The AS7C4098A is a high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) device organized as
262,144 words × 16 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are
desired.
Equal address access and cycle times (t
for high-performance applications. The chip enable input CE
systems.
When CE
is high the device enters standby mode. The device is guaranteed not to exceed 55mW power consumption in CMOS
standby mode. A write cycle is accomplished by asserting write enable (WE
O1–I/O16 is written on the rising edge of WE
should drive I/O pins only after outputs have been disabled with output enable (OE
A read cycle is accomplished by asserting output enable (OE
drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or
write enable is active, output drivers stay in high-impedance mode.
The device provides multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be
written and read. LB
controls the lower bits, I/O1–I/O8, and UB controls the higher bits, I/O9–I/O16.
All chip inputs and outputs are TTL- and CMOS-compatible, and operation is for 5.0V (AS7C4098A) supply. The device is
available in the JEDEC standard 400-mL, 44-pin SOJ, TSOP 2 packages.
, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5/6 ns are ideal
AA
permits easy memory expansion with multiple-bank memory
) and chip enable (CE). Data on the input pins I/
(write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices
) or write enable (WE).
) and chip enable (CE), with write enable (WE) high. The chip
Absolute maximum ratings
ParameterSymbolMinMaxUnit
Voltage on V
Voltage on any pin relative to GNDV
Power dissipationP
Storage temperature (plastic)T
Ambient temperature with V
DC current into outputs (low)I
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Truth table
CEWEOELBUBI/O1–I/O8I/O9–I/O16Mode
HXXXX High Z High Z Standby (I
LHHXX
LXXHH
LHL
LLX
Key: X = Don’t care, L = Low, H = High.
relative to GNDV
CC
appliedT
CC
LH D
LL D
LH D
HL High ZD
LL D
t1
t2
D
stg
bias
OUT
–0.50+7.0V
–0.50VCC +0.50V
–1.5W
–65+150°C
–55 +125°C
–±20mA
, I
)
SB
SB1
High ZHigh ZOutput disable (I
OUT
OUT
IN
IN
High Z
OUT
D
OUT
High Z
IN
D
IN
Read (I
Writ e (I
)
CC
)HL High ZD
CC
)
CC
2/21/06, v 1.2Alliance SemiconductorP. 2 of 11
Page 3
Recommended operating conditions
ParameterSymbolMinTy picalMaxUnit
Supply voltageV
Input voltage
Ambient operating temperature
*
max = V
V
IH
**
V
min = –1.0V for pulse width less than 5 nS.
IL
+ 1.5V for pulse width less than 5 nS.
CC
commercialT
industrialT
AS7C4098A
®
(10/12/15/20)4.55.05.5V
CC
*
V
IH
**
V
IL
A
A
2.2–VCC + 0.5V
–0.5–0.8V
0– 70°C
–40–85°C
DC operating characteristics (over the operating range)
ParameterSymbolSignalsTes t c on di t io n sMaxUnit
Input capacitanceC
I/O capacitanceC
2/21/06, v 1.2Alliance SemiconductorP. 3 of 11
IN
I/O
A, CE, WE, OE, UB, LBVIN = 0V6pF
I/OVIN = V
= 0V8pF
OUT
Page 4
AS7C4098A
®
Read cycle (over the operating range)
ParameterSymbol
Read cycle time
Address access time
Chip enable (CE
Output enable (OE
) access time
) access time
Output hold from address change
CE
Low to output in low Z
CE
High to output in high Z
