Datasheet AT49F002NT-70PC, AT49F002NT-70JI, AT49F002NT-70JC, AT49F002NT-55TI, AT49F002NT-55TC Datasheet (ATMEL)

Features

•

Single Voltage Operation

– 5V Read
– 5V Reprogramming

•

Fast Read Access Time - 55 ns

•

Internal Program Control and Timer

•

Sector Architecture

– One 16K Byte Boot Block with Programming Lockout
– Two 8K Byte Parameter Blocks
– Two Main Memory Blocks (96K, 128K) Bytes

•

Fast Erase Cycle Time - 10 seconds

•

Byte By Byte Programming - 10

•

Hardware Data Protection

•

DAT A Polling For End Of Program Detection

•

Low Power Dissipation

– 50 mA Active Current

µµµµ

– 100

•

Typical 10,000 Write Cycles

A CMOS Standby Current

µµµµ

s/Byte Typical

2-Megabit
(256K x 8)
5-volt Only
CMOS Flash

Description

The AT49F002(N)T is a 5-volt-on ly in- system r eprogramma ble Fl ash Memo ry. Its 2
megabits of memory is organ ized as 262,144 words by 8 bits. Manufactured with
Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 55
ns with power dissipation of just 275 mW over the commercial temperature range.

(continued)

Pin Configurations

Pin Name Function

A0 - A17 Addresses
CE
OE
WE Write Enable
RESET
I/O0 - I/O7 Data Inputs/Outputs
NC No Connect

5

A7

6

A6

7

A5

8

A4

9

A3

10

A2

11

A1

12

A0

13

I/O0

*Note: This pin is a NC on the AT49F002NT.

Chip Enable
Output Enable

RESET

PLCC Top View

A12

A15

A16

RESET *

VCCWEA17

432

1

323130

14151617181920

I/O1

I/O2

I/O3

I/O4

I/O5

GND

29
28
27
26
25
24
23
22
21

I/O6

A14
A13
A8
A9
A11
OE
A10
CE
I/O7

A11

A13
A14
A17

VCC

* RESET

A16
A15
A12

WE

1
2

A9

3

A8

4
5
6
7
8
9
10
11
12
13

A7

14

A6

15

A5

16

A4

DIP Top View

A16
A15
A12

I/O0
I/O1
I/O2

GND

1
2
3
4
5

A7

6

A6

7

A5

8

A4

9

A3

10

A2

11

A1

12

A0

13
14
15
16

* RESET

TSOP Top View

Type 1

32

VCC

31

WE

30

A17

29

A14

28

A13

27

A8

26

A9

25

A11

24

OE

23

A10

22

CE

21

I/O7

20

I/O6

19

I/O5

18

I/O4

17

I/O3

OE

32

A10

31

CE

30

I/O7

29

I/O6

28

I/O5

27

I/O4

26

I/O3

25

GND

24

I/O2

23

I/O1

22

I/O0

21

A0

20

A1

19

A2

18

A3

17

Memory

AT49F002T
AT49F002NT

0920B-B–12/97

1

When the device is dese le cted, the CMOS s tandby curren t
is less than 100 µA . For th e AT 49F00 2NT pin 1 for th e DIP
and PLCC packages and pin 9 for the TSOP package are
no connect pins.

To allow for simple in-system reprogrammability, the
AT49F002(N)T does not require high input voltages for pro­gramming. Five-vo lt-only comma nds determin e the read
and programming operation of the device. Rea ding data
out of the device is similar to reading from an EPROM; it
has standard CE

, OE, and WE inputs to avoid bus conten­tion. Reprogramming the AT49F002(N)T is performed by
erasing a block of data and then programming on a byte by
byte basis. The byte programming time is a fast 50 µs. The
end of a program cycle can be optionally detected by the

polling feature. Once the end of a byte program

DATA
cycle has been detected, a new access for a read or pro­gram can begin. The typ ical numb er of prog ram and era se
cycles is in excess of 10,000 cycles.

Block Diagram

V

CC

GND

OE

WE

CE

RESET

ADDRESS

INPUTS

CONTROL

LOGIC

Y DECODER

X DECODER

The device is erased by executing the er ase command
sequence; the device internally controls the erase opera­tions. There are two 8K byte parameter block sect ions and
two main memory blocks.

