The AS7C1024A and AS7C31024A are high performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized as
131,072 words x 8 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5, 6, 7, 8 ns are ideal for high
performance applications. Active high and low chip enables (CE1, CE2) permit easy memory expansion with multiple-bank systems.
When CE1 is high or CE2 is low the devices enter standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is
static, then full standby pow er is reached (I
conditions. All devices in this family will retain data when VCC is reduced as low as 2.0V.
A write cycle is accomplished by asserting write enable (WE) and both chip enables (CE1, CE2). Data on the input pins I/O0-I/O7 is wr itten
on the rising edge of WE
should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE) and both chip enables (CE1, CE2), with write enable (WE) high. The chips drive
I/O pins with the data word referenced by the input address. When either chip enable is inactive, output enable is inactive, or write enable is
active, output drivers stay in high-impedance mode.
(write cycle 1) or the active-to-inactive edge of CE1 or CE2 (write cycle 2). To avoid bus contention, external devices
). For example, the AS7C31024A is guaranteed not to exceed 36mW under nominal full standby
SB1
Absolute maximum ratings
ParameterSymbolMinMaxUnit
Voltage on V
relative to GND
CC
AS7C1024AV
AS7C31024AV
Voltage on any pin relative to GND BothV
Power dissipationBothP
Storage temperature (plastic)BothT
Ambient temperature with V
appliedBothT
CC
DC current into outputs (low)BothI
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause perma nent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
t1
t1
t2
D
stg
bias
OUT
–0.50+7.0V
-0.50+5.0V
–0.50VCC +0.50V
–1.0W
–65+150
–55+125
C
°
C
°
–20mA
Truth table
CE1
HXXXHigh ZStandby (I
XLXXHigh ZStandby (I
LHHHHigh ZOutput disable (I
LHHLD
LHLXD
Key: X = Don’t Care, L = Low, H = High
CE2
WEOE
DataMode
OUT
IN
Read (ICC)
Write (
SB
SB
ICC
, I
, I
SB1
SB1
)
CC
)
)
)
9/26/02; 0.9.9
Alliance Semiconductor
P. 2 of 9
Page 3
Recommended operating conditions
ParameterDeviceSymbolMinNominalMaxUnit
Supply voltag e
Input voltage
Ambient operating temperature
VILmin. = –3.0V for pulse width less than t
1
AS7C1024AV
AS7C31024AV
ASAS7C1024AV
AS7C31024AV
commercialT
industrialT
.
RC/2
CC
CC
IH
IH
1
V
IL
A
A
DC operating characteristics (over the operating range)
ParameterSymTest conditionsDevice
Input lea k age
current
Output leakage
current
Operating
pow er suppl y
current
Standby power
supply current
Output voltage
|I
|VCC = Max, VIN = GND to V
LI
V
= Max, CE1 = VIH or
|
|I
LO
CC
CE2 = V
, V
= GND to V
IL
OUT
VCC = Max, CE1 = VIL,
CE2 = V
I
CC
IH
, f = f
Max
mA
VCC = Max, CE1 ≥ VIH and/or
≤
CE2
I
SB
VIL, VIN = VIH or VIL,
f = f
, I
Max
OUT
VCC = Max, CE1 ≥ VCC–0.2V
V
I
SB1
V
OL
V
OH
≤ GND + 0.2V or
IN
V
≥ VCC –0.2V, f = 0
IN
IOL = 8 mA, VCC = Min
IOH = –4 mA, VCC = Min2.4–2.4–2.4–2.4–V
, I
OUT
= 0mA
CC
Both–1–1–1–1µA
Both–1–1–1–1µA
CC
AS7C1024A–155–150–145–140
= 0
AS7C31024A–145–140–135–130
AS7C1024A–30–25–20–20
AS7C31024A–30–25–20–20
AS7C1024A–10–10–10–10
AS7C31024A–5–5–5–5
Both
AS7C1024A
AS7C31024A
®
4.55.05.5V
3.03.33.6V
2.2–VCC + 0.5V
2.0–VCC + 0.5V
–0.5–0.8V
0–70°C
–40–85
-10-12-15-20
MinMaxMinMaxMinMaxMinMax
–0.4–0.4–0.4–0.4V
C
°
Unit
mA
mA
mA
Capacitance (f = 1 MHz, Ta = 25 °C, VCC = NOMINAL)
) to write endt
Chip enable (CE2) to write endt
Address setup to write endt
Address setup timet
Write pulse widtht
Write recovery timet
Address hold from end of writet
Data valid to write endt
Data hold timet
Write enable to output in high Zt
Output active from write endt
– Output load: see Figure B or Figure C.
– Input pulse level: GND to 3.0V. See Figure A.
– Input rise and fall times: 2 ns. See Figure A.
– Input and output timing reference levels: 1.5V.
D
+3.0V
GND
90%
10%
2 ns
Figure A: Input pulse
90%
10%
OUT
Figure B: 5V Output load
255
+5V
480
Ω
Ω
C(14)
GND
D
D
OUT
OUT
Notes
1During VCC power-up, a pull-up resistor to VCC on CE1 is required to meet I
2This parameter is sampled and not 100% tested.
3For test conditions, see AC Test Conditions, Figures A, B, and C.
4t
and t
CLZ
5This parameter is guaranteed, but not 100% tested.
6WE
is High for read cycle.
7CE1
8Address valid prior to or coincident with CE1
9All read cycle timings are referenced from the last valid address to the first transitioning address.
10 CE1
11 All write cycle timings are referenced from the last valid address to the first transitioning address.
12 CE1
13 C=30pF, except all high Z and low Z parameters, C=5pF.
14 2V data retention applies to commercial temperature operating range only.
are specified with CL = 5pF, as in Figure C. Transition is measured ±500mV from steady-state voltage.
CHZ
and OE are Low and CE2 is High for read cycle.
transition Low.
or WE must be High or CE2 Low during address transitions. Either CE1 or WE asserting high terminates a write cycle.
rodu ct n ames m a y b e th e t rad emark s o f th eir resp ec tive co m p a nie s. A llia nc e re ser ve s the rig ht to make ch an g es to thi s do cu m e nt an d its p ro d u cts at a n y time w ith ou t n o tice . A llia n ce assu mes no
responsibility for any errors that may appear in this document. The data contained herein represents Alliance’s best data and/or estimates at the tim e of issuan ce. A lliance reserv es the right to
chang e o r c o rrec t th is da ta a t an y ti m e, w itho u t n otic e. I f the pr o du ct d esc rib ed h ere in is un de r d ev elo p m e nt, si gn ific an t ch an ge s to the se sp ec ific atio ns are po ssib le. The in fo rmatio n in th is
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Alliance Semiconductor
Temperature range
C = Commercial, 0°C to 70°C
I = Industrial, -40°C to 85°C
P. 9 of 9
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