Datasheet AT49F080, AT49F080T Datasheet (ATMEL)

Page 1
Features
Single Voltage Operation
– 5V Read – 5V Reprogramming
Fast Read Access Time - 90 ns
16K bytes Boot Block With Lockout
Fast Erase Cycle Time - 10 seconds
Byte-By-Byte Programming - 10 µs/Byte Typical
Hardware Data Protection
DAT A Polling For End Of Program Detection
Low Power Dissipation
– 50 mA Active Current – 100 µA CMOS Standby Current
Typical 10,000 Write Cycles
8-Megabit (1M x 8) 5-volt Only
Description
The AT49F080 is a 5-volt-only in-system Flash Memory device. Its 8-megabits of memory is organized as 1,024,576 words by 8-bits. Manufactured with Atm el’s advanced nonvolati le CMOS te ch nol ogy , the dev i ce offers access times to 90 ns wi th power dissipation of just 27 5 mW ove r the commer cial tem perat ure range . When the device is deselected, the CMOS standby current is less than 100 µA.
The device contains a user-enabled “boot block” protection feature. Two versions of the feature are available: the AT49F080 locates the boot block at lowest order addresses (“bottom b oot”) ; th e A T 49F08 0T lo ca tes it at h igh est or de r addre ss es ( “top boot”).
VCC CE A12 A13 A14 A15 A16 A17 A18 A19 NC NC NC NC WE OE RDY/BUSY I/O7 I/O6 I/O5 I/O4 VCC
(continued)
Pin Configurations
Pin Name Function
A0 - A19 Addresses CE OE Output Enable WE RESET RDY/BUSY Ready/Busy Outpu t I/O0 - I/O7 Data Inputs/Outputs NC No Connect
CBGA Top View
1
Chip Enable
Write Enable Reset
234567
RESET
A11 A10
I/O0 I/O1 I/O2
I/O3 GND GND
SOIC
1
NC
A9 A8 A7 A6 A5
A4 NC NC
A3
A2
A1
A0
44
2
43
3
42
4
41
5
40
6
39
7
38
8
37
9
36
10
35
11
34
12
33
13
32
14
31
15
30
16
29
17
28
18
27
19
26
20
25
21
24
22
23
Flash Memory
AT49F080 AT49F080T AT49F080/080T
TSOP Top VIew
A
A5
A8
A11
NC
A12
A15
B
A4
A7
A10
A9
I/O1
A0
I/O0
RST
NC I/O3 I/O2
VCC
CE VCC GND GND
C
A6
D
A3
E
A2
F
A1
A13 A14 I/O4 I/O6 I/O5
NC A16 I/O7
OE
RY/BY
A17 A18 A19
NC NC
WE
A19
A17 A15 A13
CE NC
A11
A9 A7
A5
A18 A16 A14 A12
VCC
RESET
A10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
A8
16
A6
18
19 A2
A4
20
Type 1
NC OE I/O7
I/O5 VCC
GND I/O2 I/O0 A1
A3
NC WE RDY/BUSY I/O6
I/O4 GND I/O3 I/O1 A0
0584B-A–8/97
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
2417
23
22
21
1
Page 2
To allow for simple in-system reprogrammability, the AT49F080 does not require high input voltages for pro­gramming. 5-volt-only commands determine the read and programming operat ion of t he de vice . Rea ding data out of the device is simi lar to r eadin g from an EPROM . Repr o­gramming the AT49F080 is performed by erasing the entire 8 megabits of memory and then programming on a byte-by­byte basis. The typical by te progra mming tim e is a fast 10 µs. The end of a p rogr am cy c le ca n be optionally detec ted by the DATA
polling feature. Once th e end of a byte pro-
Block Diagram
DATA INPUTS/OUTPUTS
V
CC
GND
OE
WE
CE
ADDRESS
INPUTS
OE, CE, AND WE
LOGIC
Y DECODER
X DECODER
BLOCK (16K BYTES)
gram cycle has be en dete cted, a n ew acce ss for a rea d or program can begin. The typical number of program and erase cycles is in excess of 10,000 cycles
The optional 16K bytes boot block section includes a repro­gramming write lock out feature to provide data integrity. The boot sector is designed to contain us er secure code, and when the featur e is en abled, the b oot se ctor is per ma­nently protected from being reprogrammed.
