Datasheet AT25HP512-10PC, AT25HP256W-10SI-2.7, AT25HP256W-10SI-1.8, AT25HP256W-10SI, AT25HP256W-10SC-2.7 Datasheet (ATMEL)

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Page 1
Features
Serial Peripheral Interface (SPI) Compatible
Supports SPI Modes 0 (0,0) and 3 (1,1)
10 MHz Clock Rate
128-Byte Page Mode Only for Write Operations
Low-Volta ge and Standard-Voltage Operation
– 5.0 (VCC = 4.5V to 5.5V) – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 3.6V)
Block Write Protection
– Protect 1/4, 1/2, or Entire Array
Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection
High Reliability
– Endurance: 100K Write Cycles – Data Retention: > 40 Years – ESD Protection: > 3000V
8-Pin PDIP, 8-Pin EIAJ SOIC, and 8-Pin Leadless Array Package
Description
The AT25HP256/512 provides 262,144/524,288 bits of serial electrically erasable pro­grammable read only memory (EEPROM) organized as 32,768/65,536 words of 8-bits each. The device is o ptimi zed f or u se i n man y in dustria l and com merc ial app lic ations where high-speed, low- power, and low-voltage operation are essent ial. The AT25HP256/512 is available in a space saving 8-pin PDIP (AT25HP256/512), 8-pin EIAJ SOIC (AT25HP256), and 8-pin Leadless Array (AT25HP256/512) packages. In
(continued)
SPI Serial EEPROMs
256K (32,768 x 8) 512K (65,536 x 8)
AT25HP256 AT25HP512 Preliminary
Pin Configurations
Pin Name Function
CS SCK Serial Data Clock SI Serial Data Input SO Serial Data Output GND Ground VCC Power Supply WP HOLD Suspends Serial Input
CS SO
WP
GND
Chip Select
Write Protect
8-Pin PDIP
8
1
7
2 3
6
4
5
VCC HOLD
SCK SI
CS SO
WP
GND
8-Pin SOIC
8
1
7
2 3
6
4
5
VCC HOLD
SCK SI
8-Pin Leadless Array
VCC
HOLD
SCK
8 7 6
SI
5
CS
1
SO
2
WP
3
GND
4
Bottom View
Rev. 1113B–07/98
1
Page 2
addition, the entire family is available in 5.0V (4.5V to
5.5V), 2.7V (2.7V to 5.5V), and 1.8V (1 .8V to 3.6V) ver­sions.
The AT25HP256/512 is enabled through the Chip Select pin (CS Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). All progr amming cycle s are co mpletely s elf­timed, and no separate ERASE cycle is required before WRITE.
BLOCK WRITE protection is enabled by programming the status register with top ¼, top ½ or entire array of write pro­tection. Separate program enable and program disable instructions are provided for additional data protection. Hardware d ata protection is pr ovided via the WP tect against inadvertent write attempts to the status regis­ter. The HOLD communication without resetting the serial sequence.
) and accessed via a 3-wire interface consisting of
pin to pro-
pin may be used to suspend any serial
Block Diagram
Absolute Maximum Ratings*
Operating Temperature..................................-55°C to +125°C
Storage Temperature .....................................-65°C to +150°C
Voltage on Any Pin
with Respect to Ground.................................... -1.0V to +7.0V
Maximum Operating Voltage................................... ...... ..6.25V
DC Output Current........................................................5.0 mA
*NOTICE: Stresses beyond those listed under “Absolute Maxi-
mum Ratings” ma y cause permanent d amage to th e device. This is a stress rating only and functional operation of the device at these or any other condi­tions beyond those indicated in the operational sec­tions of this specif ic ati on is n ot im pl ie d. Ex pos ure to absolute maximum rating conditions for extended periods may affect device reliability.
32,768/65,536 x 8
2
AT25HP256/512
Page 3
AT25HP256/512
Pin Capacitance
(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).
Test Conditions Max Units Conditions
C
OUT
C
IN
Output Capacitance (SO) 8 pF V Input Capacitance (CS, SCK, SI, WP, HOLD)6pFV
OUT
IN
= 0V
= 0V
Note: 1. This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V,
= 0°C to +70°C, VCC = +1.8V to +5.5V (unless otherwise noted).
