200 ns Maximum Access Time
6 ms Typical Sector Write
CMOS Low Power Consumption
•
20 mA Typical Active Current (Byte Mode)
400 µA Typic al Standby Current
Fully MS-DOS Compatible Flash Driver and Formatter
•
Virtual-Disk Flash Driver with 512 By tes/Sector
Random Read/Write to any Sector
No Erase Operation Required Prior to any Write
Zero Data Retention Power
•
Batteries not Required for Data Storage
PCMCIA/JEIDA 68-Pin Standard
•
Selectable Byte- or Word-Wide Configuration
High Re-programmable Endurance
•
Built-in Redundancy for Sector Replacement
Minimum 100,000 Write Cycles
Five Levels of Write Protection
•
Prevent Accidental Data Loss
Block Diagram
Pin Configuration
Pin NameFunction
A0-A21Addresses
D0-D15Data
,
CE2,
CE1
WE, OE, REG
, WP
CD
BVD1, BVD2
Control Signals
Card Status
Page 2
Description
Atmel’s Flash Memory Card provides the highest system level
performance for data and file storage solutions to the portable
PC market segment. Data files and a pplications programs ca n be
stored on the AT5FC004. This allows OEM manufacturers of
portable system to eliminate the weight, power consumption and
reliability issues associated with electro-mechanical disk-based
systems. The AT5FC004 r equires a single voltage powe r supply
for total system operation. No batteries are needed for data retention due to its Flash-based technology. S ince no high volta ge
(12 V) is required to perform any write operation, the
AT5FC004 is suitable for the emerging "mobile" personal systems.
The AT5FC004 is com pa tible with the 6 8-pin P CMC IA/ JE IDA
international standard. Atmel’s Flash Memory Cards can be
read in either a byte-wide or word-wide mode which allows for
flexible integration into various system platform s. It c an be rea d
like any typical PCMCIA SRAM or ROM card.
Block Diagram
The Card Information Structure (CIS) can be written by the
OEM or by Atmel at the attribute memory address space using a
format utility. The CIS appears at the beginning of the card’s
attribute memory space and defines the low-level organization
of data on the PC card. The AT5FC004 contains a separate
2 Kbyte EEPROM memory for the card’s attribute memory
space.
The third party software solutions such as AWARD Software’s
CardWare system and the SCM’s Flash File System (FFS),
enables Atmel’s Flash Memory Card to emulate the function of
essentially all the major brand personal computers that are
DOS/Windows compatible.
For some unique portable computers, such as the
HP200/100/95LX series, the software Driver and Formatter are
also available. The Atmel Driver and Formatter utilizes a selfcontained spare sector replacement algorithm, enabled by Atmel’s small 512-byte sectors, to achieve long term card
reliability and endurance.
2AT5FC004
Page 3
Absolute Maximum Ratings*
Storage Temperature........................-30°C to +70°C
Ambient Temperature with
Power Applied................................... -10°C to +70°C
Voltage with
Respect to Ground, All pins
(1)
V
............................................... -2.0 V to +7.0 V
CC
Output Short Cir c uit Current
(1)
.......... -2.0 V to +7.0 V
(2)
....................-200 mA
AT5FC004
*NOTICE: Stresses beyond those listed under "Absolute Maximum
Ratings" may cause perm an en t dam ag e to the card . T his is a stress
rating only and functional operation of the card at these or any
other conditions beyond those indicated in the
operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transients, inputs may overshoot V
up to 20 ns. Maximum DC voltage on output and I/O pins is
V
+0.5 V. During voltage transitions, outputs may overshoot to
CC
V
+2.0 V for periods up to 20 ns.
CC
2. No more than one output shorted at a time. Durati on of the short circuit should not be greater than one second. Conditions equal
V
= 0.5 V or 5.0 V, VCC = Max.