AT49F080TAT49F080
DATA INPUTS/OUTPUTS
I/O7 - I/O0
8
DATA LATCH
INPUT/OUTPUT
BUFFERS Y-GATING
FFFFFH FFFFFH
MAIN MEMORY
(1008K BYTES)
03FFFH
OPTIONAL BOOT
00000H
I/O7 - I/O0
8
DATA LATCH
INPUT/OUTPUT
BUFFERS Y-GATING
OPTIONAL BOOT
BLOCK (16K BYTES)
FC000H
MAIN MEMORY
(1008K BYTES)
00000H
Device Operation
READ:
When CE at the memory location determined by the add ress pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE line control gives designers flexibility in preventing bus con­tention.
ERASURE:
1024K bytes memory array ( or 1008K bytes if the boot block featured is used) must be erased. The erased state of the memory bits is a logical “1”. The entire device can be erased at on e time b y using a 6-byt e softw are code . The software chip erase code consists of 6-byte load com­mands to specific addr ess location s with a specific data pattern (please refer to the Chip Erase Cycle Waveforms).
After the software chip eras e has been ini tiated , the devi ce will internally time the er ase operatio n so that no external clocks are required. The maximum time needed to era se the whole chip is t been enabled, the data in the boot sector will not be erased.
BYTE PROGRA MMING:
erased, the device is programmed (to a logical “0 ”) on a
The AT49F080 is accessed like an EPROM.
and OE are low and WE is high, the da ta stored
or OE is high. This dual-
Before a byte can be reprogrammed, the
. If the boot block lock out feat ure has
EC
Once the memory array is
byte-by-byte basis. Please note that a data “0” cannot be programmed ba ck to a “1” ; only er ase op eration s can con ­vert “0”s to “1”s. Programming is accomplished via the internal device command register and is a 4 bus cycle oper­ation (please refer to the Com man d De fini ti ons ta ble ). The device will automatically generate the required internal pro­gram pulses.
The program cycle has addresses latched on the falling edge of WE latched on the rising edge of WE first. Programming is completed after the specified t
or CE, whichever occurs last, and the data
or CE, whichever occurs
BP
cycle time. The DATA polling feature may also be use d to indicate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT:
The device has one designated block that has a programming lockout feature. This feature prevents programming of data in the designated block onc e the featu re has been en able d. The size of the block is 16K bytes. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is update d. This fe ature do es not have to be acti­vated; the boot block 's usage as a write prote ct ed r e gio n i s
2
AT49F080/080T
Page 3
AT49F080/080T
optional to the user. The address range of the AT49F080 boot block is 00000H to 03FFFH while the address range of the AT49F080T boot block is FC000H to FFFFFH.
To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION:
method is available to determine if programming of the boot block section is l ocked out. W hen the device is in the so ft­ware product iden tification mode (see Soft ware Product Identification Entry and Exit sections) a read from address location 00002H will show if program ming the boot bloc k is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lock­out feature has been activated and the block cannot be programmed. The s oftwa re p ro duc t identification exit c ode should be used to return to standard operation.
BOOT BLOCK PROGRAMMING LOCKOUT OVER­RIDE:
The user can override the boot block programming lockout by taking the RESET this, protected boot block data can be altered through a chip erase, or byte programming. When the RESET brought back to TTL levels, the boot block programming lockout feature is again active.
PRODUCT IDENTIFICATION:
mode identifies the device and manufac turer as Atmel. It may be accessed by ha rdware or softwar e operatio n. The hardware operation mode can be used by an external pro­grammer to identify the correct programming algorithm for the Atmel product.
For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes.
DATA POLLING:
to indicate the end of a program cycle. Dur ing a program cycle an attempted read of the last byte loaded will result in the complement of the loa ded data on I/O7. Onc e the pro­gram cycle has been com pleted, true data is valid on all outputs and the next cycle may begin. DATA begin at any time during the program cycle.
The AT49F080 features DATA
pin to 12V ± 0.5V. By doing
The product identi fication
A software
pin is
polling
polling may
TOGGLE BIT:
provides another method for determining the end of a pro­gram or erase cycl e. Du ring a progr am o r er ase opera tion, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle.
RDY/BUSY
vides another method of detecting the end of a program or erase operation. RDY/BUSY the internal program and erase cycles and is released at the completion of the cycle. The open drain
connection allows fo r OR - tyi ng of sev eral devi ces to the same RDY/BUSY
RESET:
tem applications. When RESET device is in its sta nda rd ope ra tin g mo de. A lo w le vel on the RESET the outputs of the device in a high impedance state. If the RESET or erase operation, the operation may not be successful ly completed and the op eration wi ll have to be repeated after a high level is applied to the RESET is reasserted on the RESET read or standby mode, depending upon the state of the control inputs. By applying a 12V ± 0.5V input signal to the RESET even if the boot block lockout fea ture has been ena bled (see Boot Block Programming Lockout Override section).
