Endurance: 10,000 Write Cycles
Data Retention: 10 Years
Internally Controlled Wri te Alg orithm
Operates over VCC = 4.5 to 5.5 Volts
•
64 Pin TQFP, Max. Height = 1.2 mm Mounted
•
Usage is Two Devices Per Card
•
Dual Mode Device with Mode Select Pin
•
Supports Up to 64 Mbytes of:
•
Flash E2PROM SRAM
ROM OTP
Description
The AT43101 is a low pow er, high inte gration P CMCI A inte rface chip set for memory
cards. It provides a complete PCMCIA PC Card Standard Release 2.1 compliant interface with no other s upport devi ces. Two AT43 101’s are use d on each memory card .
A mode select pin conf igures th e devi ce for ope ration a s a low o rder add ress and data
buffer when low and as the high order addre ss buffer/decoder when high. The two
devices together form a complete address and data buffer, address decoder, memory
device selection logic, read and write con trol logic and a Card I nformation Structu re
(CIS). Eight chip enable outp uts are provided, supporting 16 memory devices . The
device is pinned o ut for di rect co nn ectio n t o the PCM CI A c onne cto r wi thou t P C trace
cross-overs. Its 1.0 mm thick body allows population of both sides of a Type 1
PCMCIA card.
PCMCIA Card
Memory
Interface
Circuit with
256 Bytes of
Internal
Attribute
Memory
EEPROM
AT43101 pins ar e de fine d by th e fo llow ing two tabl es. The
Pin Descriptions Table lists and describes the function of
each signal used in the chip set. The Pin Assignment Table
lists the signals conne cted t o each pin fo r each mode an d
the buffer type implemented for the corresponding pin. The
buffer type listed in the P in A ss ign me nt Table do es n ot always agree with the signal type listed in the Pin Description
Table because the chip im plements buf fer types that s upport both modes of each pin. The pullup resistors included
on chip as shown in the table have a nominal value of
375K ohms. An aste risk, “*”, appended to a signal name
indicates the signal is a ctive low.
AT43101 Logical Pin Descript ions
NameTypeDescription
D[15:0]BidirPCMCIA Data Bus
A[24:0]InputPCMCIA Address Bus
CE2*InputActive low, PCMCIA byte enable for odd byte
CE1*InputActive low, PCMCIA byte enable for even byte
OE*InputActive low, PCMCIA output enable signal
WE*InputActive low, PCMCIA write enable signal
REG*InputPCMCIA signal high for common memory, low for attribute memory
ID[15:0]BidirMemory data bus
IA[24:1]OutputMemory address bus
SGL/DBL*InputAddress decoder mode control input per function table
SEL[1:0]InputAddress decoder selection inputs per function table
B/A*InputMode select input. Low selects mode A, High selects mode B.
DEC[2:0]InputAddress Inputs decoded to generate ICE[7:0]* outputs
IOEH*OutputActive low output enable for upper byte of memory
IOEL*OutputActive low output enable for lower byte of memory
IWEH*OutputActive low write enable for upper byte of memory
IWEL*OutputActive low write enable for lower byte of memory
IWP*InputInput from write protect switch
WPOutputOutput to PCMCIA write protect signal
ICE[7:0]*OutputActive low chip enable outputs for 8 pairs of memory devices
ResetInputActive high reset
IR*OutputOutput of inverted reset
WPATTInputActive high attribute memory protect signal
R/B*OutputOutput from IR/B* and attribute memory Ready/Busy*
IR/B*InputActive low Ready/Busy* input for common memory
The AT43101 is us ed in pairs to implemen t PCMCIA
Release 2.1 compatib le mem ory cards as sho wn in th e system block diagra m and in the inte rnal chip block diag rams.
Both PCMCIA signals an d m em or y de vice s co nn ect d ir e ctl y
to the AT43101 with no additional components required. The
AT43101 acts as a data an d address buffer an d address and
control signal decoder for both an external memory array and
an internal 256x 8 E2PROM w hich contains the Card Info rmation Struct ure .
The memory card is mapped into the Common Memo ry Address Space of PCMCIA according to the address signals
connected to t he D EC[2: 0], SEL[1 :0] , an d SGL/ DBL* in puts.
In a typical configuration, SGL/DBL* and SEL[1:0] are tied
high or left floating since they are pulled up internally. Then
DEC[2:0] function as direct inputs to the address/chip enable
decoder.
For example, A[25:23] are connected to DEC[2:0] and
IA[22:1] are connected to A[21:0] of sixteen 4 Mbyte devices.
Note that A0 is used in conjunction with CE1* and CE2* to
4AT43101
decode the data access and is not used as a common
memory address. A[25:23] then determine which ICE[7:0]
line is active.
