SYMBOL PARAMETER CONDITIONS MIN TYP MAX
UNITS
VIL Input Low Voltage CMOS 0.3*VCC V VIH Input High Voltage CMOS 0.7*VCC V Vt-
Schmitt trigger negative going
threshold voltage
CMOS
1.20
V
Vt+
Schmitt trigger positive going
threshold voltage
CMOS
2.10
V
VOL Output low voltage IOH=2, 4, 8, 12, 16, 24 mA 0.4 V VOH Output high voltage IOH=2, 4, 8, 12, 16, 24 mA 2.4 V RI Input Pull-up/down resistance VIL=0
V
or VIH=VCC 75
K?
5.6 Crystal Oscillator Circuit Setup for Characterization
The following setup was used to measure the open loop voltage gain for crystal oscillator circuits. The feedback resistor serves to bias the circuit at its quiescent operating point and the AC coupling capacitor, Cs, is much larger than C1 and C2.
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ELECTRICAL CHARACTERISTICS 20
5.7 USB Transceiver Characteristics
RECOMMENDED OPERATING CONDITIONS
LIMITS UNIT SYMBOL PARAMETER CONDITIONS
MIN MAX
VCC DC supply voltage 3.0 3.6 V VI DC input voltage range 0 5.5 V V
I/O
DC input range for I/Os 0 VCC V VO DC output voltage range 0 VCC V T
AMB
Operating ambient temperature
range in free air
See DC and AC characteristics for individual device
0 70
°
C
ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2)
In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v)
LIMITS UNIT SYMBOL PARAMETER CONDITIONS
MIN MAX
VCC DC supply voltage -0.5 +6.5 V IIK DC input diode current Vi<0 -50 mA VI DC input voltage Note 3 -0.5 +5.5 V V
I/O
DC input voltage range for I/Os -0.5
Vcc +0.5
V
IOK DC output diode current Vo> Vcc or Vo<0 +/-50 mA VO DC output voltage Note 3 -0.5
Vcc +0.5
V
IO
DC output source sink current for VP/VM and RCV pins
Vo=0 to Vcc +/-15 mA
IO
DC output source or sink current for D+/D- pins
Vo= 0 to Vcc +/-50 mA
ICC, I
GND
DC Vcc or GND current +/-100 mA
T
STO
Storage temperature range -60 +150 °C
P
TOT
Power dissipation per package mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
2. The performance capability of a high performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings
are observed.
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ELECTRICAL CHARACTERISTICS 21
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltages are referenced to GND (Ground=0V).
LIMITS SYMBOL PARAMETER -400°C to +850°C UNIT
TEST CONDITIONS
MIN TYP MAX
VHYS Hysteresis on inputs Vcc=3.0V to 3.6V (Note 3) 0.3 0.4 0.5 V VIH HIGH level input Vcc=3.0V to 3.6V (Note 3) 1.5 2.0 V VIL LOW level input Vcc=3.0V to 3.6V (Note 3) 0.8 1.1 V RoH Output impedance (HIGH
state)
Note 2 28 34 43 ohm
RoL Output impedance (LOW
state)
Note 2 28 35 43 ohm
VOH HIGH level output
(Note 3)
Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100?A
2.2
2.4
2.8
2.7 V
VOL LOW level output
(Note 3)
Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100?A
0.3 0.7
0.4
0.2
V
IQ Quiescent supply current Vcc=3.6V VI=Vcc or GND
Io=0
330 600
?A
Isup Supply current in suspend Vcc=3.6V VI=Vcc or GND
Io=0
70
?A
IFS Active supply current (Full
Speed)
Vcc=3.3V 9 14 mA
ILS Active supply current (Low
Speed)
Vcc=3.3V 2 mA
ILeak Imput leakage current Vcc=3.6V VI=5.5V or
GND, not for I/O Pins
+/-
0.1
+/-
0.5
?A
IOFF 3-state output OFF-state
current
Vi=Vih or ViL; Vo=Vcc or GND
+/-10
?A
NOTES:
