Datasheet AS1431 Datasheet (Silicon Link)

AS1431

Precision Adjustable Shunt Reference

Features

¥

Temperature-compensated: 30 ppm/¡C

¥

Trimmed 0.4% bandgap reference

¥

Internal amplifier with 150 mA capability

¥

Temperature range: Extended to Ð40 to125¡C

¥

Low frequency dynamic output impedance: < 150 m½

¥

Low output noise

¥

Robust ESD protection

Description

The AS1431 is a three-terminal adjustable shunt regulator providing a highly accurate 0.4% bandgap reference. The adjustable shunt regulator is ideal for a wide variety of linear applications that can be implemented using external components to obtain adjustable currents and voltages.

In the standard shunt configuration, the combination of low temperature coefficient (TC), sharp turn-on characteristics, low output impedance and programmable output voltage make this precision reference a perfect zener diode replacement.

The AS1431 is characterized to operate over the full automotive temperature range of Ð40 to 125¡C and is now available in the SOT-23 (3L) TO92-3L, SOT-89, and SOIC-8,package.

Ordering Information

Circuit Type: Precision Adjustable Shunt Reference

Temperature Range: D = –40°C to +125°C

Bandgap Tolerance: R4 = ±0.4%

AS1431 D R4 D8 13

Packaging Option: A B T 7 13

Package Style: D8 VS LP S

= SOIC = SOT-23/3L = TO-92 = SOT-89

= Ammo Pack = Bulk = Tube = Tape and Reel (7" Reel Dia) = Tape and Reel (13" Reel Dia)

1

VF

= SOT-23/3L

3LQ&RQILJXUDWLRQ ³

7RSYLHZ

Line 1: Device Line 2: Lot No. Code

F = Foundry Code

YMXXX = 5 character Lot no.

S = Split Code

Line 3: Date Code

G = Assembly Vendor Code

YY = Year

WW = Workweek

SOT-23/3L (VS)

Line 1: # BBB

(single letter code)

Note: # and BBB is supplied by

# - Device Number

BBB - Logbook Code

Silicon Link

TO-92 (LP)

# BBB

Reference

AS1431 FYMXXXS GYYWW

Reference

Anode

Cathode

Anode

Cathode

# BBB

Cathode

SOT-23/3L (VF)

Anode

Reference

Line 1: Device Line 2: Lot No. Code

F = Foundry Code

YMXXX = 5 character Lot no.

S = Split Code

Line 3: Date Code

G = Assembly vendor code

YY = Year

WW = Workweek

Line 1: Device Line 2: Lot No. Code

YMXXX = 5 character lot no.

character of lot no.

mark excluding 1st letter/

S = Split Code

SOIC (D8)

SOT-89 (S)

Reference

AS1431 FYMXXXS GYYWW

Cathode

Reference

Anode

AS1431 YMXXXS

Anode

NC

Cathode

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Functional Block Diagram

Absolute Maximum Ratings

Parameter Symbol Rating Units

Cathode-Anode Reverse Breakdown V

KA

37 V

Anode-Cathode Forward Current I

AK

1 A

Operating Cathode Current I

KA

150 mA

Reference Input Current I

REF

10 mA

Continuous Power Dissipation at 25¡C P

D

TO-92 775 mW

8L SOIC 750 mW

SOT-89 1000 mW

SOT-23/3L 200 mW

Junction Temperature T

J

150 ¡C

Storage Temperature T

STG

Ð65 to 150 ¡C

Lead Temperature Soldering 10 Seconds T

L

300 ¡C

Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Ð

+

REFERENCE

(R)

ANODE (A)

CATHODE (K)

2.5 V

Recommended Conditions

Parameter Symbol Rating Unit

Cathode Voltage V

KA

V

REF

to 20 V

Cathode Current I

K

10 mA

Typical Thermal Resistances

Package θ

JA

θ

JC

Typical Derating

TO-92 160¡C/W 80¡C/W 6.3 mW/¡C

SOIC 175¡C/W 45¡C/W 5.7 mW/¡C

SOT-89 110¡C/W 8¡C/W 9.1 mW/¡C

SOT-23/3L 575¡C/W 150¡C/W 1.7 mW/¡C

2

Precision Adjustable Shunt Reference

AS1431

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Electrical Characteristics

Electrical Characteristics are guaranteed over full junction temperature range (Ð40 to 125¡C). Ambient temperature must be derated based on power dissipation and package thermal characteristics. The conditions are: VKA= V

REF

and IK= 10 mA unless otherwise stated.