Mixed memory size applic ations can use SGL/DB L* pulled
low to enable a mixed mode decoding. This then enables
either DEC[2:0] or SEL[1:0] as inputs to the address/chip
enable decode r b ase d on t he st at e of SEL [1 :0].
For example, the common memory space contains eight
1 Mbyte SRAM devices and six 4 Mbyte Flash devices.
A[22:21] are connected to DEC[1:0] (DEC[2] is a don’t care)
and A[24:23] are connected to SEL[1:0]. Then IA[22:1] are
used to con nect to A[19 :0] of the S RAM an d A[2 1:0] of the
Flash devices. ICE[3:0]* are connected to the four SRAM
banks and ICE [7: 5] to the t hree Fl ash ba nks . The SRAM is
then memory ma pped to the low er 4 M words of a d d ressing
and the Flash to th e next 12 M w ord s. All a ddressi ng is contiguous. Noti ce that ICE4* can not be use d with thi s decoding
scheme.
The AT43101 provides separate output and write enables for
the upper and l ower byte s of the m emory ar ray to imp lement
byte address ing. The assert ion of these outp uts under the
control of A0, CE2*, CE1*, OE* and WE* is given by the
following table when REG* is high.
The IWP* i nput provides write protection for common
memory. When IWP* is low, assertion of IWEL* and
IWEH* is inhibited. The WPATT input provides write protection for the a ttribute memory w hen high. This signal is
pulled down internall y for applications not requiring write
protection. In addition, th e AT43101 is di sabled for 3 milliseconds during po wer up to prevent w rites from occu rring
to either attribute or comm on memory. The state of the
A*/B pin is also latched at this time . The AT43101 does
not support the optional PCMCIA WAIT* signal.
5
Page 6
Block Diagram for Mode B Operation
A[24:9]IA[24:9]
SGL/DBL*
DEC[2:0]
SEL[1:0]
SGL/DBL* LOGIC
REG*
Reset
ADDRESS
BUFFER
ICE7*
3
DEC
ICE6*
ICE5*
ONE OF
EIGHT
DECODER
EN
EN
ICE4*
ICE3*
ICE2*
ICE1*
ICE0*
EN
WE*
IWP*
CE1*
CE2*
A0
OE*
The AT43101 supports both Common and Attribute
Memory read and write cycles of word and byte width.
Common memory, the ext ernal memo ry devices on th e PC
card, is selected when REG* is high and can be accessed
in either byte or word mode. Attribute memory, the internal
256x8 E2PROM, i s selected when REG* is low and can
only be accessed as the even byte of it’s 512 byte address
space. Byte/word add ressing is controlled by CE1*, CE2*
and A0. OE* functions as an active low output enable.
WE* functions as an active lo w wri te ena b l e.
Memory access functionality is define d by the following
table. When Attribute Memory is selected by the assertion
WP
IWEH*
BYTE WRITE
CONTROL LOGIC
IWEL*
IOEH*
BYTE READ
CONTROL LOGIC
of REG*, only the lower data bus, D[7:0] is valid and only
even numbered addresse s may be accessed. Accordingly, an entry of “H or L” in the REG* of the function table
means the access is supported for both Common Memory
and Attribute Memory. An entry of “H only” means the access is supported for Common Memory accesses but not
for Attribute Memory accesses.
During word accesses of Common Memory, D[15:0] and
ID[15:0] are a ctive. D uring b yte a ccesse s (o ther th an Od d
Byte Only accesses), the PCMCIA transfers take place on
D[7:0] and the AT43101 performs the required byte lane
swapping based on A0 to and from D[15:8] or D[7:0]
IOEL*
6AT43101
Page 7
AT43101
Memory Access Functions
ModeREG*CE2*CE1*A0OE*WE*D[15:8]D[7:0]
StandbyXHHXXXHigh ZHigh Z
Byte Read, EvenH or LHLLLHHigh ZD(Even)
Byte Read, OddH onlyHLHLHHigh ZD(Odd)
Word ReadH onlyLLXLHD(Odd)D(Even)
Odd byte only ReadH onlyLHXLHD(Odd)High Z
Byte Write, EvenH or LHLLHLXD(Even)
Byte Wrtite, OddH onlyHLHHLXD(Odd)
Word WriteH onlyLLXHLD(Odd)D(Even)
Odd byte only WriteH onlyLHXHLD(Odd)X
The E2PROM includes addre ss and data latches wh ich are
clocked at the lea ding edge of the e ffec tiv e wri te p ul se th at
results from the gating of the PCMCIA control signals. The
Tsu(CE), Tsu(REG), Tsu(WE) timing parameters shown in
the AC Write Characteristics guarantee adequate pulse
width for the latch cloc k signals. The actual write is trig-
gered by the rising edge of the first of WE* or CE1* to go
high. Writes to the E2PROM Attribute Memory must
obse rve either a 10 ms. write recovery/cycle time or wait
until R/B* goes inact ive before another wr ite can be initiated.