HARDWARE DATA PROTECTION:
protect against inadvertent programs to the AT49F080 in the following ways: (a) V (typical), the program function is inhibited. (b) Program inhibit: holding any one of OE inhibits program cycles. (c) Noise filter: pulses of less than 15 ns (typical) on the WE gram cycle.
input halts the present de vice opera tion and puts
pin makes a high to low transition during a program
pin, the boot block array can be reprogrammed
In addition to DATA
:
An open drain READY/BUSY
line.
A RESET
input pin is provided to ease some sys-
pin, the device returns to the
sense: if VCC is below 3.8V
CC
or CE inputs will not initiate a pro-
polling, the AT49 F080
output pin pro-
is actively pulled low during
is at a l ogic high lev el, t he
pin. When a high level
Hardware features
low, CE high or WE high
3
Page 4
Command Definition (in Hex)
1st Bus
Command Sequence
Bus
Cycles
Cycle
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus
Cycle
Read 1 Addr D Chip Erase 6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10 Byte Program 4 555 5 AA 2AAA 55 5555 A0 Addr D
(2) (2)
(1)
6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 40
3 555 5 AA 2AAA 55 5555 F0 1 XXXX F0
Boot Block Lockout Product ID Entry 3 5555 AA 2AAA 55 5555 90 Product ID Exit Product ID Exit
Notes: 1. The 16K byte boot sector has the address range 00000H to 03FFFH for the AT49F080 and FC000H to FFFFFH for the
AT49F080T.
2. Either one of the Product ID Exit commands can be used.
OUT
IN
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
All Input Voltages (including NC Pins)
with Respect to Ground...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground............................-0.6V to V
V oltage on OE
with Respect to Ground...................................-0.6V to +13.5V
4
AT49F080/080T
+ 0.6V
CC
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam­age to the dev ice . This is a stress rating only an d functional operati on of the de vi ce at these or an y other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions f or exten ded periods ma y affect d evice reliability .
Page 5
AT49F080/080T
DC and AC Operating Range
AT49F080-90 AT49F080-12 AT49F080-15
Operating Temperature (Case)
V
Power Supply 5V ± 10% 5V ± 10% 5V
CC
Operating Modes
Mode CE OE WE RESET Ai I/O RDY/BUSY
Read V
(2)
Program Standby/Write
Inhibit
IL
V
IL
V
X
IH
Program Inhibit X X V Program Inhibit X V Output Disable X V RESET XXXV Product Identification
V
IL
Hardware
Software
(5)
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms. = 12.0V ± 0.5V
3. V
H
4. Manufacturer Code: 1FH
Device Code: 23H (AT49F080), 27H (AT49F080T)
5. See details under Software Product Identification Entry/Exit..
DC Characteristics
Symbol Parameter Condition Min Max Units
I
LI
I
LO
I
SB1
I
SB2
(1)
I
CC
V
IL
V
IH
V
OL
V
OH1
V
OH2
Note: 1. I
Input Load Current VIN = 0V to V Output Leakage Current V
VCC Standby Current CMOS CE = V
VCC Standby Current TTL CE = 2.0V to V V
Active Current f = 5 MHz; I
CC
Input Low Voltage 0.8 V Input High Voltage 2.0 V Output Low Voltage IOL = 2.1 mA 0.45 V Output High Voltage IOH = -400 µA2.4V Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V
in the erase mode is 90 mA.
