Datasheet AT27C256R Datasheet (ATMEL)

Features

• Fast Read Access Time – 45 ns

• Low-Power CMOS Operation

– 100 µA Max Standby
– 20 mA Max Active at 5 MHz

• JEDEC Standard Packages

– 28-lead PDIP
– 32-lead PLCC
– 28-lead TSOP and SOIC

• 5V ± 10% Supply

• High Reliability CMOS Technology

– 2,000V ESD Protection
– 200 mA Latchup Immunity

• Rapid Programming Algorithm – 100 µs/Byte (Typical)

• CMOS and TTL Compatible Inputs and Outputs

• Integrated Product Identification Code

• Industrial and Automotive Temperature Ranges

• Green (Pb/Halide-free) Packaging Option

1. Description

The AT27C256R is a low-power, high-performance 262,144-bit one-time programma­ble read-only memory (OTP EPROM) organized 32K by 8 bits. It requires only one 5V
power supply in normal read mode operation. Any byte can be accessed in less than
45 ns, eliminating the need for speed reducing WAIT states on high-performance
microprocessor systems.

256K (32K x 8)
OTP EPROM

AT27C256R

Atmel’s scaled CMOS technology provides low-active power consumption, and fast
programming. Power consumption is typically only 8 mA in Active Mode and less than
10 µA in Standby.

The AT27C256R is available in a choice of industry-standard JEDEC-approved one
time programmable (OTP) plastic DIP, PLCC, SOIC, and TSOP packages. All devices
feature two-line control (CE
contention.

With 32K byte storage capability, the AT27C256R allows firmware to be stored reli­ably and to be accessed by the system without the delays of mass storage media.

Atmel’s AT27C256R has additional features to ensure high quality and efficient pro­duction use. The Rapid Programming Algorithm reduces the time required to program
the part and guarantees reliable programming. Programming time is typically only
100 µs/byte. The Integrated Product Identification Code electronically identifies the
device and manufacturer. This feature is used by industry-standard programming
equipment to select the proper programming algorithms and voltages.

, OE) to give designers the flexibility to prevent bus

0014K–EPROM–10/05

2. Pin Configurations

Pin Name Function

A0 - A14 Addresses

O0 - O7 Outputs

CE

Chip Enable

OE

Output Enable

NC No Connect

2.1 28-lead PDIP/SOIC Top View

VPP

A12

A7
A6
A5
A4
A3
A2
A1

A0
O0
O1
O2

GND

1
2
3
4
5
6
7
8
9
10
11
12
13
14

28

VCC

27

A14

26

A13

25

A8

24

A9

23

A11

22

OE

21

A10

20

CE

19

O7

18

O6

17

O5

16

O4

15

O3

2.3 28-lead TSOP Top View – Type 1

2.2 32-lead PLCC Top View

OE

A11

A9

A8
A13
A14

VCC

VPP

A12

A7

A6

A5

A4

A3

1
2
3
4
5
6

7
8
9
10
11
12
13
14

28

A10

27

CE

26

O7

25

O6

24

O5

23

O4

22

O3

21

GND

20

O2

19

O1

18

O0

17

A0

16

A1

15

A2

A7

A12

VPPNCVCC

A14

A13

432

1

O2

GND

323130

O3O4O5

NC

29

A8

28

A9

27

A11

26

NC

25

OE

24

A10

23

CE

22

O7

21

O6

A6
A5
A4
A3
A2
A1
A0

NC

O0

5
6
7
8
9
10
11
12
13

14151617181920

O1

Note: PLCC Package Pins 1 and 17 are Don’t Connect.

2

AT27C256R

0014K–EPROM–10/05

3. System Considerations

Switching between active and standby conditions via the Chip Enable pin may produce tran­sient voltage excursions. Unless accommodated by the system design, these transients may
exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high
frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This
capacitor should be connected between the V
to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit
boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again
connected between the V
close as possible to the point where the power supply is connected to the array.

4. Block Diagram

AT27C256R

and Ground terminals of the device, as close

CC

and Ground terminals. This capacitor should be positioned as

CC

5. Absolute Maximum Ratings*

Temperature Under Bias................................ -55°C to +125°C

Storage Temperature..................................... -65°C to +150°C

Voltage on Any Pin with

Respect to Ground .........................................-2.0V to +7.0V

Voltage on A9 with

Respect to Ground ......................................-2.0V to +14.0V

VPP Supply Voltage with

Respect to Ground .......................................-2.0V to +14.0V

Note: 1. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is

V

+ 0.75V dc which may overshoot to +7.0 volts for pulses of less than 20 ns.