7
Page 8
Block Diagram for Mode A Operation
D[15:0]
ID[15:0]
ENB
M
U
X
ENB
A[8:1]
WPATT
Reset
R/B*
WE*
CE1*
CE2*
REG*
OE*
A0
Write Protect
256 X 8 EEPROM
DATAIN
Ready/Busy*
ADDR
CONTROL LOGIC
CE
OE
WE
DATAOUT
IR/B*
IA[8:1]
IR*
Absolute Maximum Ra ti ngs *
Operating Temperature........................0°C to +70°C
Storage Temperature ..................... -65°C to +150°C
Voltage on Any Pin
With Respect to VSS.................-0.6 V to Vcc +0.6 V
Maximum Operating Voltage............................ 6.1 V
8AT43101
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device.
This is a stess rating only and functional operation of the device at
these or any other conditions beyond those indicated in the
operational section of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
Page 9
AT43101
Pin Capacitance (F = 1 MHz , T = 25°C)
(1)
MaxUnitsConditions
Cin12pfVin = 0 V
Cout12pfVout = 0 V
Note: 1. These parameters are characterized and not 100% tested.
DC and AC Operating Range
AT43101
Operating Temperature (Case)0
°C to 70°C
VCC Power Supply4.5 V to 5.5 V
DC Characteristics
SymbolParameterConditionMinMaxUnits
I
I
I
I
LI
LO
LIP
SB
Input Load CurrentVin = 0 V to V
Output Leakage CurrentVin = 0 V to V
CC
CC
Input Load CurrentInputs with pullups/downs-150+150µA
=5.5 V Inputs=0 or V
V
Standby Current
CC
I out=0mA
CC
-1010µA
-1010µA
200µA
I
CCA
I
CCP
V
IL
V
IH
V
OL
V
OH
=5.5 V Inputs=0 or VCC,
V
Operating Current
E2PROM Write Current
CC
I out=0mA
=5.5 V Inputs=0 or VCC,
V
CC
I out=0mA
Input Low Voltage0.3V
Input High Voltage.7V
Output Low VoltageI
= 4 mA VCC = 4.5 V0.45V
OL
CC
5mA
5mA
CC
Output High VoltageIOH = -4 mA, VCC = 4.5 V2.4V
V
V
9
Page 10
AC Read Characteristics
SymbolParameterMinMaxNotes
tia(A)Delay to IA[24:0], from A[24:0]0 ns30 ns
tda(A)Data access time, from A[8:0] to D[7:0]250 ns3
ten(CE)Output enable time from CE*5 ns36 ns1
ten(OE)Output enable time from OE*5 ns36 ns
ten(REG)Output enable time from REG*36 ns2
tdis(CE)Output disable time from CE*58 ns1
tdis(OE)Output disable time from OE*58 ns
tdis(REG)Output disable time from REG*58 ns
tioel(A0)Delay to IOEL*, IOEH* assertion from A028 ns
tioel(CE)Delay to IOEL*, IOEH* assertion from CE*28 ns1
tioel(OE)Delay to IOEL*, IOEH* assertion from OE*25 ns
tioel(REG)Delay to IOEL*, IOEH* assertion from REG*28 ns2
tioeh(A0)Delay to IOEL*, IOEH* de-assertion from A028 ns
tioeh(CE)Delay to IOEL*, IOEH* de-assertion from CE*28 ns1
tioeh(OE)Delay to IOEL*, IOEH* de-assertion from OE*25 ns
tioeh(REG)Delay to IOEL*, IOEH* de-assertion from REG*28 ns2
tv(A)Delay to data change, from change of address0 ns
td(ID)Delay from ID[15:0] to D[15:0]27 ns
tice(A)Delay to ICE[7:0]* from DEC[2:0], SEL[1:0], SGL/DBL*38 ns4
tice(REG)Delay to ICE[7:0]* from REG*38 ns4
tice(CE)Delay to ICE[7:0]* from CE1*, CE2*30 ns4
Ten (reset)Chip active enable time from reset50 ns5
Tdis (reset)Chip active disable time from reset50 ns5
Notes: 1. Either or both of CE1*, CE2* assert according to functio n tru th tab le .
2. REG* asserted only for Attribute Memory read.
3. tda(A) applies to Attribute Memory rea d. Acce ss time for Common Memory
read is derived from tia(A), td(ID), and external device access time.