The device has the capability to protect the data in the boot
block; this feature is enabled by a command sequence.
The 16K-byte boot block section includes a reprogramming
lock out feature to pr ovi de data int egrity. The boot sector is
designed to contai n user secu re code, and whe n the fea­ture is enabled, the boot sector is protected from being
reprogrammed.

In the AT49F002NT, once the boot block progr amming
lockout featu re is enabl ed, the co ntents o f the boot bl ock
are permanent and cannot be changed. In the AT49F002T,
once the boot block programming lockout feature is
enabled, the contents of the boot blo ck ca nnot be change d
with input voltage levels of 5.5 volts or less.

DATA INPUTS/OUTPUTS

I/O7 - I/O0

8

INPUT/OUTPUT

BUFFERS

PROGRAM

DATA LATCHES

Y-GATING

BOOT BLOCK

(16K BYTES)

PARAMETER

BLOCK 1

(8K BYTES)

PARAMETER

BLOCK 2

(8K BYTES)

MAIN MEMORY

BLOCK 1

(96K BYTES)

MAIN MEMORY

BLOCK 2

(128K BYTES)

3FFFF

3C000
3BFFF

3A000
39FFF

38000
37FFF

20000
1FFFF

00000

2

AT49F002(N)T

Device Operation

READ:

When CE
at the memory location determined by the address pins is
asserted on the outputs . The outputs ar e put in the high
impedance state whenever CE
control gives designers flexibility in preventing bus conten­tion.

COMMAND SEQUENCES:

ered on it will be reset to the read or standby mode
depending upon the state of the control line inputs. In order
to perform other device functions, a series of command
sequences are entered into the device. The command
sequences are shown in the Command Definitions table.
The command sequences are written by applying a low
pulse on the WE
tively) and OE
edge of CE
latched by the first rising ed ge of CE
microprocessor write timings are used. T he address loc a­tions used in the command sequences are not affected by
entering the command sequences.

RESET:

tem application s. When RESET
device is in its st anda r d ope r atin g mo de. A low level on the
RESET
the outputs of the device in a high impedence state. If the
RESET
or erase operation, the operation may not be sucessfully
completed and the ope ration will have to be repeate d after
a high level is applied to the RESET
is reasserted on the RESET
read or standby mode, depending upon the state of the
control inputs. By appl ying a 12V ± 0.5V inp ut signal to the
RESET
even if the boot block lockout feature has been enabled
(see Boot Block Programming Lockout Override section).
The RESET feature is not available for the AT49F002NT.

0ERASURE:

main memory block or parameter block which contains the
byte must be erased. The erased state of the memory bits
is a logical “1”. The entire device can be erased at one time
by using a 6-byte software code. The software chip erase
code consists of 6-byte load commands to specific address
locations with a specific data pattern (please refer to the
Chip Erase Cycle Waveforms).

After the software chip erase has been ini tiated , the devi ce
will internally time the eras e operatio n so that no ex ternal
clocks are required. The maximum time needed to erase
the whole chip is t
been enabled, the data in the boot sector will not be
erased.

The AT49F002(N)T is access ed like an EPROM .

and OE are low and WE is high, the da ta stor ed

or OE is high. This dual-line

When the device is first pow-

or CE input with CE or WE low ( respec-

high. The addre ss is latche d on the fall ing

or WE, whichever occurs last. The data is

or WE. Standard

A RESET

input halts the present device operation and puts
pin makes a high to low transition during a program

pin, the boot block array can be reprogrammed

input pin is prov ided to ea se som e sys-

is at a logic high le vel, the

pin. When a high level

pin, the device returns to the

Before a byte can be reprogrammed, the

. If the boot block lockout feature has

EC

AT49F002(N)T

CHIP ERASE:

the Chip Erase function will erase Parameter Block 1,
Parameter Block 2, Mai n Memo ry B lock 1, and Main Mem­ory Block 2 but not the boot block. If the Boot Block Lockout
has not been enabled, the Chip Erase function will erase
the entire chip. After the full chip erase the device will
return back to read mode. A ny com man d dur in g ch ip era se
will be ignored.

SECTOR ERASE

device is organized into sectors that can be individually
erased. There are two 8K-byte parameter block sections
and two main memory blocks. The 8K-byte parameter
block sections can be independently erased and repro­grammed. The two main memory sections are designed to
be used as alternative memory sectors. That is, whenever
one of the blocks has been erased and reprogrammed, the
other block should be erased and reprogramm ed before
the first block is again erase d. The Sec tor Eras e command
is a six bus cycle operation. The sector address is latched
on the falling WE
input command is latch ed at the rising edge of WE
sector erase starts after the rising edge of WE
cycle. The erase op eration is in ternally con trolled; it wil l
automatically time to completion.