Parameter Symbol Test Condition Min. Typ. Max. Unit Circuit

Reference Voltage V

REF

TA= 25¡C 2.490 2.500 2.510 V 1

Over temp. 2.470 2.530 V 1

ÆV

REF

with Temp* TC 0.06 0.16 mV/¡C 1

Ratio of Change in V

REF

to ÆV

REF

ÆVK= 3 V to 36 V Ð2 Ð1.1 mV/V 2

Cathode Voltage

Reference Input Current I

REF

R1= 10 k ½; R2= ° 0.7 1.9 µA 2

I

REF

Temp Deviation ÆI

REF

Over temp. 0.4 1.2 µA 2

Min IKfor Regulation I

K(min)

0.4 1 mA 1

Off State Leakage I

K(off)

V

REF

= 0 V, 0.04 500 nA 3

VKA= 36 V

Dynamic Output Impedance Z

KA

f ² 1 kHz 0.15 0.2 ½ 1 IK= 1 to 100 mA

*Calculating Average Temperature Coefficient (TC)

0

–10

–20

0.55000

0 0

–40 –25 0 25 50 75 100 125

0.06 mV/°C

0.002%/°C 24 ppm/°C

ppm

mV

%

∆V

REF

∆T

Temperature (°C)

• TC in mV/°C =

• TC in %/°C =

∆T

A

∆T

A

X 100

∆V

REF

(mV)

V

REF

at 25°C

∆V

REF

• TC in ppm/°C = ∆T

A

X 10

6

V

REF

at 25°C

∆V

REF

Average Temperature Coefficient

Test Circuits

Figure 1a. Test Circuit 1 Figure 1b. Test Circuit 2 Figure 1c. Test Circuit 3

R

1

R

2

I

K

V

IN

V

KA

(V

REF

)

I

REF

I

REF

I

K

V

IN

VKA = V

REF

I

K (OFF)

V

IN

VKA

3

Precision Adjustable Shunt Reference

AS1431

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Typical Performance Curves

Figure 2

Figure 4

Figure 3

Figure 5

I

K

– Cathode Current (µA)

900

700 600

500 400 300 200

100

0 –100 –200

800

–1.0 0 1.0

V

KA

– Cathode Voltage (V)

2.0 3.0

Low Current Operating Characteristics

VKA = V

REF

Temperature Range: –40 to 125°C

125°C

25°C

–40°C

I

K

– Cathode Current (mA)

150 125 100

75 50 25

0

–25 –50

–75

–100

–2 –1 0 1 2 3

V

KA

– Cathode Voltage (V)

High Current Operating Characteristics

VKA = V

REF

Temperature Range: –40 to 125°C

I

Z

off – Off State Cathode Current (nA)

100

10

1

0.1

0.01

–60 –30 0 30

T

A

– Ambient Temperature (°C)

60 90 120

Off State Leakage

VKA = 36 V V

REF

= 0 V

V

REF

– Reference Voltage (V)

2.53

2.52

2.51

2.50

2.49

2.48

2.47

2.46

2.45

–60 –30 0 30

T

A

– Ambient Temperature (°C)

60 90 120

VKA = V

REF

IK = 10 mA

Reference Voltage vs Ambient Temperature

V

REF

= 2.500 V at 25°C

4

Precision Adjustable Shunt Reference

AS1431

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Typical Performance Curves

Figure 6

Figure 8

Figure 7

Figure 9

3.0

2.5

2.0

1.5

1.0

0.5

0

–60 –30 0 30 60 90 120

I

REF

– Reference Input Current (µA)

TA – Ambient Temperature (°C)

Reference Input Current

R1 = 10 kΩ R2 = ∞ I

K

=10 mA

70

60

50

40

30

20

10

0

10 100 1 k

f – Frequency (Hz)

10 k 100 k

Noise Voltage nV/√H

Z

VKA = V

REF

IK = 10 mA T

A

= 25°C

Noise Voltage

Z

KA

– Dynamic Impedance (Ω)

0.150

0.125

0.100

0.075

0.050

0.025

0.0

–60 –30 0 30

T

A

– Free Air Temperature

60 90 120

VKA = V

REF

IKA = 1 to 100 mA f ≤ 1 kHz

Low Frequency Dynamic Output Impedance

5

0

–10

–20

–30

–40

–50

0 3 6 9

VKA – Cathode Voltage (V)