4. Symmetrical for assertion and de-assertion. Also applies to write cycles.
5. Not shown in timing diagram.
Input Test Waveforms and Measurement Level
V
DD
VDD/2
0V
AC MEASUREMENT LEVEL
tR1tƒ<5 ns, test load capacitance is 50pf≥
10AT43101
Page 11
AC Read Waveforms
AT43101
A[24:0], SGL/DBL*,
DEC[2:0], SEL[1:0]
IA[24:0]
ICE[7:0]*
REG*
CE1*, CE2*
OE*
tia(A)
ADDRESS VALID
tice(A)
tice(REG)
tda(A)
ten(REG)
tv(A)
tice(CE)
tioeh(AO)
tdis(REG)
tdis(CE)
ten(CE)
D[15:0]
IOEH*,
IOEL*
ID[15:0]
HIGH Z
ten(OE)
DATA VALID
tioel(CE)
tioel(OE)
tioel(REG)tioeh(OE)
tioel(A0)
td(ID)
DATA VALID
tdis(OE)
tioeh(REG)
tioeh(CE)
11
Page 12
AC Write Characteristics
SymbolParameterMinMaxNote
tia(A)Delay to IA[24:0], from A[24:0]030 ns
tid(D)Delay to ID[15:0], from D[15:0]031 ns
tsu(A)Setup time, A[24:0] valid before WE* assertion26 ns1
th(A)Hold time, A[24:0] after WE* de-assertion11 ns1
tsu(D)Setup time, D[15:0] valid before WE* de-assertion10 ns1
th(D)Hold time, D[15:0] after WE* de-assertion10 ns1
tsu(CE)Setup time, CE*, CE* before WE* de-assertion190 ns2
th(CE)Hold time, CE*, CE* after WE* de-assertion02
twcWrite cycle time10 ms1
twrMinimum active pulse of WE*, CE1*190 ns1
tsu(REG)Setup time, REG* to WE*190 ns
th(REG)Hold time, REG* after WE* de-assertion0
tiwel(A0)Delay to IWEL*, IWEH* assertion from A0025 ns4
tiwel(CE)Delay to IWEL*, IWEH* assertion from CE*025 ns4
tiwel(WE)Delay to IWEL*, IWEH* assertion from WE*025 ns4
tiwel(REG)Delay to IWEL*, IWEH* assertion from REG*025 ns4
tiweh(A0)Delay to IWEL*, IWEH* de-assertion from A0025 ns
tiweh(CE)Delay to IWEL*, IWEH* de-assertion from CE*025 ns2
tiweh(WE)Delay to IWEL*, IWEH* de-assertion from WE*025 ns
tiweh(REG)Delay to IWEL*, IWEH* de-assertion from REG*025 ns3
twp(IWP)Delay to WP, from IWP*025 ns5
twe(IWP)Delay to IWEH*, IWEL* from IWP*025 ns5
2
tRB(WE)Delay to R/B* from start of E
PROM write50 ns1
tRB(IRB)Delay to R/B* from IR/B*40 ns
Notes: 1. Parameter applies to writes of in te rnal E2PROM.
2. Either or both of CE1*, CE2* assert according to function trut h tabl e.
3. REG* asserted only for Attribute Memory write. REG* must be stable
during the write at the level appropriate to the memory type bei ng acc es se d.
4. One or both of IWEH*, IWEL* assert per A0, CE1*, CE2*, provided REG* is high.
5. Not shown in timing diagrams.
12AT43101
Page 13
A. C. Write Waveforms - WE* Control
A[24:0]ADDRESS VALID
AT43101
tia(A)
IA[24:0]
D[15:0]DATA VALID
tsu(D)
tid(D)
ID[15:0]
tsu(A)twr
WE*
CE1*,
CE2*
REG*
tiwel(CE)
tiwel(REG)
tiwel(A0)
tiwel(WE)
tsu(CE)
tsu(REG)th(REG)
th(A)
th(D)
tiweh(WE)
th(CE)
tiweh(A0)
tiweh(CE)
tiweh(REG)
IWEH*, IWEL*
Ready/Busy* Waveforms
WE*
1
R/B*
1) CE* or WE* dependant
on controlling signal
IR/B*
R/B*
tRB(WE)
twc
tRB(IRB)
13
Page 14
AC Write Waveforms - CE Control
A[24:0]ADDRESS VALID
tia(A)
IA[24:0]
D[15:0]DATA VALID
tsu(D)
tid(D)
ID[15:0]
CE1*, CE2*
WE*
REG*
IWEH*, IWEL*
tsu(A)
tiwel(WE)
tsu(REG)th(REG)
tiwel(REG)
tiwel(A0)
twr
tsu(CE)
tiwel(CE)
th(A)
th(D)
th(CE)
tiweh(A0)
tiweh(WE)
tiweh(REG)
tiweh(CE)
Packaging and Orde ring Infor m at io n
Package TypePin Count, DimensionsPart Number
TQFP64 pins, 1 mm thick AT43101
14AT43101
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