BYTE PROGRAMMING:

erased, the device is programmed (to a logical “0”) on a
byte-by-byte basi s. Please not e that a data “0” ca nnot be
programmed ba ck to a “1”; only era se oper ation s can con ­vert “0”s to “1 ”s. Programmi ng is accom plished via the
internal device command register and is a 4 bus cycle oper­ation (plea se refer to the Co mmand Defini tions ta ble). The
device will automatically generate the required internal pro­gram pulses.

The program cycle has addresses latched on the falling
edge of WE
latched on the rising edge of WE
first. Programming is completed after the specified t
cycle time. The DATA polling feature may also be used to
indicate the end of a program cycle.

BOOT BLOCK PROGRAMMING LOCKOUT:

has one designated block that has a programming lockout
feature. This feature prevents programmin g of data in the
designated block once the feature has been enabled. The
size of the block is 16K bytes. This block, referred to as the
boot block, can contain secure code that is used to bring up
the system. Enablin g the l ockout fe ature will allow t he boot
code to stay in the device while data in the rest of the
device is updated. This feature does not have to be acti­vated; the boot block’ s u sa ge a s a write protected region is
optional to the user. The address range of the boot block is
3C000 to 3FFFF.

If the boot block lockout has been enabled,

: As an alternative to a full chip erase, the

edge of the sixth cycle while the 30H data

. The

of the sixth

Once the memory array is

or CE, whichever occurs last, and the data

or CE, whichever occurs

BP

The device

3

Once the feature is enabled , the data i n the boot b lock can
no longer be erased or programmed. Data in the main
memory block can still be changed through the regular pro­gramming method. To activate the lockout feature, a series
of six program commands to specific addresses with spe­cific data must be performed. Please refer to the Command
Definitions table.

BOOT BLOCK LOCKOUT DETECTION:

method is available to determine if programming of the boot
block section is locked out. When the device is in the soft­ware product iden tification mode (see Soft ware Produc t
Identification Entry and Exit sections) a read from address
location 00002H will sho w if progra mming th e boot blo ck is
locked out. If the d ata on I /O 0 i s low, the boo t bl oc k ca n be
programmed; if the data on I/O0 is high, the program lock­out feature has been activated and the block cannot be
programmed. The software product identification code
should be used to return to standard operation.

BOOT BLOCK PROGRAMMING LOCKOUT OVERRIDE:

The user can override the boot block programming lockout
by taking the RESET
tected boot block data can be altered through a chip erase,
sector erase or word programming. When the RESET
brought back to TTL leve ls the boo t block pr ogramming
lockout feature is again active. This fe ature is not av aila ble
on the AT49F002NT.

PRODUCT IDENTIFICATION:

mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware oper ation mode can be used by an exte rnal pro-

pin to 12 volts. By doing this, pro-

The product identification

A software

pin is

grammer to identify the correct programm ing algoithm for
the Atmel product.

For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.

DATA POLLING:

ing to indicate the end of a program cycle. During a pro­gram cycle an attempted read of the last byte loaded will
result in the c omple ment of t he load ed data on I/O7 . Once
the program cycle has been completed, true data is valid
on all outputs and the next cycle may begin. DATA
may begin at any time during the program cycle.

TOGGLE BIT:

AT49F002(N)T provides another method for determining
the end of a program or erase cycle. Dur ing a program or
erase operation, successive attempts to read data from the
device will result in I/O6 toggling between one and zero.
Once the program cycle has completed, I/O6 will stop tog­gling and valid data will be read. Examining the togg le bit
may begin at any time during a program cycle.

HARDWARE DATA PROTECTION:

protect against i nad ve rtent programs to the AT49F002(N)T
in the following ways: (a) V
(typical), the program function is inhibited. (b) Program
inhibit: holding any one of OE
inhibits program cycles. (c) Noise filter: pulses of less than
15 ns (typical) on the WE
gram cycle.

