
6F-3 NO.7, LANE 75, TA-AN ROAD, SEC.1, TAIPEI, TAIWAN, R.O.C.
http://www.aplusinc.com.tw
台北市大安路一段75巷7號6F-3 TEL:886-2-27818277 FAX:886-2-27815779
ASM12712C/17012C
DATA SHEET

1.0 General Description
– VERY LOW-COST VOICE SYNTHESIZER WITH 4-BIT
The ASM12712C/17012C is very low cost voice synthesizer with 4-bit microprocessor. It has various
features including 4-bit ALU, ROM, RAM, I/O ports, timers, clock generator, watchdog timer(WDT),
voicesynthesizer, etc. It consists of 22 instructions in the device. With CMOS technology and halt
functioncan minimize power dissipation. Its architecture is similar to RISC, with two stages of
instructionpipeline. It allows all instructions to be executed in a single cycle, except for program
branches and data table read instructions (which need two instruction cycles).
1.1 Feature
Single power supply can operate from 2.4V through 5V
Internal Program ROM: 4K x 10-bit
1 sets of 19-bit DPR can access up to 512K x 10 bits data memory space
Data Registers:
• 96 x 4-bit data RAM (00-1Fh plus 40h-7Fh)
• Unbanked special function registers (SFR) range: 20h-3Fh
I/O Ports:
• PRA: 4-bit I/O Port A (2Bh)
• PRB: 4-bit Output Port B (2Dh)
• PRC: 4-bit Input Port C (2Fh)
On-chip clock generator: Resistive Clock Drive(RM)
Timer: 1
• Timer0: a 9-bit auto-reload timer/counter
Stack: 2-level subroutine nesting
HALT and Release from HALT function to reduce power consumption
Watch Dog Timer (WDT)
Instruction: 1-cycle instruction except for table read and program branches which are 2-cycles
Number of instruction: 22
1

FIGURE 1.1 : Block Diagram of ASM12712C/17012C
Data Bus[3:0]
(ADDR[18:12])
=0000000b
COUT
PCLATCH(8)
PCH(8) PCL(4)
DPR3,2,1
DLATCH(10)
Data Bus[3:0
Accumlator
ALU(4)
Register(4)
One-Channel
( Voice synthesizer )
COUT
PC[11:0]
ADDR[18:0]
DPR[18:0]
P1,P2,P3,P4
enter test mode
Reset Chip
Reset Chip
ROM_Data[9:0]
Immediate(4
Stack
(2-Level)
ROM_ADDR[18:0]
Program
(Data)
ROM
SRAM
(96 x 4)
00h-1Fh
40h-7Fh
Clock Generator
Tes t s el ect
Power on Reset
RESET pin
Instruction Bus [9:0]
Instruction Bus [9:0]
Timer0(9)
OSC
VDD/GND
PRA0
ROM Latch
Instruction
Latch
Instruction
Decoder
Control Signal
Instruction Bus [9:0]
PRA(4)
PRB(4)
PRC(4)
weak or strong
pull-low for PRA,
PRB, PRC
PRASL(4)
2
Rev 1.0

FIGURE 1.2 : External ROM Map of ASM12712C/17012C
PC[11:0]
12bit x 2 STACK
00000h-7FFFFh
19-bit Data Pointer
Reserved for Testing
ram and data ROM
Pro
Data ROM
Reset Vector
00000h
00080h
00080h-003FFh
00400h
00000h-00FFFh
00FFFh(4K)
7FFFFh(512Kx10-bits)
3
Rev 1.0

