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August 2005 ASM3P18S19B
rev 2.1
Notebook LCD Panel EMI Reduction IC
Features
FCC approved method of EMI attenuation.
Provides up to 15dB EMI reduction.
Generates a low EMI Spread Spectrum clock and a
non-spread reference clock of the input frequency.
Optimized for Frequency range from 20 to 40MHz.
Internal loop filter minimizes external components and
board space.
Low Inherent Cycle-to-Cycle jitter.
Two spread % selections: -1.25% to -1.75%.
3.3V Operating Voltage.
Low power CMOS design.
Supports notebook VGA and other LCD timing
controller applications.
Power Down function for mobile application.
Available in Commercial temperature range.
Available in 8-pin SOIC and TSSOP Packages.
RoHS Compliant
Product Description
The ASM3P18S19B is a Versatile Spread Spectrum
Frequency Modulator designed specifically for input clock
frequencies from 20 to 40MHz. (Refer Input Frequency and
Modulation Rate Table). The ASM3P18S19B reduces
electromagnetic interference (EMI) at the clock source,
allowing system wide reduction of EMI of down stream
clock and data dependent signals. The ASM3P18S19B
Block Diagram
PD#
allows significant system cost savings by reducing the
number of circuit board layers, ferrite beads, shielding, and
other passive components that are traditionally required to
pass EMI regulations.
The ASM3P18S19B modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of its
harmonics. This results in significantly lower system EMI
compared to the typical narrow band signal produced by
oscillators and most frequency generators. Lowering EMI
by increasing a signal’s bandwidth is called ‘Spread
Spectrum Clock Generation’.
The ASM3P18S19B uses the most efficient and optimized
modulation profile approved by the FCC and is
implemented in a proprietary all digital method.
Applications
The ASM3P18S19B is targeted towards EMI management
for memory and LVDS interfaces in mobile graphic chipsets
and high-speed digital applications such as PC peripheral
devices, consumer electronics, and embedded controller
systems.
SRS
VDD
PLL
VCO
XIN/CLKIN
XOUT
REF
Crystal
Oscillator
Frequency
Divider
Feedback
Divider
Modulation
Phase
Detector
Alliance Semiconductor
Loop
Filter
VSS
2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com
Notice: The information in this document is subject to change without notice.
Output
Divider
ModOUT
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August 2005
ASM3P18S19B
rev 2.1
Pin Configuration
Pin Description
Pin# Pin Name Type Description
1 XIN / CLKIN I
2 VSS P Ground Connection. Connect to system ground.
3 SRS I
4 ModOUT O
5 REF O Non-modulated Reference clock output of the input frequency.
6 PD# I
7 VDD P Power Supply for the entire chip.
8 XOUT O
Input Frequency and Modulation Rate
XIN/ CLKIN
VSS
SRS
ModOUT
1
2
ASM3P18S19B
3
4
Crystal Connection or external frequency input.This pin has dual
functions. It can be connected to either an external crystal or an external
reference clock
Spread range select. Digital logic input used to select frequency deviation
(Refer Spread Deviation Selection Table). This pin has an internal pull-up
resistor.
Spread spectrum clock output. (Refer Input Frequency and Modulation
Rate Table and Spread Deviation Selection Table)
Power down control pin. Pull LOW to enable Power-Down mode. This pin
has an internal pull-up resistor.
Crystal Connection. Input connection for an external crystal. If using an
external reference, this pin must be left unconnected.
XOUT
8
7
VDD
6
PD#
REF
5
Part Number Input Frequency Range Output Frequency range Modulation rate
ASM3P18S19B 20MHz to 40MHz 20MHz to 40MHz Input Frequency / 512
Spread Deviation Selection
Part Number SRS Spread Deviation
ASM3P18S19B
0 -1.25% (DOWN)
1 -1.75% (DOWN)
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August 2005
ASM3P18S19B
rev 2.1
Absolute Maximum Ratings
Symbol Parameter Rating Unit
VDD, VIN Voltage on any pin with respect to Ground -0.5 to +7.0 V
T
Storage temperature -65 to +125 °C
STG
TA Operating temperature 0 to 70 °C
Ts Max. Soldering Temperature (10 sec) 260 °C
TJ Junction Temperature 150 °C
TDV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol Parameter Min Typ Max Unit
VIL Input Low voltage VSS - 0.3 - 0.8 V
VIH Input High voltage 2.0 - VDD + 0.3 V
IIL Input Low current (inputs PD#, SRS) -60.0 - -20.0 µA
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
2 KV
IIH Input High current - - 1.0 µA
I
X
XOL
I
X
XOH
Output low current @ 0.4V, VDD = 3.3V - 3 - mA
OUT
Output high current @ 2.5V, VDD = 3.3V - 3 - mA
OUT
VOL Output Low voltage VDD = 3.3V, IOL = 20mA - - 0.4 V
VOH Output High voltage VDD = 3.3V, IOH = 20mA 2.5 - - V
ICC
Dynamic supply current normal mode
3.3V and 25pF probe loading
fIN
7.1
- min
-
26.9
f
IN - max
mA
IDD Static supply current standby mode - 4.5 - mA
VDD Operating Voltage - 3.3 - V
tON Power up time (first locked clock cycle after power up) - 0.18 - mS
Z
Clock Output impedance - 50 - Ω
OUT
AC Electrical Characteristics
Symbol Parameter Min Typ Max Unit
fIN Input Frequency 20 - 40 MHz
f
Output Frequency 20 - 40 MHz
OUT
tLH*
tHL*
tJC Jitter (Cycle to Cycle) -200 - 200 pS
tD Output Duty cycle 45 50 55 %
Output Rise time
Measured from 0.8V to 2.0V
Output Fall time
Measured from 0.8V to 2.0V
- 0.66 - nS
- 0.65 - nS
*tLH and tHL are measured into a capacitive load of 15pF
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August 2005
ASM3P18S19B
rev 2.1
Package Information
D
e
B
Symbol
8-lead (150-mil) SOIC Package
H
E
A2
A
A1
D
θ
L
Dimensions
Inches
Millimeters
Min Max Min Max
A1 0.004 0.010 0.10 0.25
A 0.053 0.069 1.35 1.75
A2 0.049 0.059 1.25 1.50
B 0.012 0.020 0.31 0.51
C 0.007 0.01 0.18 0.25
D 0.193 BSC 4.9 BSC
E 0.154 BSC 3.91 BSC
e 0.050 BSC 1.27 BSC
H 0.236 BSC 6.00 BSC
L 0.016 0.050 0.41 1.27
Note: Controlling dimensions are millimeters
SOIC – 0.074 grams unit weight
θ 0° 8° 0° 8°
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Notice: The information in this document is subject to change without notice.