T
AC
Symbol Parameter Test Condition Min Typ Max Units
V
CC1
V
CC2
V
CC3
I
CC1
I
CC2
I
SB1
I
SB2
I
SB3
I
IL
I
OL
(1)
V
IL
(1)
V
IH
V
OL1
V
OH1
V
OL2
V
OH2
Note: 1. V
Supply Voltage 1.8 3.6 V Supply Voltage 2.7 5.5 V Supply Voltage 4.5 5.5 V Supply Current VCC = 5.0V at 5 MHz, SO = Open Read 6.0 10.0 mA Supply Current VCC = 5.0V at 5 MHz, SO = Open Write 4.0 7.0 mA Standby Current VCC = 1.8V, CS = V Standby Current VCC = 2.7V, CS = V Standby Current VCC = 5.0V, CS = V Input Leakage VIN = 0V to V
CC
CC
CC
CC
-3.0 3.0
0.1 2.0
0.2 2.0
2.0 5.0
Output Leakage VIN = 0V to VCC, TAC = 0°C to 70°C-3.0 3.0 Input Low Voltage -0.6 V
x 0.3 V
CC
Input High Voltage VCC x 0.7 VCC + 0.5 V Output Low Voltage Output High Voltage IOH = -1.6 mA VCC - 0.8 V
4.5V ≤ V
≤ 5.5V
CC
Output Low Voltage Output High Voltage IOH = -100 µAV
1.8V ≤ V
and VIH max are reference only and are not tested.
IL
≤ 3.6V
CC
I
= 3.0 mA 0.4 V
OL
I
= 0.15 mA 0.2 V
OL
- 0.2 V
CC
µ
A
µ
A
µ
A
µ
A
µ
A
3
Page 4
AC Characteristics
Applicable over recommended operating range from TA = -40°C to +85°C, VCC = As Specified,
= 1 TTL Gate and 30 pF (unless otherwise noted).
C
L
Symbol Parameter Voltage Min Max Units
f
SCK
SCK Clock Frequency
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
0 0 0
10
5
TBD
MHz
t
t
t
t
t
t
t
t
RI
FI
WH
WL
CS
CSS
CSH
SU
Input Rise Time
Input Fall Time
SCK High Time
SCK Low Time
CS High Time
CS Setup Time
CS Hold Time
Data In Setup Time
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
40 80
TBD
40 80
TBD
50
100
TBD
50
100
TBD
50
100
TBD
12 20
TBD
2 2
TBD
2 2
TBD
µ
µ
ns
ns
ns
ns
ns
ns
s
s
4.5 - 5.5
t
H
Data In Hold Time
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
t
HD
Hold Setup Time
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
t
CD
Hold Hold Time
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
t
V
Output Valid
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
t
HO
Output Hold Time
2.7 - 5.5
1.8 - 3.6
4
AT25HP256/512
10 20
TBD
25 50
TBD
25 50
TBD
0 0 0
0 0 0
40 80
TBD
ns
ns
ns
ns
ns
Page 5
AT25HP256/512
AC Characteristics (Continued)
Applicable over recommended operating range from TA = -40°C to +85°C, VCC = As Specified,
= 1 TTL Gate and 30 pF (unless otherwise noted).
C
L
Symbol Parameter Voltage Min Max Units
t
LZ
t
HZ
t
DIS
t
WC
Endurance
Note: 1. This parameter is characterized and is not 100% tested.
Hold to Output Low Z
Hold to Output High Z
Output Disable Time
Write Cycle Time
(1)
5.0V, 25°C, Page Mode
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
4.5 - 5.5
2.7 - 5.5
1.8 - 3.6
0 0 0
100K
100 200
TBD
100 200
TBD
100 100
TBD
5
10
TBD
Write
Cycles
ns
ns
ns
ms
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Page 6
Serial Interface Description
MASTER: SLAVE:
input, the AT25HP256/512 always operates as a slave.
TRANSMITTER/RECEIVER:
separate pins designated for data transmission (SO) and reception (SI).