OE
Low to output in low Z
OE
High to output in high Z
LB
, UB access time
LB
, UB Low to output in low Z
LB
, UB High to output in high Z
Power up time
Power down time
t
t
t
ACE
t
t
t
CLZ
t
CHZ
t
OLZ
t
OHZ
t
t
BLZ
t
BHZ
t
t
RC
AA
OE
OH
BA
PU
PD
2,8
–10–12–15–20
Unit NotesMinMaxMinMaxMinMax MinMax
10 – 12–15–20– ns
– 10 –12–15–20ns
– 10 –12–15–20ns
– 5 –6–6–6ns
3 – 3–3–3–ns4
3 – 3–3–3–ns3, 4
– 5 –6–7–9ns3, 4
0 – 0–0–0–ns3, 4
– 5 –6–7–9ns3, 4
– 5 –6–7–8ns
0 – 0–0–0–ns
– 5 –6–7–9ns
0 – 0–0–0–ns4
– 10 –12–15–20ns 4
Key to switching waveforms
Read waveform 1 (address controlled)
Address
t
OH
Data
OUT
5,6,8
t
AA
Undefined/don’t careFalling inputRising input
t
RC
t
OH
Data validPrevious data valid
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Page 5
AS7C4098A
®
Read waveform 2 (CE, OE, UB, LB controlled)
Address
t
AA
OE
t
t
OLZ
CE
LB, UB
t
BLZ
Data
OUT
Write cycle (over the operating range)
ParameterSymbol
t
CLZ
9
OE
t
ACE
t
BA
–10–12–15–20
5,7,8
t
RC
t
OHZ
t
OH
t
CHZ
t
BHZ
Data valid
UnitNoteMinMaxMinMaxMinMaxMinMax
Write cycle time
Chip enable (CE)
to write end
Address setup to write end
Address setup time
Write pulse width (OE
Write pulse width (OE
= High)
= Low)
Write recovery time
Address hold from end of write
Data valid to write end
Data hold time
Write enable to output in High-Z
Output active from write end
Byte enable Low to write end
t
WC
t
CW
t
AW
t
t
WP1
t
WP2
t
WR
t
t
DW
t
t
WZ
t
OW
t
BW
AS
AH
DH
10–12–15–20– ns
7–8–10–12–ns
7–8–10–12–ns
0–0–0–0–ns
7–8–10–12–ns
10–12–15–20– ns
0–0–0–0–ns
0–0–0–0–ns
5–67–9–ns
0–0–0–0–ns3, 4
25262729ns3, 4
3–3–3–3–ns3, 4
7–8–10–12–ns3, 4
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Page 6
Write waveform 1(WE controlled)9
Address
CE
LB, UB
WE
Data
IN
Data
OUT
t
AS
Data undefined
t
AW
t
t
t
t
WZ
WC
CW
BW
AS7C4098A
®
t
AH
t
WR
t
WP
t
DW
Data valid
t
DH
High Z
t
OW
Write waveform 2 (CE controlled)9
Address
t
AS
CE
LB, UB
WE
Data
IN
t
AW
t
WC
t
t
t
CW
BW
WP
t
DW
t
t
Data valid
AH
WR
t
DH
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Page 7
AS7C4098A
®
Write waveform 3
Address
CE
LB, UB
WE
Data
IN
Data
OUT
9
t
WC
t
AS
High ZHigh Z
t
CW
t
AW
t
BW
t
WP
t
DW
t
WZ
Data undefined
Data valid
t
t
AH
WR
t
DH
AC test conditions
- Output load: see Figure B.
- Input pulse level: GND to V
- Input rise and fall times: 2 ns. See Figure A.
- Input and output timing reference levels: 1.5V.
V
0.5V
CC -
GND
90%
10%
2 ns
Figure A: Input pulse
Notes
1During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
2For test conditions, see AC Test Conditions, Figures A and B.
3t
and t
CLZ
4This parameter is guaranteed, but not tested.
5WE
is High for read cycle.
6CE
and OE are Low for read cycle.
7Address valid prior to or coincident with CE
8All read cycle timings are referenced from the last valid address to the first transitioning address.
9All write cycle timings are referenced from the last valid address to the first transitioning address.
10 C = 30 pF, except on High Z and Low Z parameters, where C = 5 pF.
are specified with CL = 5pF as in Figure B. Transition is measured ±500mV from steady-state voltage.