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August 2005
rev 2.1
ASM3P18S19B
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)
H
E
D
e
B
A2
A
θ
A1
L
Symbol
Inches Millimeters
Min Max Min Max
A
A1 0.002 0.006 0.05 0.15
A2 0.033 0.037 0.85 0.95
B 0.008 0.012 0.19 0.30
C 0.004 0.008 0.09 0.20
D 0.114 0.122 2.90 3.10
E 0.169 0.177 4.30 4.50
e 0.026 BSC 0.65 BSC
H 0.252 BSC 6.40 BSC
L 0.020 0.028 0.50 0.70
θ 0° 8° 0° 8°
Note: Controlling dimensions are millimeters
TSSOP – 0.0325 grams unit weight
Dimensions
0.043
1.10
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August 2005
ASM3P18S19B
rev 2.1
Ordering Information
Part Number Marking Package Type Temperature
ASM3P18S19BF-08TT 3P18S19BF 8-Pin TSSOP, TUBE, RoHS Compliant Commercial
ASM3P18S19BF-08TR 3P18S19BF 8-Pin TSSOP, TAPE & REEL ,RoHS Compliant Commercial
ASM3P18S19BF-08ST 3P18S19BF 8-Pin SOIC, TUBE, RoHS Compliant Commercial
ASM3P18S19BF-08SR 3P18S19BF 8-Pin SOIC, TAPE & REEL, RoHS Compliant Commercial
ASM3P18S19B-08TT 3P18S19B 8-Pin TSSOP, TUBE Commercial
ASM3P18S19B-08TR 3P18S19B 8-Pin TSSOP, TAPE & REEL Commercial
ASM3P18S19B-08ST 3P18S19B 8-Pin SOIC, TUBE Commercial
ASM3P18S19B-08SR 3P18S19B 8-Pin SOIC, TAPE & REEL Commercial
ASM3P18S19BG-08TT 3P18S19BG 8-Pin TSSOP, TUBE, Green Commercial
ASM3P18S19BG-08TR 3P18S19BG 8-Pin TSSOP, TAPE & REEL, Green Commercial
ASM3P18S19BG-08ST 3P18S19BG 8-Pin SOIC, TUBE, Green Commercial
ASM3P18S19BG-08SR 3P18S19BG 8-Pin SOIC, TAPE & REEL, Green Commercial
Products are available for industrial temperature range operation. Please contact factory for more information.
Device Ordering Information
ASM3P18S19BF-08TR
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
R = Tape & reel, T = Tube or Tray
O = SOT U = MSOP
S = SOIC E = TQFP
T = TSSOP L = LQFP
A = SSOP U = MSOP
V = TVSOP P = PDIP
B = BGA D = QSOP
=
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE
PART NUMBER
X= Automotive I= Industrial P or n/c = Commercial
(-40C to +125C) (-40C to +85C) (0C to +70C)
1 = Reserved 6 = Power Management
2 = Non PLL based 7 = Power Management
3 = EMI Reduction 8 = Power Management
4 = DDR support products 9 = Hi Performance
5 = STD Zero Dela
ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT
Buffer 0 = Reserved
=
-
Notebook LCD Panel EMI Reduction IC 6 of 7
Notice: The information in this document is subject to change without notice.
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August 2005
ASM3P18S19B
rev 2.1
Alliance Semiconductor Corporation
2575 Augustine Drive,
Santa Clara, CA 95054
Tel# 408-855-4900
Fax: 408-855-4999
www.alsc.com
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their
respective companies. Alliance reserves the right to make changes to this document and its products at any time without
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this
data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual
property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance).
All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of
products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any
other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical
components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant
injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer
assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.
Copyright © Alliance Semiconductor
All Rights Reserved
Preliminary Information
Part Number: ASM3P18S19B
Document Version: v2.1
Notebook LCD Panel EMI Reduction IC 7 of 7
Notice: The information in this document is subject to change without notice.
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