MSB:
transmitted and received.
SERIAL OP-CODE:
going low, the first byte will be receiv ed. This byte co ntains the op-code that defines the operations to be performed.
INVALID OP-CODE:
data will be shifted in to th e A T25HP 256 /512, and the serial output pin (SO) will remain in a high impedance state until the falling edge of CS the serial communication.
CHIP SELECT:
pin is low. When the device is not selected, data will not
CS be accepted via the SI pin, and the seria l output pin (SO) will remain in a high impedance state.
HOLD:
pin to select the AT25HP256/512. When the device is selected and a serial sequence is underway, HOLD used to pause the se rial communica tion with the master device without resetting the serial sequence. To pause, the HOLD resume serial communication, the HOLD high while the SCK pin is low (SCK may still toggle during HOLD is in the high impedance state.
WRITE PROTECT:
normal read/ write opera tions when he ld high. Wh en the WP tions to the status registe r are inhibited. WP while CS ter. If the internal write cycle has already been initiated, WP going low will have no effect on any write operation to the
The device that generates the serial clock.
Because the Serial Clock pin (SCK) is always an
The AT25HP256/512 has
The Most Significant Bit (MSB) is the first bit
After the device is selected with CS
If an invalid op-code is received, no
is detected again. This will reinitialize
The AT25HP256/512 is sele cted whe n the
The HOLD
pin must be brought low while the SCK pin is low. To
). Inputs to the SI pin will be ignored while the SO pin
pin is brought low an d WPEN bit is “ 1”, all wr ite oper a-
is still low will interrupt a write to the status regis-
pin is us ed in conju nctio n wit h the CS
can be
pin is brought
The write protect pin (WP
) will allow
going low
status register. The WP WPEN bit in the statu s register is “0”. This wil l allow the user to install the AT25HP256/512 in a system with the WP pin tied to ground and still be able to write to the status reg­ister. All WP is set to “1”.
pin functions ar e enab led wh en the WPE N bit
pin function is blocked when the
SPI Serial Interface
AT25HP256/512
6
AT25HP256/512
Page 7
Functional Description
The AT25HP256/512 is designed to interface directly with the synchronous serial peripheral interface (SPI) of the 6800 type series of microcontrollers.
The AT25HP256/512 utilizes an 8-bit instruction register. The list of i nstruction s and th eir ope ration c odes ar e con­tained in Ta ble 1. All i nst ructi ons , add ress es, and dat a ar e transferred with the MSB first and start with a hi gh-to-low
transition.
CS
Table 1.
Instruction Name
WREN 0000 X110 Set Write Enable Latch WRDI 0000 X100 Reset Write Enable Latch RDSR 0000 X101 Re ad Status Regi ste r WRSR 0000 X001 Write Status Register READ 0000 X011 Read Data from Memory Array WRITE 0000 X010 Write Data to Memory Array
WRITE ENABLE (WREN):
write disable state when V instructions mus t t here fo re be p reced ed b y a Wr ite Enab le instruction.
WRITE DISABLE (WRDI):
inadvertent writes, the Wr it e Dis able i nst ru cti on disabl es all programming modes. The WRDI ins tructio n is ind ependen t of the status of the WP
READ STATUS REGISTER (RDSR):
Register instruction provides access to the status register. The READY/BUSY an d Write Enable sta tus of th e devic e can be determined by the RDSR instruction. Similarly, the Block Write Pr otec tion bits i ndic ate th e exten t o f prote ctio n employed. These bits are set by using the WRSR instru c­tion.
Table 2.
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
WPEN X X X BP1 BP0 WEN RDY
Instruction Set for the AT25HP256/512
Instruction Format Operation
The device will power u p in th e
is applied. All programming
CC
To protect the device against
pin.
The Read Status
Status Register Format
AT25HP256/512
Table 3.
Bit Definition
Bit 0 (RDY
Bit 1 (WEN) Bit 1= 0 indicates the device
Bit 2 (BP0) See Table 4. Bit 3 (BP1) See Table 4. Bits 4-6 are 0s when device is not in an internal write cycle. Bit 7 (WPEN) See Table 5. Bits 0-7 are 1s during an internal write cycle.
