The ASI AS5C1008 is a high speed, low power, 128K by
8-bit ruggedized plastic (COTS) CMOS Static RAM. It is fabricated using high performance, CMOS technology . This highly
reliable process coupled with innovative circuit design techniques, yields access times as fast as 15ns (Max) over the
military and industrial temperature ranges.
When Chip Enable (CE\) is HIGH, the device assumes a
standby mode at which the power dissipation can be reduced
down to 125mW (max) at CMOS input levels.
Easy memory expansion is provided by using asserted LOW
CE\ and asserted HIGH CE2, and asserted LOW write enable
(WE\) controls both writing and reading of the memory.
TheAS5C1008 is pin-compatible with other 128K x 8
SRAM's in the SOJ package.
*For ceramic versions of this product, please see the
MT5C1008 datasheet.
AS5C1008
Rev. 3.5 1/01
PIN FUNCTIONS
A0 - A16Address Inputs
WE\Write Enable
CE\
, CE
1
Chip Enable
2
OE\Output Enable
I/O0 - I/O
V
CC
V
SS
Data Inputs/Outputs
7
Power
Ground
NCNo Connection
For more products and information
please visit our web site at
www.austinsemiconductor .com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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Austin Semiconductor, Inc.
SRAM
AS5C1008
ABSOLUTE MAXIMUM RA TINGS*
Vcc Supply Relative to GND...................................-0.5V to +7.0V
Voltage on any pin Relative to GND.........-0.5V to Vcc +7.0V
Storage T emperature ............................................-65°C to +150°C
Ambient Temperature with Power Applied........-55oC to +125oC
Short Circuit Output Current.................................................260oC
Power Dissipation...................................................................1.0W
FUNCTIONAL BLOCK DIA GRAM
A0
Address
A16
Decoder
*Stresses greater than those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect reliability .
Memory Matrix
Data
CE\
CE
WE\
OE\
AS5C1008
Rev. 3.5 1/01
I/O0
Input Data
Control
I/O7
1
2
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
2
Column I/O
Page 3
SRAM
AS5C1008
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55oC<TA<+125oC or -40oC to +85oC; Vcc = 5V+10%)
-15-20-25
PARAMETERCONDITIONSSYMBOL MIN MAX MIN MAX MIN MAX UNITS
Dynamic Operating
Current
TTL Standby Current TTL Inputs
CMOS Standby Current CMOS Inputs
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
Input High VoltageV
Input Low Voltage
Vcc=MAX, I
CE
= VIL and CE2 = VIH, f = fmax
1
Vcc=MAX, V
CE\
> VIH and CE2 > VIL, f = fmax
1
Vcc=MAX, CE\
< 0.2V, VIN > Vcc -0.2V and
V
< 0.2V, f = 0
IN
GND <
VIN < VccI
GND <
V
Output Disabled
Vcc = MIN, I
Vcc = MIN, I
= 0mA,
OUT
= VIH or VIL,
IN
> Vcc -0.2V, or CE
1
< Vcc
OUT
= -4.0 mAV
OH
= 8.0 mAV
OL
I
CC1
I
SB1
2
I
SB2
LI
I
LO
OH
OL
IH
V
IL
180150140mA
907570mA
101010mA
-1010-1010-1010µA
-1010-1010-1010µA
2.42.42.4V
0.40.40.4V
Vcc
2.2
+0.5
-0.50.8-0.50.8-0.50.8V
2.2
Vcc
+0.5
2.2
Vcc
+0.5
V
PIN DESCRIPTIONS
A0 - A16: Address Inputs
These 17 address inputs select one of the 131,072 8-bit words in
the RAM.
CE\1: Chip Enable 1 Input
CE\1 is asserted LOW to read from or write to the device. If Chip
Enable 1 is deasserted, the device is deselected and is in standby
power mode. The I/O pins will be in the high-impedance state
when the device is deselected.
CE2: Chip Enable 2 Input
CE2 is asserted HIGH to read from or write to the device. If Chip
Enable 2 is deasserted, the device is deselected and is in standby
power mode. The I/O pins will be in the high-impedance state
when the device is deselected.
AS5C1008
Rev. 3.5 1/01
OE\: Output Enable Input
The Output Enable Input is asserted LOW. If asserted LOW
while CE\1 is asserted (LOW) and CE2 is asserted (HIGH) and
WE\ is deasserted (HIGH), data from the SRAM will be present
on the I/O pins. The I/O pins will be in the high-impedance
state when OE\ is deasserted.
WE\: Write Enable Input
The Write Enable input is asserted LOW and controls read and
write operations. When CE\1 and WE\ are both asserted (LOW)
and CE2 is asserted (HIGH) input data present on the I/O pins
will be written into the selected memory location.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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SRAM
AS5C1008
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(-55oC<TA<+125oC or -40oC to +85oC; Vcc = 5V+10%)
-15-20-25
t
RC
t
AA
t
ACE
t
OH
LZCE
HZCE
t
AOE
LZOE
HZOE
t
WC
t
CW
t
AW
t
AS
t
AH
WP
t
DS
t
DH
LZWE
1
MINMAXMINMAXMINMAXUNIT
152025ns
152025ns
152025ns
333ns
333ns
7810ns
7710ns
000ns
7810ns
152025ns
121520ns
121520ns
000ns
000ns
121520ns
81015ns
000ns
555ns
7910ns
DESCRIPTION
READ CYCLE
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Hold from Address Change
Chip Enable to Output in Low-Z
Chip Disable to Output in High-Z
Output Enable Access Time
Output Enable to Output in Low-Z
Output Disable to Output in High-Z
WRITE CYCLE
Write Cycle Time
Chip Enable to End of Write
Address Valid to End of Write
Address Set-up Time
Address Hold from End of Write
Write Pulse Width (OE\ >
VIH)t
Data Set-up Time
Data Hold Time
Write Disable to Output in Low-Z
Write Enable to Output in High-Z
SYMBOL
t
t
t
t
t
t
HZWE
NOTE: 1. t
AS5C1008
Rev. 3.5 1/01
LZCE
, t
LZWE
, t
HZCE
, t
LZOE
, and t
are simulated values.
HZOE
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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Austin Semiconductor, Inc.
MAX
CAPACITANCE (TA = +25oC, f = 1.0 MHz)
PARAMETERCONDITIONSYMBOL
= 0VC
Input Capacitance
Output Capacitance
AC TEST CONDITIONS
Input Pulse Levels.......................................................GND to 3.0V
Input Rise and Fall Times..........................................................3ns