1. All typical values are at Vcc=3.3V and Tamb=25°C.
2. This value includes an external resistor of 24 ohm +/-1%. See "Load D+ and D-" diagram for testing details.
3. All signals except D+ and D-.
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ELECTRICAL CHARACTERISTICS 22
AC ELECTRICAL CHARACTERISTICS
GND=0V, tR = tF =3.0 ns; CL = 50pF, RL=500ohms
LIMITS (T
AMB
)
00°C to +250°C 00°C to +700°C
SYMBOL PARAMETER WAVEFORM
MIN TYP MAX MIN MAX
UNIT
tpLH tpHL
VMO/VPO to D+/D-
Full Speed
1 0
0
12
12 0 0
14 14
ns
trise tfall
Rise and Fall Times
Full Speed
2 4
4
9 9
20 20 4 4
20 20
ns
tRFM
Rise and Fall Time
Matching
Full Speed
90 110 90 110 %
tpLH tpHL
VMO/VPO to D+/D-
Low Speed
1 120
120
300 300
300
300
ns
trise tfall
Rise and Fall Times
Low Speed
2 75
75
300
200
75 75
300 200
ns
tRFM
Rise and Fall Time
Matching
Low Speed
70 130 70 130 %
tpLH tpHL
D+/D - to RCV
3 9
9
16 16
16
16
ns
tpLH tpHL
D+/D - to VP/VM
1 4
4
8 8
8
8
ns
tpHZ tpZH tpLZ tpZL
OE# to D+/D- RL =
500ohm
4
12
12 10 10
12
12 10 10
ns
tsu Setup for SPEED 5 0 ns Vcr Crossover point1 3 1.3 2.0 1.3 2.0 V
NOTE:
1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with a 5Cpf capacitance.
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ELECTRICAL CHARACTERISTICS 23
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ELECTRICAL CHARACTERISTICS 24
5.8 ESD Test Results
Test Description : ESD Testing was performed on a Zapmaster system using the Human-Body –Model (HBM) and Machine-Model (MM), according to MIL_STD 883 and EIAJ IC_121 respectively. ?? Human-Body-Model stress devices by sudden application of a high
voltage supplied by a 100 PF capacitor through 1.5 Kohm resistance.
?? Machine-Model stresses devices by sudden application of a high voltage
supplied by a 200 PF capacitor through very low (0 ohm) resistance
Test circuit & condition
??Zap Interval : 1 second ??Number of Zaps : 3 positive and 3 negative at room temperature ??Critera : I-V Curve Tracing
Model Model S/S TARGET Results
HBM Vdd, Vss, I/C 15 6000V Pass MM Vdd, Vss, I/C 15 200V Pass
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ELECTRICAL CHARACTERISTICS 25
5.9 Latch-Up Test Results
Test Description: Latch-Up testing was performed at room ambient using an IMCS-4600 system which applies a stepped voltage to one pin per device with all other pins open except Vdd and Vss which were biased to 5 Volts and ground respectively. Testing was started at 5.0 V (Postive) or 0 V(Negative), and the DUT was biased for 0.5 seconds. If neither the PUT current supply nor the device current supply reached the predefined limit (DUT=0 mA , Icc=100 mA), then the voltage was increased by 0.1 Volts and the pin was tested again. This procedure was recommended by the JEDEC JC-40.2 CMOS Logic standardization committee.
Notes:
1. DUT: Device Under Test.
2. PUT: Pin Under Test.
Vcc
DUT
GND
Pin
under
mUntested
Output Open
Untested
Input Tied
Trigger
Source
V Supply
+
+
Icc Measurement
Test Circuit : Positive Input/ output Overvoltage /Overcurrent
1 Source
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ELECTRICAL CHARACTERISTICS 26
Vcc
DUT
GND
Pin under test
mA
Untested Output Open Circuit
Untested Input Tied to V supply
Trigger Source
V Supply
+
+
Icc Measurement
Test Circuit : Negative Input/ Output Overvoltage /Overcurrent
1 Source
Vcc
DUT
GND
mA
Untested Output Open Circuit
All Input Tied to V supply
V Supply
+
Icc Measurement
Supply Voltage test
Latch–Up Data
Model Model Voltage (v)/ Current S/S Results
+ Voltage
-
11.0
11.0
5 Pass
+ Current
-
200 200
5
Vdd-Vxx 9.0 5 Pass
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MECHANICAL INFORMATION 27
6.0 Mechanical Information
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