WRITE STATUS REGISTER (WRSR):
tion allows the user to select one of four levels of protec­tion. The AT25HP256/512 is div ided into four array segments. Top quarter (1/4), top half (1/2), or all of the memory segments can be protected. Any of the data within any selected segment will therefore be READ only. The block write prot ection le vels and corr espondi ng stat us reg­ister control bits are shown in Table 4.
The three bits, BP0, BP1, and WPEN are nonvolatile cells that have the same pro perties and functi ons as the regul ar memory cells (e.g. WREN, t
Table 4.
Level
000 None 1(1/4) 0 1 6000 - 7FFF/C000 - FFFF 2(1/2) 1 0 4000 - 7FFF/8000 - FFFF 3(All) 1 1 0000 - 7FFF/0000 - FFFF
The WRSR instruction also allows the user to enable or disable the write protect (WP Write Protect Enable (WPEN) bit. Hardware write protec­tion is ena bl e d wh en t h e W P “1”. Hardware write protection is disabled when WP hardware write protected, writes to the Status Register, including the Bloc k Protec t bits and the WPEN bi t, and the block-protected sec tions in the memor y arra y are disab led.
Read Status Register Bit Definition
) Bit 0 = 0 (RDY) indicates the device is
READ Y. Bit 0 = 1 indica tes the write cycle is in progress.
is not
WRITE ENABLED. Bit 1 = 1 indicates the device is WRITE ENABLED.
The WRSR instruc-
, RDSR).
WC
Block Write Protect Bits
Status Register Bits Array Addresses Protected
BP1 BP0 AT25HP256/512
) pin through the use of the
pin is low and the WPEN bit is
either
the
pin is high or the WPEN bit is “0.” When the device is
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Page 8
Writes are only allowed to sections of the memory which are not block-protected.
NOTE:
cannot be changed back to “0”, as long as the WP
When the WPEN bit is hardware write protected, it
pin is
held low.
Table 5.
WPEN WP WEN
READ SEQUENCE (READ):
WPEN Operation
Protected
Blocks
0 X 0 Protected Protected Protected 0 X 1 Protected Writable Writable 1 Low 0 Protected Protected Protected 1 Low 1 Protected Writable Protected X High 0 Protected Pr otected Protected X High 1 Protected Writable Writable
Unprotected
Blocks
Status
Register
Reading the AT25HP256/512 via the SO (Serial Output) pin requires the following sequence. After the CS
line is pulled low to select a device, the READ op-code is transmitted via the SI line followed by the byte a ddres s to be r ead (R efer to Tab le 6) . Upon completion, any data on the SI line will be ignored. The data (D7-D0 ) at the speci fied addres s is then sh ifted out onto the SO line . If only on e byte is to be read, th e CS line should be driven high after the data comes out. T he READ sequence can be continued since the byte address is automatically incremented and data will continue to be shifted out. When the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be rea d in one continuous REA D cycle.
WRITE SEQUENCE ( WRITE):
In order to program the AT25HP256/512, two separate instructions must be exe­cuted. First, the device
must be write enabled
via the Write Enable (WREN) Instruction. Then a Write (WRITE) Instruction may be executed. Also, the address of the memory location(s) t o be pr og r amm ed mu st b e out si de th e protected address field location selected by the Block Write
Protection Level. During an internal write c ycle, all com­mands will be ignored except the RDSR instruction.
A Write Instruc tion r equires the foll owing s equence. After the CS
line is pulled low to select the device, the WRITE op-code is transmitted via the S I line follo wed by the byte address and the data (D7- D0) to be programme d (Refer to Table 6). Programming will s tar t aft er the CS high. (The LOW to High transition of the CS
pin is brought
pin must occur during the SCK low ti me immedi ately after c locking in th e D0 (LSB) data bit.
The READY/BUSY status of the devic e can be determine d by initiating a READ STATUS REGISTER (RDSR) Instruc­tion. If Bit 0 = 1, the WRITE cycle is still in progress. If Bit 0 = 0, the WRITE cycle has ended. Only the READ STATUS REGISTER instruction is enabled during the WRITE pro­gramming cycle.