The AT49F002(N)T features DATA

In addition to DATA

sense: if VCC is below 3.8V

CC

low, CE high or WE high

or CE inputs will not i ni t ia t e a pro-

polling the

Hardware features

poll-

polling

4

AT49F002(N)T

AT49F002(N)T

Cycle

(1)

OUT

2nd Bus

Cycle

3rd Bus

Cycle

4th Bus

Cycle

5th Bus

Cycle

IN

6th Bus

Cycle

(4)

Command Definition (in Hex)

1st Bus

Command
Sequence

Read 1 Addr D
Chip Erase 6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10
Sector Erase 6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 SA
Byte Program 4 5555 AA 2AAA 55 5555 A0 Addr D
Boot Block Lockout
Product ID Entry 3 5555 AA 2AAA 55 5555 90
Product ID Exit
Product ID Exit

Notes: 1. The DATA FORMAT in each bus cycle is as follows: I/O7 - I/O0 (Hex)

2. The 16K byte boot sector has the address range 3C000H to 3FFFFH.

3. Either one of the Product ID Exit commands can be used.

4. SA = sector addresses:

(3)
(3)

SA = 3C000 to 3FFFF for BOOT BLOCK
If the boot block is not locked out, this command will erase - BOOT BLOCK, PB1, PB2 and MMB1
If the boot block is locked out, nothing will happen and the device goes back to the read mode in 100 ns
SA = 3A000 to 3BFFF for PARAMETER BLOCK 1
SA = 38000 to 39FFF for PARAMETER BLOCK 2
SA = 20000 to 37FFF for MAIN MEMORY ARRAY BLOCK 1
If the boot block is not locked out, this command will erase - BOOT BLOCK, PB1, PB2 and MMB1
If the boot block is locked out, this command will erase - PB1, PB2 and MMB1
SA = 00000 to IFFFF for MAIN MEMORY ARRAY BLOCK 2

(2)

Bus

Cycles

6 5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 40

3 5555 AA 2AAA 55 5555 F0
1 XXXX F0

Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data

30

Absolute Maximum Ratings*

Temperature Under Bias................................ -55°C to +125°C

Storage Temperature..................................... -65°C to +150°C

All Input Voltages
(including NC Pins)

with Respect to Ground...................................-0.6V to +6.25V

All Output Voltages

with Respect to Ground............................-0.6V to V

Voltage on OE

with Respect to Ground...................................-0.6V to +13.5V

+ 0.6V

CC

*NOTICE: Stresses beyond those listed under “Absolute Maxi-

mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or any other c ondi­tions beyond those indicated in the operational sec­tions of this specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect device reliability.

5

DC and AC Operating Range

AT49F002(N)T-55 AT49F002(N)T-70

Operating
Temperature (Case)

V

Power Supply 5V ± 10% 5V ± 10%

CC

Com. 0°C - 70°C 0°C - 70°C
Ind. -40°C - 85°C -40°C - 85°C

Operating Modes

Mode CE OE WE RESET

Read V
Program/Erase

(2)

Standby/Write Inhibit V

V

V

IL

V

IL

X

IH

Program Inhibit X X V
Program Inhibit X V
Output Disable X V

V

IL

IH

(1)

IL

IH

IH

V

IL

XV

IH

XV

XV
Reset X X X V
Product Identi fi cation

Hardware

Software

V

(5)

V

IL

V

IL

IH

Notes: 1. X can be VIL or VIH.

2. Refer to AC Programming Waveforms.
= 12.0V ± 0.5V.

3. V

H

4. Manufacturer Code: 1FH, Device Code: 08H

5. See details under Software Product Identification Entry/Exit.

6. This pin is not available on the AT49F002NT.

DC Characteristics

(6)

V

IH

V

IH

IH

V

IH

IH

IH

IL

A1 - A17 = VIL, A9 = VH,

A1 - A17 = VIL, A9 = VH,

A0 = VIL, A1 - A17=V
A0 = VIH, A1 - A17=V

Ai

Ai D
Ai D

X High Z

X High Z

(3)

A0 = V

IL

(3)

A0 = V

IH

IL

IL

I/O

OUT

IN

High Z

Manufacturer Code

Device Code

(4)

Manufacturer Code
Device Code

(4)

(4)

(4)

Symbol Parameter Condition Min Max Units

I

LI

I

LO

Input Load Current VIN = 0V to V
Output Leakage Current V

= 0V to V

I/O

CC

CC

10
10

Com. 100

I

SB1

I

SB2

(1)

I

CC

V

IL

V

IH

V

OL

V

OH1

V

OH2

VCC Standby Current CMOS CE = V

VCC Standby Current TTL CE = 2.0V to V
V

Active Current f = 5 MHz; I

CC

- 0.3V to V

CC

OUT

CC

CC

Ind. 300

= 0 mA 50 mA

3mA

Input Low Voltage 0.8 V
Input High Voltage 2.0 V
Output Low Voltage IOL = 2.1 mA .45 V
Output High Voltage IOH = -400 µA2.4V
Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V

Note: 1. In the erase mode, ICC is 90 mA.