OUT
to -2.0 V for periods of
SS
D.C. and A.C. Operating Range
AT5FC004-20
o
Operating Temperature (Case)Com.0
Power Supply5 V ± 5%
V
CC
Pin Capacitance
(f = 1 MHz, T = 25°C)
(1)
SymbolParameterConditionsTypMaxUnits
C
IN1
C
OUT
C
IN2
C
I/O
Note: 1. This parameter is characterized and is not 100% tested.
Control CapacitanceVIN = 0 (CE)45pF
I/O CapacitanceV
= 0 V20pF
I/O
C - 70oC
3
Page 4
PC Card Pin Assignments
I = Input, O = Output, I/O = Bi-directional, NC = No Connect
PinSignalI/OFunction
1GNDGround
2D3I/OData Bit 3
3D4I/OData Bit 4
4D5I/OData Bit 5
5D6I/OData Bit 6
6D7I/OData Bit 7
7
CE
1
ICard Enable 1
8A10IAddress Bit 10
9
OEIOutput Enable
10A11IAddress Bit 11
11A9IAddress Bi t 9
12A8IAddress Bi t 8
13A13IAddress Bit 13
14A14IAddress Bit 14
15
WEIWrite Enable
16NCNo Connect
17V
CC
Power Supply
18NCNo Connect
19A16IAddress Bit 16
20A15IAddress Bit 15
21A12IAddress Bit 12
22A7IAddress Bi t 7
23A6IAddress Bi t 6
24A5IAddress Bi t 5
25A4IAddress Bi t 4
26A3IAddress Bi t 3
27A2IAddress Bi t 2
28A1IAddress Bi t 1
29A0IAddress Bi t 0
30D0I/OData Bit 0
31D1I/OData Bit 1
32D2I/OData Bit 2
33WPOWrite Protect
34GNDGround
(1)
(1)
PinSignalI/OFunction
35GNDGroun d
36
CD
1
OCard Detect 1
37D11I/OData Bit 11
38D12I/OData Bit 12
39D13I/OData Bit 13
40D14I/OData Bit 14
41D15I/OData Bit 15
42
CE
2
ICard Enable 2
43NCNo Connect
44RFUReserved
45RFUReserved
46A17IAddress Bit 17
47A18IAddress Bit 18
48A19IAddress Bit 19
49A20IAddress Bit 20
50NCNo Connect
51V
64D8I/OData Bit 8
65D9I/OData Bit 9
66D10I/OData Bit 10
67
CD
2
OCard Detect 2
68GNDGroun d
(1)
(1)
(2)
(2)
(1)
Notes: 1. Signal must not be connected between cards.
BVD = Internally pul led up.
2.
4AT5FC004
Page 5
AT5FC004
Pin Description
SymbolNameTypeFunction
A0-A21Address InputsInputAddress Inputs are internally latched during write cycles.
Data Input/Outputs are internally latched on write cycles.
D0-D15Data Input/Output
CE1, CE
2
Card EnableInput
Input/Output
Data outputs are latched during read cycles. Data pins
are active high. Whe n the memory card is de-selected or
the outputs are dis ab led the outputs float to tri-state.
Card Enable is active low. The memory card is
de-selected and power consumption is reduced to
standby levels whe n
memory card circuitry that controls the high and low byte
control logic o f the card, input buffers, segment decoders,
and associated memory devices.
CE is high. CE activates the internal
OEOutput EnableInput
WEWrite Enable Input
V
CC
GNDGroundGround
CD1, CD
WPWrite ProtectOutput
NCNo ConnectCorresponding pin is not connected internally.
BVD1, BVD
REGRegister SelectInput
2
PC Card Power
Supply
Card DetectOutput
Battery Voltage DetectOutputInternally pulled up. (There is no battery in the card.)
2
Output Enable is active low and enables the data buffers
through the card outputs during read cycles.
Write Enable is active low and controls th e write function
to the memory arra y. The target address is latched on the
falling edge of the
latched on the rising edge of the pulse.