CC

(1)

(1)

(1)

*NOTICE: Stresses beyond those listed under “Absolute Maxi-

mum Ratings” may cause permanent damage to
the device. This is a stress rating only and func­tional operation of the device at these or any other
conditions beyond those indicated in the opera­tional sections of this specification is not implied.
Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.

0014K–EPROM–10/05

3

6. Operating Modes

Mode/Pin CE OE Ai V

Read V

Output Disable V

Standby V

Rapid Program

PGM Verify

Optional PGM Verify

PGM Inhibit

Product Identification

(2)

(2)

(2)

(2)

(4)

X

IL

IL

IH

V

IL

(1)

V

IL

V

IH

V

IL

V

V

X

V

V

V

V

V

IL

IH

(1)

IH

IL

IL

IH

IL

Ai V

(1)

X

(1)

X

Ai V

Ai V

Ai V

(1)

X

A9 = V

(3)

H

A0 = VIH or VIL
A1 - A14 = V

IL

Notes: 1. X can be VIL or VIH.

2. Refer to Programming Characteristics.

= 12.0 ± 0.5V.

3. V

H

4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled
low (V

) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.

IL

7. DC and AC Operating Conditions for Read Operation

AT27C256R

-45 -70

V

PP

CC

V

CC

V

CC

PP

PP

CC

V

PP

CC

Outputs

D

OUT

High Z

High Z

D

IN

D

OUT

D

OUT

High Z

Identification Code

Operating Temp. (Case) Ind. -40°C - 85°C-40°C - 85°C

Auto. -40°C - 125°C

V

Supply 5V ± 10% 5V ± 10%

CC

8. DC and Operating Characteristics for Read Operation

Symbol Parameter Condition Min Max Units

I

LI

I

LO

(2)

I

PP1

I

SB

I

CC

V

IL

V

IH

V

OL

V

OH

Notes: 1. V

2. V

Input Load Current VIN = 0V to V

Output Leakage Current V

(1)

V

Read/Standby Current VPP = V

PP

(1)

V

Standby Current

CC

= 0V to V

OUT

I

(CMOS), CE = VCC ± 0.3V 100 µA

SB1

I

(TTL), CE = 2.0 to V

SB2

VCC Active Current f = 5 MHz, I

CC

OUT

CC

CC

= 0 mA, E = V

Input Low Voltage -0.6 0.8 V

Input High Voltage 2.0 VCC + 0.5 V

Output Low Voltage IOL = 2.1 mA 0.4 V

Output High Voltage IOH = -400 µA 2.4 V

must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP..

CC

may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.

PP

Ind. ±1 µA

Auto. ±5 µA

Ind. ±5 µA

Auto. ±10 µA

10 µA

+ 0.5V 1 mA

CC

IL

20 mA

4

AT27C256R

0014K–EPROM–10/05

.

9. AC Characteristics for Read Operation

Symbol Parameter Condition

(1)

t

ACC

(1)

t

CE

(1)

t

OE

(1)

t

DF

t

OH

Note: 1. See AC Waveforms for Read Operation.

Address to Output Delay CE = OE = V

CE to Output Delay OE = V

OE to Output Delay CE = V

IL

IL

OE or CE High to Output
Float, Whichever Occurred First

Output Hold from Address, CE or OE,
Whichever Occurred First

AT27C256R

AT27C256R

-45 -70

Min Max Min Max

IL

45 70 ns

45 70 ns

20 30 ns

20 25 ns

77 ns

Units

10. AC Waveforms for Read Operation

(1)

Notes: 1. Timing measurement reference level is 1.5V for -45 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V. Timing mea-

surement reference levels for all other speed grades are V
and V

2. OE

3. OE

= 2.4V.

IH

may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.

may be delayed up to t

- tOE after the address is valid without impact on t

ACC

= 0.8V and VOH = 2.0V. Input AC drive levels are VIL = 0.45V

OL

.

ACC

4. This parameter is only sampled and is not 100% tested.

5. Output float is defined as the point when data is no longer driven.

0014K–EPROM–10/05

5

11. Input Test Waveforms and Measurement Levels

For -45 devices only:

t

, tF < 5 ns (10% to 90%)

R

For -70 devices:

tR, tF < 20 ns (10% to 90%)

12. Output Test Load

Note: 1. CL = 100 pF including jig capacitance, except for the -45 devices, where CL = 30 pF.

13. Pin Capacitance

f = 1 MHz, T = 25°C

Symbol Typ Max Units Conditions

C

IN

C

OUT

Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.

(1)

46pFV

812pFV

IN

OUT

= 0V

= 0V

6

AT27C256R

0014K–EPROM–10/05

AT27C256R

14. Programming Waveforms

(1)

Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.

