The AS7C4096 and AS7C34096 are high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) devices
organized as 524,288 words × 8 bits. They are designed for memory applications where fast data access, low power, and simple
interfacing are desired.
Equal address access and cycle times (t
ideal for high-performance applications. The chip enable input CE
systems.
When CE
is high the device enters standby mode. The AS7C4096 is guaranteed not to exceed 110 mW power consumption in
CMOS standby mode. Both devices offer 2.0V data retention.
A write cycle is accomplished by asserting write enable (WE
on the rising edge of WE
(write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins
only after outputs have been disabled with output enable (OE
A read cycle is accomplished by asserting output enable (OE
I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write
enable is active, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single supply voltage. Both devices are available in the
industry standard 400-mil 36-pin SOJ and 44-pin TSOP II packages.
, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5/6/7/8 ns are
AA
permits easy memory expansion with multiple-bank memory
) and chip enable (CE). Data on the input pins I/O1–I/O8 is written
) or write enable (WE).
) and chip enable (CE), with write enable (WE) high. The chip drives
Absolute maximum ratings
ParameterDeviceSymbolMinMaxUnit
Vol tag e o n V
relative to GND
CC
AS7C4096V
AS7C34096V
Voltage on any pin relative to GNDV
Power dissipationP
Storage temperature (plastic)T
Te m p er a t u re w i t h V
appliedT
CC
DC current unto output (low)I
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional oper-
ation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
t1
t1
t2
D
stg
bias
OUT
–1+7.0V
–0.5+5.0V
–0.5VCC +0.5V
–1.0W
–65+150°C
–55+125°C
–20mA
Truth table
CE
HXXHigh ZStandby (I
LHHHigh ZOutput disable (I
LHLD
LLXD
Key: X = Don’t care, L = Low, H = High
WEOEDataMode
OUT
IN
Read (ICC)
Write (ICC)
, I
)
SB
SB1
)
CC
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Page 3
Recommended operating condition
ParameterDeviceSymbolMinNominalMaxUnit
Supply voltage
Input voltage
Ambient operating
temperature
†
VIL min = –3.0V for pulse width less than tRC/2.
commercialT
industrialT
AS7C4096V
AS7C34096V
AS7C34096V
(12/15/20)4.55.05.5V
CC
CC
(12/15/20)3.03.33.6V
CC
AS7C4096V
AS7C34096V
AS7C4096
AS7C34096
®
(–10)3.153.303.6V
IH
IH
V
IL
A
A
2.2–VCC + 0.5V
2.0–VCC + 0.5V
†
–0.5
–0.8V
0– 70°C
–40–85°C
DC operating characteristics (over the operating range)
Data retention characteristics (over the operating range)13
ParameterSymbolTest conditionsMinMaxUnit
for data retentionV
V
CC
Data retention currentI
Chip deselect to data retention timet
Operation recovery timet
Input leakage current|I
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DR
CCDR
CDR
R
|–1µA
LI
VCC = 2.0V
CE
≥ V
V
≥ V
IN
V
CC
CC
≤ 0.2V
IN
– 0.2V
– 0.2V or
2.0–V
–500µA
0–ns
t
RC
–ns
Page 6
Data retention waveform
AS7C4096
AS7C34096
®
Data retention mode
V
CC
CE
V
CC
t
CDR
V
IH
VDR ≥ 2.0V
V
DR
AC test conditions
- Output load: see Figure B or Figure C.
- Input pulse level: GND to 3.0V. See Figures A, B, and C.
- Input rise and fall times: 2 ns. See Figure A.
- Input and output timing reference levels: 1.5V.
+3.0V
GND
90%
10%
2 ns
Figure A: Input pulse
90%
10%
D
OUT
255WC(14)
Figure B: 5V Output load
Notes
1During V
2This parameter is sampled, but not 100% tested.
3For test conditions, see AC Test Conditions.
4t
CLZ
5This parameter is guaranteed, but not tested.
6WE
7CE
8Address valid prior to or coincident with CE
9All read cycle timings are referenced from the last valid address to the first transitioning address.
10 CE
11 All write cycle timings are referenced from the last valid address to the first transitioning address.
12 Not applicable.
13 2V data retention applies to commercial temperature range operation only.
14 C = 30pF, except at high Z and low Z parameters, where C = 5pF.
power-up, a pull-up resistor to V
CC
and t
is HIGH for read cycle.
and OE are LOW for read cycle.
or WE must be HIGH during address transitions. Either CE or WE asserting high terminates a write cycle.
are specified with CL = 5pF as in Figure C. Transition is measured ±500 mV from steady-state voltage.
CHZ
on CE is required to meet ISB specification.
CC
transition Low.
+5V
480W
GND
V
CC
t
R
V
IH
Thevenin equivalent:
OUT
168W
+1.728V
D
+3.3V
320W
D
OUT
350WC(14)
GND
Figure C: 3.3V Output load
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Page 7
AS7C4096
AS7C34096
®
Typical DC and AC characteristics
Normalized supply current ICC, I
vs. supply voltage V
1.4
1.2
I
SB
1.0
, I
CC
0.8
CC
0.6
I
0.4
Normalized I
SB
0.2
0.0
MIN
NOMINAL
Supply voltage (V)
Normalized access time t
vs. supply voltage V
1.5
1.4
Ta = 25° C
1.3
1.2
SB
CC
MAX
AA
CC
12
Normalized supply current ICC, I
vs. ambient temperature T
1.4
1.2
SB
1.0
, I
CC
0.8
0.6
0.4
Normalized I
0.2
0.0
–558012535–10
Ambient temperature (°C)
Normalized access time t
vs. ambient temperature T