PC Card Power Supply for device operation
(5.0 V ± 5%)
When Card Detect 1 and 2 = Ground the system detects
the card.
Write Protect is active high and indicate s that all card
write operations are disabled by the write protect switch.
Provide access to Card Information Structure in the
Attribute Memory Device
WE pulse and the appropriate data is
5
Page 6
Memory Card Operations
The AT5FC004 Flash Memory Card is organized as an array of
8 individual AT29C040A devices. They are logically define d as
contiguous sectors of 512 bytes. Each sector can be read and
written randomly as designated by the host. Th ere is N O need to
erase any sector prior to any write operation. Also, there is NO
high voltage (12 V) required to perform any write operations.
The common memory space data contents are altered in a similar manner as writing to individual Flash memory devices. Oncard address and data buffers activate the appropriate Flash device in the memory array. E ach devic e internally latche s addres s
and data during wri te cycles. Refer to the Common M emoryOperations table.
Byte-Wide Operations
The AT5FC004 provides the flexibility to operate on data in
byte-wide or word-wide oper ations . Byte- wid e dat a is a va ilable
on D0-D7 for read and write operations (
high). Even and odd bytes are stored in a pair of memory chip
segments (i.e., S0 and S1) and are accessed when A0 is low and
high respectively.
Word-Wide Operat io n s
The 16-bit words are accessed when both CE1 and CE2 are
forced low, A0 = don’t care. D0-D15 are used for word-wide
operations
Read Enable/Output Disable
Data outputs from the card are disabled when OE is at a logichigh level. Under this condition, outputs are in the high-impedance state. The A20 and A2 1selects the paired memo ry chip segments, while A0 decide s the upper or lower bank . T he
pins determine either byte or word mode operation. The Output
Enable (
chip segments. The on-card I/O transceiver is set in the output
mode. The AT5FC004 sends data to the host. Refer to A.C.
Read Waveforms drawing.
OE) is forced low to activate all outputs of the me mor y
Standby Operations
When both CE1 and CE2 are at logic-high level, the AT5FC004
is in Standby mode; i.e., all memory chip segme nts as well as the
decoder/transceiver are completely de-selected at minimum
power consumption. Even in the byte-mode read operation, only
one memory chip segment (even or odd) is active at any time.
The other seven memory chip segments remain in standby. In
the word-mode there are two memory chip segments in active
and six in standby.
Write Operations
The AT5FC004 is written on a sector basis. Each sector of 512
bytes can be selected randomly and written indepe ndently without any prior erase cycle. A9 to A19 specify the sector address,
while A20 and A21 specifies the Flash chip segment pair.
Within each sector, the individual by te ad dress is la tch ed on the
falling edge of
CE or WE, whichever occurs last. The data is
CE1 = low, CE2 =
CE1/CE
latched by the first rising edge of
be programmed must have its high-to-low transition on
CE) within 150 µs of the low-to- high transition of WE (or CE)
of the preceding byte pair. If a high-to-low transition is not de-
tected within 150 µs of the last low-to-high transition, the data
load period will end and the internal programming period will
start. All the bytes of a sector are simultaneously programmed
during the internal programming period. A maxim um write time
of 10 ms per sector is self-controlled by the Flash devices. Refer
to A.C. Write Waveforms drawings.
CE or WE. Each byte pair to
Write Protection
The AT5FC004 has five types of write protection. The
PCMCIA/JEIDA socket itself provides the first type of write
protection. Power supply and control pins have specific pin
lengths in order to protect the card with proper power supply
sequencing in the case of hot insertion and removal.
A mechanical write protection switch provide s a second type of
write protection. When this swit ch is ac tivated,
forced high. The Flash memory arrays are therefore write-disabled.
The third type of write protection is achieved with the built-in
low VCC sensing circuit within each Flash device. If the external VCC is below 3.8 V (typica l), the write f unction is inhibited.
The fourth type of write protection is a noise filter circuit within
each Flash device. Any pulse of less than 15 ns (typical) on the
WE, CE1 or CE2 inputs will not initiate a program cycle.