6

AT49F002(N)T

µ

A

µ

A

µ

A

µ

A

AC Read Characteristics

t

ACC

t

CE

t

OE

t

DF

t

OH

(1)

(2)

(3)(4)

Address to Output Delay 55 70 ns
CE to Output Delay 55 70 ns
OE to Output Delay 0 30 0 35 ns
CE or OE to Output Float 0 25 0 25 ns
Output Hold from OE, CE or Address,

whichever occurred first

AT49F002(N)T

AT49F002(N)T-55 AT49F002(N)T-70

Min Max Min Max

00 ns

UnitsSymbol Parameter

AC Read Wavef orms

Notes: 1. CE may be delayed up to t

2. OE may be delayed up to tCE - t

change without impact on t

3. t

is specified from OE or CE whichever occurs first (CL = 5 pF).

DF

(1)(2)(3)(4)

ADDRESS

CE

OE

OUTPUT

- tCE after the address transition without impact on t

ACC

OE

.

ACC

ADDRESS VALID

t

CE

t

OE

t

ACC

HIGH Z

after the falling edge of CE without impact on tCE or by t

4. This parameter is characterized and is not 100% tested.

Input Test Waveform and Measurement Level

OUTPUT

VALID

t

DF

t

OH

.

ACC

ACC

Output Loa d Test

- tOE after an address

tR, tF < 5 ns

Pin Capacitance

(f = 1 MHz, T = 25°C)

C

IN

C

OUT

Note: 1. This parameter is characterized and is not 100% tested.

(1)

Typ Max Units Conditions

46 pF V
812 pF V

IN

OUT

= 0V

= 0V

7

AC Byte Load Characteristics

Symbol Parameter Min Max Units

tAS, t

OES

t

AH

t

CS

t

CH

t

WP

t

DS

tDH, t

OEH

t

WPH

Address, OE Set-up Time 0 ns
Address Hold Time 50 ns
Chip Select Set-up Time 0 ns
Chip Select Hold Time 0 ns
Write Pulse Width (WE or CE)90ns
Data Set-up Time 50 ns
Data, OE Hold Time
Write Pulse Width High

0ns

90 ns

AC Byte Load Wa veforms

WE Controlled

CE Controlled

OE

ADDRESS

CE

WE

DATA IN

OE

ADDRESS

WE

t

OES

t

t

t

t

AS

CS

OES

AS

t

OEH

t

AH

t

WP

t

DS

t

AH

t

t

OEH

t

CH

CH

t

t

DH

WPH

t

CS

CE

t

WPH

t

WP

t

DS

t

DH

DATA IN

8

AT49F002(N)T

AT49F002(N)T

Program Cycle Characteristics

Symbol Parameter Min Typ Max Units

t

BP

t

AS

t

AH

t

DS

t

DH

t

WP

t

WPH

t

EC

Program Cycle Waveforms

Byte Programming Time 10 50 µs
Address Set-up Time 0 ns
Address Hold Time 50 ns
Data Set-up Time 50 ns
Data Hold Time 0 ns
Write Pulse Width 90 ns
Write Pulse Width High 90 ns
Erase Cycle Time 10 seconds

Sector or Chip Erase Cycle Waveforms

(1)

OE

CE

t

WP

WE

AO - A17

DATA

t

AS

t

AH

5555

BYTE 0

t

DH

2AAA 2AAA

t

DS

AA

55 55

BYTE 1 BYTE 2

Notes: 1. OE must be high only when WE and CE are both low.

2. For chip erase, the address should be 5555. For sector erase, the address depends on what sector is to be erased. (See

note 4 under command definitions.)

3. For chip erase, the data should be 10H, and for sector erase, the data should be 30H.

t

WPH

5555

5555

80

AA

BYTE 3

BYTE 4

Note 2

Note 3

BYTE 5

t

EC

9

Data Polling Characteristics

(1)

Symbol Parameter Min Typ Max Units

t

DH

t

OEH

t

OE

t

WR

Data Hold Time 10 ns
OE Hold Time 10 ns
OE to Output Delay

(2)

Write Recovery Time 0 ns

Notes: 1. These parameters are characterized and not 100% tested.