CC
Com. 0°C - 70°C 0°C - 70°C 0°C - 70°C Ind. -40°C - 85°C -40°C - 85°C -40°C - 85°C
V
IL
V
IH
IL
IH
V
IL
V
IH
V
IL
(1)
XV
IH
XV XV
V
IH
V
IH
V
IH
IH
V
IH
IH
IH
IL
V
IH
A1 - A19 = VIL, A9 = VH,
A1 - A19 = VIL, A9 = VH,
A0 = VIL, A1 - A19 = V
A0 = VIH, A1 - A19 = V
= 0V to V
I/O
Ai D Ai D
OUT
IN
X High Z V
High Z V
X High Z
CC
CC
A0 = V
A0 = V
(3)
IL
(3)
IH
IL
IL
Manufacturer Code
Device Code
(4)
Manufacturer Code
Device Code
(4)
Com. 100
- 0.3V to V
CC
OUT
CC
CC
Ind. 300
= 0 mA 50 mA
±
10%
V
OH
V
OL
OH
V
OH
V
OH
OH
(4)
(4)
10 10
3mA
µ
A
µ
A
µ
A
µ
A
5
Page 6
AC Read Characteristics
OUTPUT
PIN
5.0V
100 pF
1.8K
1.3K
AT49F080-90 AT49F080-12 AT49F080-15
Symbol Parameter
t
ACC
(1)
t
CE
(2)
t
OE
(3)(4)
t
DF
t
OH
Address to Output Delay 90 120 150 ns CE to Output Delay 90 120 150 ns OE to Output De lay 0 40 0 50 0 70 ns CE or OE to Output Float 0 25 0 30 0 40 ns Output Hold from OE, CE or Address,
whichever occurre d first
AC Read Waveforms
ADDRESS
CE
OE
OUTPUT
UnitsMinMaxMinMaxMinMax
000ns
ADDRESS VALID
t
CE
t
OE
t
DF
t
ACC
HIGH Z
OUTPUT
VALID
t
OH
Notes: 1. CE may be delayed up to t
2. OE
may be delayed up to tCE - t
change without impact on t
- tCE after the address transition without impact on t
ACC
after the falling edge of CE without impact on tCE or by t
OE
.
ACC
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested
Input Test Waveforms and Measurement level
3.0V
AC
DRIVING
LEVELS
1.5V
AC MEASUREMENT LEVEL
0.0V
tR, tF < 5 ns
Pin Capacitance
(f = 1 MHz, T = 25 C)
Typ Max Units Conditions
C
IN
C
OUT
Note: 1. Thi s parameter is characterized and is not 100% tested
6
AT49F080/080T
46 pF V 812 pF V
.
ACC
- tOE after an address
ACC
Output Test Load
= 0V
IN
= 0V
OUT
Page 7
AT49F080/080T
AC Byte Load Characteristics
Symbol Parameter Min Max Units
tAS, t
OES
t
AH
t
CS
t
CH
t
WP
t
DS
tDH, t
OEH
t
WPH
AC Byte Load Waveforms
WE Controlled
Address, OE Set-up Time 0 ns Address Hold Time 50 ns Chip Select Set-up Time 0 ns Chip Select Hold Time 0 ns Write Pulse Width (WE or CE)90ns Data Set-up Time 50 ns Data, OE Hold Time 0 ns Write Pulse Width High 90 ns
OE
CE
Controlled
ADDRESS
CE
WE
DATA IN
OE
ADDRESS
WE
CE
DATA IN
t
t
t
t
AS
CS
AS
CS
t
OES
t
OES
t
t
AH
AH
t
t
t
DS
t
DS
WP
WP
t
OEH
t
CH
t
WPH
t
DH
t
OEH
t
CH
t
WPH
t
DH
7
Page 8
Program Cycle Characteristics
Symbol Parameter Min Typ Max Units
t
BP
t
AS
t
AH
t
DS
t
DH
t
WP
t
WPH
t
EC
Byte Programming Time 10 50 µs Address Set-up Time 0 ns Address Hold Time 50 ns Data Set-up Time 50 ns Data Hold Time 0 ns Write Pulse Width 90 ns Write Pulse Width High 90 ns Erase Cycle Time 10 seconds
Program Cycle Waveforms
PROGRAM CYCLE
OE
CE
WE
t
AS
A0-A19
DATA
5555 2AAA 5555
AA 55 A0
Chip Erase Cycle Waveforms
OE
CE
t
WE
t
AS
A0-A19
DATA
5555 2AAA 5555
t
AA 55 80
BYTE 0 BYTE 1 BYTE 2 BYTE 3 BYTE 4 BYTE 5
WP
t
AH
DS
t
WP
t
t
DS
AH
t
WPH
t
DH
t
WPH
t
DH
ADDRESS
INPUT
DATA
5555 2AAA 5555
AA 55 10
t
BP
t
EC
Note: OE must be high only when WE and CE are both low.
8
AT49F080/080T
Page 9
AT49F080/080T
Data Poll ing Characteristics
Symbol Parameter Min Typ Max Units
t
DH
t
OEH
t
OE
t
WR
Data Hold Time 10 ns OE Hold Time 10 ns OE to Output Delay Write Recovery Time 0 ns
(1)
(2)
Notes: 1. These parameters are characterized and not 100% tested
2. See tOE spec in AC Read Characteristics.
Data Polling Waveforms
WE
CE
t
OEH
OE
I/O7
A0-A19
t
DH
t
OE
HIGH Z
An
An An AnAn
t
WR
ns
Toggle Bit Characteristics
Symbol Parameter Min Typ Max Units
t
DH
t
OEH
t
OE
t
OEHP
t
WR
Data Hold Time 10 ns OE Hold Time 10 ns OE to Output Delay OE High Pulse 150 ns Write Recovery Time 0 ns
(1)
(2)
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
WE
CE
OE
I/O6
(1)(2)(3)
t
OEH
t
DH
t
OEHP
t
OE
HIGH Z
t
WR
Toggle Bit Waveforms
ns
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The t
input(s).