The last type of write protection is based on the Software Data
Protection (SDP) scheme of the AT29C040A devices. Each of
the sixteen devices needs to enable and disable the SDP indi-
2
vidually. Refer to the Software Data Protected Program-ming/Disable Algorithm tables for descriptions of enable and
disable SDP operations.
WE is internally
Card Detection
Each CD (output) pin should be read by the host system to determine if the memory ca rd is properly sea ted in the socket.
and CD2 are internally tied to the ground. If both bits are not
detected, the system should indicate that the card must be
re-inserted.
CIS Data
The Card Information Structure (CIS) describes the capabilities
and specifications o f a card. T he CIS of the AT5FC004 can be
written either by the OEM or by Atmel at the attribute memory
space beginning at address 00000H by using a format utility.
The AT5FC004 contains a separate 2 Kbyte EEPROM memory
for the card’s attribute memory space. The attribute is active
when the
tribute memory access. D8-D15 should be ignored. Odd order
bytes present invalid data. Refer to the Attribute MemoryOperations table.
REG pin is driven low. D0-D7 are active during at-
WE (or
CD
1
6AT5FC004
Page 7
Common Memory Operations
X = Don’t Care, where Don’t Care is either VIL or VIH levels.
1. Byte access - Even. In this x8 mode, D0-D7 contain the "even"
byte (low byte) of the x16 word. D8-D15 are inactive.
2. Byte access - Odd. In this x8 mode, D0-D7 contain the "odd" byte
(high byte) of the x16 word. This is accomplished internal to the
card by transposin g D 8 -D 15 to D0 -D 7. D 8-D 15 are inactive.
V
IH
V
IH
V
IH
V
IH
IH
V
IH
V
IH
V
IL
V
IL
V
IL
V
IL
V
IH
V
IL
V
IH
V
IH
V
IH
V
IH
XXVIHV
V
IH
V
IH
V
IH
V
IH
IH
V
IL
V
IL
V
IL
V
IL
IL
V
V
High ZData Out-Even
IL
High ZData Out-Odd
IH
XData Out-OddHigh Z
XData Out-OddData Out-Even
XHigh ZHigh Z
V
V
High ZData In-Even
IL
High ZData In-Odd
IH
XData In-OddHigh Z
XData In-OddData In-Even
XHigh ZHigh Z
3. Odd byte only access. In this x8 mode, D8-D15 contain the "odd"
byte (high byte) of the x16 word. D0-D7 are inactive. A0 = X.
4. Word access. In this mode D0-D7 contain the "eve n" byte while
D8-D15 contain the "odd" byte. A0 = X
Memory Card Program Routine
Byte Mode
BEGIN
SELECT
SECTOR
LOAD ADDRESS/DATA
OF 512 BYTES
WAIT FOR A
MAX IMUM OF 10 ms
SECTOR
PROGRAM COMPLETE
INTERLEAVING LOW
256 BYTES AND
HIGH 256 BYTES
Memory Card Program Routine
Word Mode
BEGIN
SELECT
SECTOR
LOAD ADDRESS/DA TA
OF 256 WORDS
WAIT FOR A
MAX I MUM OF 10 ms
SECTOR
PROG RAM COMPLE TE
LOWA NDHIG HBYTES
SIMULT A NEOUSLY
7
Page 8
Attribute Memory Operations
X = Don’t Care, where Don’t Care is either VIL or VIH levels.
Note:1. Byte access - Even. In this x8 mode, D0-D7 contain the "even" byte (low byte) of the x16 word. D8-D15 are inactive.