2. tOE and t

are characteristics of the device but must be accommodated by the programmer.

DFP

3. When programming the AT27C256R a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage
transients.

15. DC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

I

V

V

V

V

I

I

V

LI

IL

IH

OL

OH

CC2

PP2

ID

Input Load Current V

= VIL,V

IN

IH

Input Low Level -0.6 0.8 V

Input High Level 2.0 VCC + 1 V

Output Low Volt IOL = 2.1 mA 0.4 V

Output High Volt I

= -400 µA 2.4 V

OH

VCC Supply Current (Program and Verify) 25 mA

VPP Current CE = V

IL

A9 Product Identification Voltage 11.5 12.5 V

Limits

UnitsMin Max

±10 µA

25 mA

0014K–EPROM–10/05

7

16. AC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

Limits

(1)

UnitsMin Max

t

t

t

t

t

t

t

t

t

t

t

AS

OES

DS

AH

DH

DFP

VPS

VCS

PW

OE

PRT

Address Setup Time

OE Setup Time 2 µs

Data Setup Time 2 µs

Input Rise and Fall Times

(10% to 90%) 20 ns

Address Hold Time 0 µs

Input Pulse Levels

Data Hold Time 2 µs

OE High to Output Float Delay

VPP Setup Time 2 µs

(2)

Input Timing Reference Level

0.45V to 2.4V

0.8V to 2.0V

VCC Setup Time 2 µs

CE Program Pulse Width

Data Valid from OE

(3)

(2)

Output Timing Reference Level

0.8V to 2.0V

VPP Pulse Rise Time During Programming 50 ns

Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.

2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer
driven – see timing diagram.

3. Program Pulse width tolerance is 100

µsec ± 5%.

17. Atmel’s AT27C256R Integrated Product Identification Code

Pins

Codes

2µs

0 130 ns

95 105 µs

150 ns

Hex

DataA0 O7 O6 O5 O4 O3 O2 O1 O0

Manufacturer 000011110 1E

Device Type 110001100 8C

8

AT27C256R

0014K–EPROM–10/05

18. Rapid Programming Algorithm

A 100 µs CE pulse width is used to program. The address is set to the first location. VCC is
raised to 6.5V and V
CE

pulse without verification. Then a verification/reprogramming loop is executed for each
address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are
applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been
applied, the part is considered failed. After the byte verifies properly, the next address is
selected until all have been checked. V
are read again and compared with the original data to determine if the device passes or fails.

PP

AT27C256R

is raised to 13.0V. Each address is first programmed with one 100 µs

is then lowered to 5.0V and VCC to 5.0V. All bytes

PP

0014K–EPROM–10/05

9

19. Ordering Information

19.1 Standard Package

I

t

ACC

(ns)

45 20 0.1 AT27C256R-45JI

70 20 0.1 AT27C256R-70JI

Note: Refer to PCN# SC042702.

19.2 Green Package (Pb/Halide-free)

t

ACC

(ns)

45 20 0.1 AT27C256R-45JU

70 20 0.1 AT27C256R-70JU

(mA)

CC

Ordering Code Package Operation RangeActive Standby

AT27C256R-45PI
AT27C256R-45RI
AT27C256R-45TI

AT27C256R-70PI
AT27C256R-70RI
AT27C256R-70TI

20 0.1 AT27C256R-70JA

AT27C256R-70PA
AT27C256R-70RA

I

(mA)

CC

Ordering Code Package Operation RangeActive Standby

AT27C256R-45PU
AT27C256R-45RU
AT27C256R-45TU

AT27C256R-70PU
AT27C256R-70RU
AT27C256R-70TU

32J
28P6
28R
28T

32J
28P6
28R
28T

32J
28P6
28R

32J
28P6
28R
28T

32J
28P6
28R
28T

Industrial

(-40°C to 85°C)

Industrial

(-40°C to 85°C)

Automotive

(-40°C to 125°C)

Industrial

(-40°C to 85°C)

Industrial

(-40°C to 85°C)

Package Type

32J 32-lead, Plastic J-Leaded Chip Carrier (PLCC)

28P6 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

28R 28-lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC)

28T 28-lead, Thin Small Outline Package (TSOP)

10

AT27C256R

0014K–EPROM–10/05

20. Packaging Information

20.1 32J – PLCC

AT27C256R

1.14(0.045) X 45˚

B

e

0.51(0.020)MAX

45˚ MAX (3X)

Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE.

2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.