The AT25HP256/512 is capable of a 128-byte PAGE WRITE operation. After each by te of data is receiv ed, the seven low order address bits are intern ally incr emented by one; the high order bits of the address will remain constant. If more than 128-bytes of data are transmitted, the address counter will roll over and the previously written data will be overwritten. The AT25 HP256/5 12 is automa tically returne d to the write disable state at the completion of a WRITE cycle.
NOTE:
If the device is not Write enabl ed (WREN), the device will igno re the Wr it e instruction and wil l return to the standby state, when CS
is brought high. A new CS falli ng
edge is required to re-initiate the serial communication.
Table 6.
NOTE:
Address Key
Address AT25HP256/512
A
N
Don’t Care Bits A15 / none
A14 - A0 / A15 - A
128-byte PAGE WRITE operation only
0
. Content of the page in the array will not be guaranteed if less than 128 bytes of data is received (byte write is not supported).
8
AT25HP256/512
Page 9
Timing Diagrams (for SPI Mode 0 (0, 0))
Synchronous Data Timing
V
IH
CS
V
IL
t
CSS
V
IH
SKC
V
IL
V
IH
SI
V
IL
V
OH
SO
V
OL
WREN Timing
HI- Z
t
SU
VALID IN
t
WH
t
H
AT25HP256/512
t
CS
t
CSH
t
WL
t
V
t
HO
t
DIS
HI- Z
CS
SCK
SO
WRDI Timing
SI
CS
SCK
SI
SO
WRDI OP-CODE
HI-Z
9
Page 10
RDSR Timing
CS
01234567891011121314
SCK
WRSR Timing
SO
SI
HIGH IMPED
INSTRUCTION
ANCE
A OUT
DA T
76543210
MSB
READ Timing
10
AT25HP256/512
Page 11
WRITE Timing (AT25HP256)
CS
AT25HP256/512
SCK
SO
0123456789101120212223242526
BYTE ADDRESS
...
SI
INSTRUCTION
HIGH IMPEDANCE
15
14
13
3
2
10
65432
7
27 28 29 30 31
1ST BYTE DATA IN
1
0
11
Page 12
PAGE WRITE Timing (AT25HP512)
CS
SCK
SI
SO
HOLD Timing
HOLD
0123456789101120212223242526
INSTRUCTION
HIGH IMPEDANCE
15
BYTE ADDRESS
13
14
12
3
1st BYTE DATA IN
10
2
CS
t
CD
SCK
t
HD
t
HD
t
HZ
SO
10431044 1045 1046 1047
128
65432
7
t
CD
t
LZ
th
BYTE DATA IN
1
0
12
AT25HP256/512
Page 13
AT25HP256 Ordering Information
tWC (max)
(ms)
5
5
TBD
ICC (max)
(µµµµA)
8000 7.0 10000
8000 7.0 10000
4000 3.0 5000
4000 3.0 5000
TBD TBD TBD
TBD TBD TBD
ISB (max)
(µµµµA)
f
MAX
(kHz) Ordering Code Package Operation Range
AT25HP256-10CC AT25HP256C1-10CC AT25HP256-10PC AT25HP256W-10SC
AT25HP256-10CI AT25HP256C1-10CI AT25HP256-10PI AT25HP256W-10SI
AT25HP256-10CC-2.7 AT25HP256C1-10CC-2.7 AT25HP256-10PC-2.7 AT25HP256W-10SC-2.7
AT25HP256-10CI-2.7 AT25HP256C1-10CI-2.7 AT25HP256-10PI-2.7 AT25HP256W-10SI-2.7
AT25HP256-10CC-1.8 AT25HP256C1-10CC-1.8 AT25HP256-10PC-1.8 AT25HP256W-10SC-1.8
AT25HP256-10CI-1.8 AT25HP256C1-10CI-1.8 AT25HP256-10PI-1.8 AT25HP256W-10SI-1.8
AT25HP256/512
8C 8C1 8P3 8S2
8C 8C1 8P3 8S2
8C 8C1 8P3 8S2
8C 8C1 8P3 8S2
8C 8C1 8P3 8S2
8C 8C1 8P3 8S2