V
IL
IL
IL
IL
IL
V
IH
VIHV
VILV
VILV
V
IL
IL
IH
IL
V
IH
V
IH
V
IH
V
IH
XXVIHV
V
IL
V
IL
V
IL
V
IL
IL
V
V
High ZData In-Even
IL
High ZNot Valid
IH
XNot ValidHigh Z
XNot ValidData In-Even
XHigh ZHigh Z
8AT5FC004
Page 9
AT5FC004
D.C. Characteristics, Byte-Wide Operation
SymbolParameterConditionMinTypMaxUnits
= VCC Max,
V
I
LI
I
LO
I
SB
I
CC1
Input LeakageCurrent
Output Leakage Current
VCC Standby Current
(1)
V
Active Read Current
CC
CC
V
= VCC or V
IN
V
= VCC Max,
CC
V
= VCC or V
OUT
= VCC Max,
V
CC
SS
CE = VCC ± 0.2 V
= VCC Max, CE = VIL,
V
CC
OE = VIH, I
OUT
= 0 mA,
at 5 MHz
SS
1.0±20µA
1.020µA
0.51.0mA
2040mA
I
CC2
V
IL
V
IH
V
OL
V
OH
Notes: 1. One Flash device active, 7 in standby.
V
Active Write Current
CC
Input Low Voltage0.8V
Input High Voltage2.4V
Output Low VoltageIOL = 3.2 mA0.40V
Output High VoltageIOH = -2.0 mA3.8V
CE = VIL,WE = VIL,
Programming in Progre ss
2040mA
D.C. Characteristics, Word-Wide Operation
SymbolParameterConditionMinTypMaxUnits
= VCC Max,
V
I
LI
I
LO
I
SB
I
CC1
Input LeakageCurrent
Output Leakage Current
VCC Standby Current
(1)
V
Active Read Current
CC
CC
V
= VCC or V
IN
= VCC Max,
V
CC
V
= VCC or V
OUT
= VCC Max,
V
CC
SS
CE = VCC ± 0.2 V
= VCC Max, CE = VIL,
V
CC
OE = VIH, I
OUT
= 0 mA,
at 5 MHz
SS
1.0±20µA
1.020µA
0.51.0mA
4080mA
I
CC2
V
IL
V
IH
V
OL
V
OH
Notes: 1. Two Flash devices active, 6 in standby.
V
Active Write Current
CC
Input Low Voltage0.8V
Input High Voltage2.4V
Output Low VoltageIOL = 3.2 mA0.40V
Output High VoltageIOH = -2.0 mA3.8V
CE = VIL, WE = VIL,
Programming in Progre ss
4080mA
9
Page 10
A.C. Read Characteristics
Symbol ParameterMinMaxUnits
t
RC
t
CE
t
ACC
t
OE
t
Lz
t
DF
t
OLZ
t
DF
t
OH
t
WC
Read Cycle Time200ns
Chip Enable Access Ti me200ns
Address Access Time200ns
Output Enable Access Time100ns
Chip Enable to Output in Low Z5ns
Chip Disable to Output in High Z60ns
Output Enable to Output in Low Z5ns
Output Disable to Output in High Z60ns
Output Hold Time from First of Address, CE, or OE Change5ns
Write Recovery Time Before Read10ms
Input test Waveforms and
Measurement Level
3.0V
AC
DRIVING
LEVELS
0.0V
tR, tF < 5 ns
1.5V
AC
MEASUREMENT
LEVEL
Output Test Load
5.0V
1.8K
1.3K
OUTPUT
PIN
100pF
A.C. Read Waveforms
POWER-UP,
STANDBY
ADDRESSADDRESSES STABLE
CE
OE
WE
DATA
5.0 V
VCC
0V
(1)
t
WC
DEVICE AND
ADDRESS
SELECTION
t
CE
t
OLZ
t
LZ
t
ACC
Note:
1.