3. Lead coplanarity is 0.004" (0.102 mm) maximum.

PIN NO. 1
IDENTIFIER

D1

D

D2

1.14(0.045) X 45˚

E1 E

0.318(0.0125)

0.191(0.0075)

E2

B1

A2

A1

A

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

A 3.175 – 3.556

A1 1.524 – 2.413

A2 0.381 – –

D 12.319 – 12.573

D1 11.354 – 11.506 Note 2

D2 9.906 – 10.922

E 14.859 – 15.113

E1 13.894 – 14.046 Note 2

E2 12.471 – 13.487

B 0.660 – 0.813

B1 0.330 – 0.533

e 1.270 TYP

MIN

NOM

MAX

NOTE

10/04/01

2325 Orchard Parkway

R

San Jose, CA 95131

0014K–EPROM–10/05

TITLE

32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)

DRAWING NO.

32J

REV.

B

11

20.2 28P6 – PDIP

PIN

1

E1

A1

B

REF

E

B1

C

L

SEATING PLANE

A

e

D

0º ~ 15º

eB

Notes: 1. This package conforms to JEDEC reference MS-011, Variation AB.

2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").

TITLE

2325 Orchard Parkway

R

San Jose, CA 95131

28P6, 28-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

A – – 4.826

A1 0.381 – –

D 36.703 – 37.338 Note 2

E 15.240 – 15.875

E1 13.462 – 13.970 Note 2

B 0.356 – 0.559

B1 1.041 – 1.651

L 3.048 – 3.556

C 0.203 – 0.381

eB 15.494 – 17.526

e 2.540 TYP

MIN

NOM

MAX

DRAWING NO.

28P6

NOTE

09/28/01

REV.

B

12

AT27C256R

0014K–EPROM–10/05

20.3 28R – SOIC

AT27C256R

B

E

1

PIN 1

e

D

A

1

0º ~ 8º

C

L

Note: 1. Dimensions D and E1 do not include mold Flash
or protrusion. Mold Flash or protrusion shall not exceed

0.25 mm (0.010").

E

A

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

A 2.39 – 2.79

A1 0.050 – 0.356

D 18.00 – 18.50 Note 1

E 11.70 – 12.50

E 1 8.59 – 8.79 Note 1

B 0.356 – 0.508

C 0.203 – 0.305

L 0.94 – 1.27

e 1.27 TYP

MIN

NOM

MAX

NOTE

2325 Orchard Parkway

R

San Jose, CA 95131

0014K–EPROM–10/05

TITLE
28R, 28-lead, 0.330" Body Width,

Plastic Gull Wing Small Outline (SOIC)

5/18/2004

DRAWING NO.

28R

REV.

C

13

20.4 28T – TSOP

PIN 1

Pin 1 Identifier Area

D1

D

e

E

b

A2

A

A1

Notes: 1. This package conforms to JEDEC reference MO-183.

2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.

3. Lead coplanarity is 0.10 mm maximum.

0º ~ 5º

SEATING PLANE

SYMBOL

c

L

L1

GAGE PLANE

COMMON DIMENSIONS

(Unit of Measure = mm)

MIN

A – – 1.20

A1 0.05 – 0.15

A2 0.90 1.00 1.05

D 13.20 13.40 13.60

D1 11.70 11.80 11.90 Note 2

E 7.90 8.00 8.10 Note 2

L 0.50 0.60 0.70

L1 0.25 BASIC

b 0.17 0.22 0.27

c 0.10 – 0.21

e 0.55 BASIC

NOM

MAX

NOTE

14

2325 Orchard Parkway

R

San Jose, CA 95131

AT27C256R

TITLE

28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline

Package, Type I (TSOP)

DRAWING NO.

28T

0014K–EPROM–10/05

12/06/02

REV.

C

Atmel Corporation Atmel Operations

2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: [phone]
Fax: [phone]

Regional Headquarters

Europe

Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: [phone]
Fax: [phone]

Asia

Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

Japan

9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: [phone]
Fax: [phone]

Memory

2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: [phone]
Fax: [phone]

Microcontrollers

2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: [phone]
Fax: [phone]

La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: [phone]
Fax: [phone]

ASIC/ASSP/Smart Cards

Zone Industrielle
13106 Rousset Cedex, France
Tel: [phone]
Fax: [phone]

1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: [phone]
Fax: [phone]

Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: [phone]
Fax: [phone]

RF/Automotive

Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: [phone]
Fax: [phone]

1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: [phone]
Fax: [phone]

Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom

Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: [phone]
Fax: [phone]

Literature Requests

www.atmel.com/literature

Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-

TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN­TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no

representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.

© Atmel Corporation 2005. All rights reserved. Atmel®, logo and combinations thereof, Everywhere You Are® and others, are
registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.

Printed on recycled paper.

0014K–EPROM–10/05