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Package Type
8C 8-Lead, 0.230" Wide, Leadless Array Package (LAP) 8C1 8-Lead, 0.300" Wide, Leadless Array Package (LAP) 8P3 8-Lead, 0.300" Wide, Plastic Dual In-line Package (PDIP) 8S2 8-Lead, 0.300" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
Options
Blank Standard Device (4.5V to 5.5V)
-2.7 Low Voltage (2.7V to 5.5V)
-1.8 Low Voltage (1.8V to 3.6V)
13
Page 14
AT25HP512 Ordering Information
tWC (max)
(ms)
5
5
TBD
ICC (max)
(µµµµA)
8000 7.0 10000
8000 7.0 10000
4000 3.0 5000
4000 3.0 5000
TBD TBD TBD
TBD TBD TBD
ISB (max)
(µµµµA)
f
MAX
(kHz) Ordering Code Package Operation Range
AT25HP512C1-10CC AT25HP512-10PC
AT25HP512C1-10CI AT25HP512-10PI
AT25HP512C1-10CC-2.7 AT25HP512-10PC-2.7
AT25HP512C1-10CI-2.7 AT25HP512-10PI-2.7
AT25HP512C1-10CC-1.8 AT25HP512-10PC-1.8
AT25HP512C1-10CI-1.8 AT25HP512-10PI-1.8
8C1 8P3
8C1 8P3
8C1 8P3
8C1 8P3
8C1 8P3
8C1 8P3
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Package Type
8C1 8-Lead, 0.300" Wide, Leadless Array Package (LAP) 8P3 8-Lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
Blank Standard Device (4.5V to 5.5V)
-2.7 Low Voltage (2.7V to 5.5V)
-1.8 Low Voltage (1.8V to 3.6V)
14
AT25HP256/512
Options
Page 15
Packaging Information
AT25HP256/512
8C
, 8-Lead, 0.230" Wide, Leadless Array Package (LAP) Dimensions in Inches and (Millimeters)
SIDE
5.15 (0.203)
4.85 (0.191)
1.27 (0.050) TYP
TOP VIEW
6.15 (0.242)
5.85 (0.230)
BOTTOM VIEW
8
7
6
5
0.64 (0.025) TYP
1
2
3
4
VIEW
0.41 (0.016) TYP
1.30 (0.051)
1.00 (0.039)
0.42 (0.017)
0.34 (0.013)
8C1
, 8-Lead, 0.300" Wide, Leadless Array Package (LAP) Dimensions in Inches and (Millimeters)
SIDE
5.15 (0.203)
4.85 (0.191)
1.27 (0.050) TYP
TOP VIEW
8.15 (0.321)
7.85 (0.309)
BOTTOM VIEW
8
7
6
5
0.64 (0.025) TYP
1
2
3
4
VIEW
0.41 (0.016) TYP
1.30 (0.051)
1.00 (0.039)
0.42 (0.017)
0.34 (0.013)
8P3
, 8-Lead, 0.300" Wide, Plastic Dual In-line Package (PDIP) Dimensions in Inches and (Millimeters)
JEDEC STA NDARD MS-001 BA
.400 (10.16) .355 (9.02)
PIN
1
.037 (.940)
.300 (7.62) REF
.210 (5.33) MAX
SEATING
PLANE
.150 (3.81) .115 (2.92)
.012 (.305) .008 (.203)
.070 (1.78) .045 (1.14)
.027 (.690)
.100 (2.54) BSC
.015 (.380) MIN
.022 (.559) .014 (.356)
.325 (8.26) .300 (7.62)
0
REF
15
.430 (10.9) MAX
.280 (7.11) .240 (6.10)
8S2
, 8-Lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC) Dimensions in Inches and (Millimeters)
.020 (.508) .012 (.305)
PIN 1
0 8
.213 (5.41) .205 (5.21)
.050 (1.27) BSC
.212 (5.38) .203 (5.16)
.013 (.330) .004 (.102)
REF
.035 (.889) .020 (.508)
.330 (8.38) .300 (7.62)
.080 (2.03) .070 (1.78)
.010 (.254) .007 (.178)
15
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