CE refers to CE
, and/or CE
1
2
OUTPUT
ENABLED
t
OE
t
RC
DATA
VALID
t
OUTPUT VALID
OH
STANDBY,
POWER-DOWN
t
DF
t
DF
HIGH Z
10AT5FC004
Page 11
AT5FC004
Write Cycle Characteristics
SymbolParameterMinMaxUnits
t
WC
t
AS
t
AH
t
DS
t
DH
t
WP
t
BLC
t
WPH
Write Cycle Time10ms
Address Set-up Time10ns
Address Hold Time60ns
Data Set-up Time60ns
Data Hold Time10ns
Write Pulse Width 100ns
Byte Load Cycle Time150µs
Write Pulse Width High100ns
A.C. Write Waveforms (Byte Mode)
OE
CE
2
CE
1
WE
A0
A1-A8
A9-A19
DATA
Notes:
1. A20 and A21 specify the pair of AT29C040A devices to be
written, while A0 controls the selection of even an d odd bytes.
A0, A20, and A21 must be valid throughout the entire
pulse.
2. A9 through A19 must specify the sector address during each high
to low transition of
t
AS
WE (or CE).
BYTE
ADDRESS
SECTOR
ADDRESS
BYTE 0BYTE 1BYTE 510BYTE 2BYTE 511
t
WP
t
AH
t
t
DS
WE low
DH
t
WPH
t
BLC
t
WC
3.
OE must be high when WE and CE are both low.
All bytes that are not loaded within the sector being pro-
4.
grammed will be indeterminate.
11
Page 12
A.C. Write Waveforms (Word Mode)
OE
CE
1,2
WE
A1-A8
t
AS
BYTE
ADDRESS
t
WP
t
AH
t
DH
t
WPH
t
BLC
t
WC
A9-A19
SECTOR
ADDRESS
t
DS
DATA
WORD 0WORD 1
1. A20 and A21 specify the pair of AT29C040A devices to be written; they must be valid throughout the entire
WE low pulse. A0 is
don’t care.
2. A9 through A19 must specify the sector address during each high
to low transition of
WE (or CE).
WORD 2
WORD254
3.
OE must be high when WE and CE are both low.
4.
All bytes that are not loaded with in the se ct or bein g pro -
WORD255
grammed will be indeterminate.
12AT5FC004
Page 13
AT5FC004
Software Data Protected Programming Algorithm
Device0123
Data
Address
Data
Address
Data
Address
Writes
Enabled
Note:1. Load 3 bytes to corresponding Flash chip segment individually to enable software data protection.
AA
00AAAA
55
005554
A0
00AAAA
Write
Bytes
AA
00AAAB
55
005555
A0
00AAAB
Write
Bytes
(1)
AA
10AAAA
55
105554
A0
10AAAA
Write
Bytes
AA
10AAAB
55
105555
A0
10AAAB
Write
Bytes
13
Page 14
Software Data Protected Disable Algorithm
Device0123
(1)
Data
Address
Data
Address
Data
Address
Data
Address
Data
Address
Data
Address
Writes
Enabled
Note:1. Load 6 bytes to corresponding Flash chip segment individually to disable software data protection.
AA
00AAAA
55
005554
80
00AAAA
AA
00AAAA
55
005554
20
00AAAA
Write
Bytes
AA
00AAAB
55
005555
80
00AAAB
AA
00AAAB
55
005555
20
00AAAB
Write
Bytes
AA
10AAAA
55
105554
80
10AAAA
AA
10AAAA
55
105554
20
10AAAA
Write
Bytes
AA
10AAAB
55
105555
80
10AAAB
AA
10AAAB
55
105555
20
10AAAB
Write
Bytes
14AT5FC004
Page 15
AT5FC004
Ordering Information
t
ACC
(ns)
200AT5FC004-20PCMCIA Type 1Commercial
Ordering CodePackageOperation Range
(0°C to 70°C)
Packaging Information
PCMCIA, Type 1 PC Memory Card
Dimensions in millimeters
85.6 0.2 mm
10.0 MIN. (mm)
10.0 MIN. (mm)
54.0 0.1 mm
3.3 0.1 mm
FRONT SIDE
34
68
BACK SIDE
CardWare may be trademarks of others.
1
35
15
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