1.2 Pin-Out
ASM12712C/17012C Pin-Out
VDD3
PRC1
PRC0/RESET
PRA3-1
PRA0/RESET
OSC
VDD1
COUT
GND1
GND2
TEST
VDD2
PRB0-3
PRC2-3
GND3
I - Third Power supply during operation
ISTI
Std./O.D.
ISTI
Std./O.D.
I/O STI
Std./O.D.
I/O STI
Std./O.D.
I - RM mode Oscillator input
I - First Power supply during operation
O - Current Output of Audio
I - First Circuit Ground Potential
I - Second Circuit Ground Potential
O - Enter Test Mode. ( TEST = High )
I - Second Power supply during operation
O Std./O.D. Output type with standard or Open-Drain output
ISTI
Std./O.D.
I - Third Circuit Ground Potential
Input port with programmable strong pull-low or weak pull-low or fix-inputfloating capability
Input port with programmable strong pull-low or weak pull-low or fix-inputfloating capability
Mask option selected as an external RESET pin with weak pull-low capability
I/O port with programmable strong pull-low or weak pull-low or fix-inputfloating capability
Output type with standard or Open-Drain output
I/O port with programmable strong pull-low or weak pull-low or fix-inputfloating capability
Output type with standard or Open-Drain output
Mask option selected as an external RESET pin with weak pull-low capability
Input port with programmable strong pull-low or weak pull-low or fix-inputfloating capability
1.3 Application circuit
4
Rev 1.0

1.4 Bonding Diagram
3
4 5 6 7 8 9 10 1112 13 1817161514 2 1 19 20 21
(256K x 10 bit) x 2-Block ROM
CH IP SIZE: X= 309 0 + 100 (um), Y= 314 0 + 100 (u m)
ASM12712C/17012C Pad Location
PAD# PAD Name X Y PAD # PAD Name X Y
1 VDD3 -1445.96 -1456.08 12 GND2 118.72 -1450.56
2 RC_PAD[1] -1325.24 -1456.08 13 TEST_PAD 319.68 -1456.08
3 RC_PAD[0] -1202.92 -1456.08 14 VDD2 575.32 -1456.08
RA_PAD[3]
4
5 RA_PAD[2] -958.28 -1456.08 16 RB[1] 836.8 -1456.08
6 RA_PAD[1] -835.96 -1456.08 17 RB[2] 959.12 -1456.08
RA_PAD[0]/RESET
7
8 AOSC_PAD -591.32 -1456.08 19 RC_PAD[2] 1203.76 -1456.08
9 VDD1 -414.36 -1456.08 20 RC_PAD[3] 1326.08 -1456.08
10 ACOUT -162.24 -1456.08 21 GND3 1449.36 -1456.08
11 GND1 38.72 -1450.56
-1080.6 -1456.08 15 RB[0] 714.48 -1456.08
-713.64 -1456.08 18 RB[3] 1081.44 -1456.08
Chip Size: X= 3090 + 100 (um) , Y= 3140 + 100 (um)
5
Rev 1.0

1.5 DC Characteristics for ASM12712C/17012C
SYMBOL PARAMETER VDD MIN. TYP. MAX. UNIT CONDITION
VDD
Isb
Iop
Iih
Ioh
Iol
dF/F
dF/F Fosc VARIATION -20 20 %
OPERATING
VOLTAGE
SUPPLY
STANDBY
CURREN
T
OPERATING
INPUT CURRENT
/Internal pull low
OUTPUT HIGH
CURRENT
OUTPUT LOW
CURRENT
FREQUENCY
STABILITY
2.4 3 5 V depending on Freq.
31
51
32
57
uA
mA
33
59
uA
5 -5.2
4MHz, RM
in HALT Mode
4MHz, RM
IO Floating
4MHz, RM
in HALT Mode
(IO Ports with
weak pull-high
3-3
5-8
37
mA
4MHz, RM
(IO ports)
520
Fosc(3v)-
-10 10 %
Fosc(2.4v)
VDD=3V,
Rosc=740k, 4MHz
pull-low)
Fosc (3v)
FIGURE 1.3 : Frequency Range for Rosc in RM mode
Resistor(k ohm) 1200 1000 820 470
3v Freq.(MHz)
8
6
4
Freq. MHz
2
0
0 200 400 600 800 1000 1200 1400
2.47 3.04 3.31 6.25
Rosc & Freq.
6.25
Rosc k ohm
3.31
3.04
2.47
6
Rev 1.0