2. See t

spec in AC Read Characteristics.

OE

DA T A Polling W aveforms

WE

CE

t

OE

I/O7

t

DH

OEH

t

t

OE

HIGH Z

WR

ns

A0-A17

Toggle Bit Characteristics

(1)

An An An An An

Symbol Parameter Min Typ Max Units

t

DH

t

OEH

t

OE

t

OEHP

t

WR

Data Hold Time 10 ns
OE Hold Time 10 ns
OE to Output Delay

(2)

OE High Pulse 150 ns
Write Recovery Time 0 ns

Notes: 1. These parameters are characterized and not 100% tested.

2. See t

Toggle Bit Waveforms

spec in AC Read Characteristics.

OE

(1)(2)(3)

WE

CE

t

OEH

OE

t

I/O6

DH

t

OEHP

t

OE

HIGH Z

t

WR

ns

Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The t

input(s).

2. Beginning and ending state of I/O6 will vary.

3. Any address location may be used but the address should not vary.

10

AT49F002(N)T

specification must be met by the toggling

OEHP

AT49F002(N)T

LOAD DATA AA

TO

ADDRESS 5555

LOAD DATA 55

TO

ADDRESS 2AAA

LOAD DATA 80

TO

ADDRESS 5555

LOAD DATA AA

TO

ADDRESS 5555

LOAD DATA 55

TO

ADDRESS 2AAA

LOAD DATA 40

TO

ADDRESS 5555

PAUSE 1 second

(2)

Software Product
Identification Entry

LOAD DATA AA

ADDRESS 5555

LOAD DATA 55

ADDRESS 2AAA

LOAD DATA 90

ADDRESS 5555

ENTER PRODUCT

IDENTIFICATION

MODE

Software Product
Identification Exit

LOAD DATA AA

TO

ADDRESS 5555

(1)

(1)

TO

TO

TO

(2)(3)(5)

OR

Boot Block Lockout
Feature Enable Algorithm

Notes for boot block lockout feature enable:

LOAD DATA AA

TO

ADDRESS 5555

1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).

2. Boot block lockout feature enabled.

(1)

LOAD DATA 55

TO

ADDRESS 2AAA

LOAD DATA F0

TO

ADDRESS 5555

EXIT PRODUCT

IDENTIFICATION

Notes for software product identification

1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).

2. A1 - A17 = V
Manufacture Code is read for A0 = V
Device Code is read for A0 = V

3. The device does not remain in identification mode if
powered down.

4. The device returns to standard operation mode.

MODE

(4)

.

IL

EXIT PRODUCT

IDENTIFICATION

MODE

;

IL

.

IH

(4)

5. Manufacturer Code: 1FH
Device Code: 08H

11

Ordering Information

t

ACC

(ns)

55 50 0.1 AT49F002T-55JC

70 50 0.1 AT49F002T-70JC

55 50 0.1 AT49F002NT-55JC

ICC (mA)

Ordering Code Pac kage Operation RangeActive Standby

AT49F002T-55PC
AT49F002T-55TC

50 0.3 AT49F002T-55JI

AT49F002T-55PI
AT49F002T-55TI

AT49F002T-70PC
AT49F002T-70TC

50 0.3 AT49F002T-70JI

AT49F002T-70PI
AT49F002T-70TI

AT49F002NT-55PC
AT49F002NT-55TC

50 0.3 AT49F002NT-55JI

AT49F002NT-55PI
AT49F002NT-55TI

32J
32P6
32T

32J
32P6
32T

32J
32P6
32T

32J
32P6
32T

32J
32P6
32T

32J
32P6
32T

Commercial
(0° to 70°C)

Industrial

(-40° to 85°C)

Commercial
(0° to 70°C)

Industrial

(-40° to 85°C)

Commercial
(0° to 70°C)

Industrial

(-40° to 85°C)

70 50 0.1 AT49F002NT-70JC

AT49F002NT-70PC
AT49F002NT-70TC

50 0.3 AT49F002NT-70JI

AT49F002NT-70PI
AT49F002NT-70TI

Package Type

32J 32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)

32J
32P6
32T

32J
32P6
32T

Commercial
(0° to 70°C)

Industrial

(-40° to 85°C)

32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
32T 32-Lead, Thin Small Outline Package (TSOP)

12

AT49F002(N)T