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
specification must be met by the toggling
OEHP
9
Page 10
Software Product
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 40
TO
ADDRESS 5555
PAUSE 1 second
(2)
Identification Entry
LOAD DATA AA ADDRESS 5555
LOAD DATA 55
ADDRESS 2AAA
LOAD DATA 90
ADDRESS 5555
ENTER PRODUCT
IDENTIFICATION
MODE
(1)
TO
TO
TO
(2)(3)(5)
Boot Block Lockout Feature Enable Algorithm
(1)
Software Product Identification Exit
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA F0
Notes: 1. Data Format: I/O7 - I/O0 (Hex);
TO
ADDRESS 5555
EXIT PRODUCT
IDENTIFICATION
(4)
MODE
2. A1 - A19 = V
3. The device does not remain in identificati on mode if
4. The device returns to standard operation mode.
5. Manufacturers Code: 1FH
Address Format: A14 - A0 (Hex).
Manufacture Code is read for A0 = V Device Code is read for A0 = V
powered down.
Device Code: 23H (AT49F080), 27H (AT49F080T)
(1)
OR
.
IL
LOAD DATA F0
TO
ANY ADDRESS
EXIT PRODUCT
IDENTIFICATION
.
IH
MODE
;
IL
(4)
Notes: 1. Data Format: I/07 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Boot block lockout feature enabled.
10
AT49F080/080T
Page 11
Order ing Informat ion
(mA)
I
t
ACC
(ns)
90 50 0.1 AT49F080-90CC
CC
Ordering Code Package Operation RangeActive Standby
AT49F080-90RC AT49F080-90TC
42C2 44R 40T
AT49F080/080T
Commercial
(0° to 70°C)
50 0.3 AT49F080-90CI
AT49F080-90RI AT49F080-90TI
120 50 0.1 AT49F080-12CC
AT49F080-12RC AT49F080-12TC
50 0.3 AT49F080-12CI
AT49F080-12RI AT49F080-12TI
150 50 0.1 AT49F080-15CC
AT49F080-15RC AT49F080-15TC
50 0.3 AT49F080-15TI
AT49F080-15TI AT49F080-15TI
42C2 44R 40T
42C2 44R 40T
42C2 44R 40T
42C2 44R 40T
42C2 44R 40T
Industrial
(-40° to 85°C)
Commercial
(0° to 70°C)
Industrial
(-40° to 85°C)
Commercial
(0° to 70°C)
Industrial
(-40° to 85°C)
(continued)
Pakage Type
42C2 42-Ball, Plastic Chip-Size Ball Grid Array Package (CBGA) 8 x 14 mm 44R 44-Lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 40T 40-Lead, Thin Small Outline Package (TSOP)
11
Page 12
Order ing Informat ion
(mA)
I
t
ACC
(ns)
90 50 0.1 AT49F080T-90CC
CC
Ordering Code Package Operation RangeActive Standby
AT49F080T-90RC AT49F080T-90TC
42C2 44R 40T
Commercial
(0° to 70°C)
50 0.3 AT49F080T-90CI
AT49F080T-90RI AT49F080T-90TI
120 50 0.1 AT49F080T-12CC
AT49F080T-12RC AT49F080T-12TC
50 0.3 AT49F080T-12CI
AT49F080T-12RI AT49F080T-12TI
150 50 0.1 AT49F080T-15CC
AT49F080T-15RC AT49F080T-15TC
50 0.3 AT49F080T-15CI
AT49F080T-15RI AT49F080T-15TI
42C2 44R 40T
42C2 44R 40T
42C2 44R 40T
42C2 44R 40T
42C2 44R 40T
Industrial
(-40° to 85°C)
Commercial
(0° to 70°C)
Industrial
(-40° to 85°C)
Commercial
(0° to 70°C)
Industrial
(-40° to 85°C)
Pakage Type
42C2 42-Ball, Plastic Chip-Size Ball Grid Array Package (CBGA) 8 x 14 mm 44R 44-Lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 40T 40-Lead, Thin Small Outline Package (TSOP)
12
AT49F080/080T
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