12 15 18 21 24 27 30

V

REF

–

Change in Reference Voltage (mV)

IK = 10 mA

Temperature Range: –40 to 125°C

Reference Voltage Line Regulation

125°C

–40°C

75°C

25°C

0°C

Precision Adjustable Shunt Reference

AS1431

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Typical Performance Curves

Figure 10

Figure 11

100

10

1.0

Z

KA

– Dynamic Impedance (Ω)

0.1

0.01 1 k 10 k 100 k

f – Frequency (Hz)

1 M 10 M

TA = 25°C I

K

= 1 to 100 mA

Dynamic Output Impedance

70

60

50

40

30

20

10

0

1 k 10 k 100 k 1 M 10 M

f – Frequency (Hz)

230 Ω

I

K

A

V

– Small Signal Voltage Gain (dB)

Temperature Range: –40 to 125°C

I

K

= 10 mA

OUT

GND

15 k

8.25 k

9 µF

Small Signal Voltage Gain vs. Frequency

6

Precision Adjustable Shunt Reference

AS1431

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Figure 12

Figure 13

6

5

4

3

Input and Output Votages (V)

2

1

0

–0

0 1 2 3 4 5 6 7

t – Time (ms)

8 9 10 11 12

Input

Output

Pulse Response

INPUT MONITOR

220 Ω

50 Ω

OUT

GND

fp = 100 kHz

100

90 80

70 60

50 40 30

20 10

0

10010110210

3

CL – Load Capacitance (pF)

10410510610

7

150 Ω

C

L

10 K

I

K

C

D

TA = 25°C

Stability Boundary Conditions

Stability Region

I

K

– Cathode Current (mA)

A: VKA = V

REF

B: VKA = 5 V at IK = 10 mA C: V

KA

= 10 V at IK = 10 mA

D: V

KA

= 15 V at IK = 10 mA

A

B

Typical Performance Curves

7

Precision Adjustable Shunt Reference

AS1431

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

TO-92 Dimension

8

Precision Adjustable Shunt Reference

AS1431

SOT-89 Dimension

SYM MIN NOM MAX

INCHES

A 0.176 0.180 0.184 B 0.015 0.018 0.022

C 0.014 0.015 0.020

øD 0.176 0.180 0.184

e 0.098 0.100 0.102

e1 0.048 0.050 0.052

E 0.136 0.140 0.144

j 0.166 0.170 0.174

L 0.530 0.550 0.570

S1 0.031 0.035 0.039

*

3-Lead TO-92 Plastic Package

SLI Package Code: LP

Silicon Link, Inc www.silicon-link.com

INCHES

MIN

SYM

0.055

A

0.017

B

0.014

B1

0.014

C

0.173

D

0.066

D1

0.090

E

0.084

E1

e

e1

H

L

*: Typical, Unit: inches

0.059

0.118

0.155

0.029

3-Lead SOT-89 Plastic

Surface Mounted Package

SLI Package Code: S

NOM

0.063

0.022

0.019

0.017

0.181

0.070

0.099

0.086

0.167

0.041

September 2013 Rev. 3

SOT-23 Dimension

9

Precision Adjustable Shunt Reference

AS1431

3-Lead SOT-23 Plastic

Surface Mounted Package

SLI Package Code: VS

SOIC 8L Dimension

DIMENSION IN INCHES DIMENSION IN MM

SYM MIN NOM MAX MIN NOM MAX

A 0.059 0.062 0.065 1.50 1.57 1.65 A1 0.004 0.008 0.010 0.10 0.20 0.25 A2 0.051 0.054 0.057 1.30 1.37 1.45

b 0.013 0.016 0.020 0.33 0.41 0.51

c 0.007 0.008 0.010 0.18 0.20 0.25

D 0.191 0.193 0.195 4.85 4.90 4.95

E1 0.151 0.153 0.155 3.84 3.89 3.94

E 0.228 0.234 0.240 5.79 5.94 6.10

e 0.050 1.27

L 0.020 0.024 0.032 0.51 0.51 0.81

L1 0.039 0.041 0.043 0.99 1.04 1.09

Ø 0* - B* 0* - B*

h 0.011 0.015 0.019 0.28 0.38 0.48

8-Lead SOIC Plastic

Surface Mounted Package

SLI Package Code: D8

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

Package Mechanical Drawing

10

Precision Adjustable Shunt Reference

AS1431

Surface Mountable Tape & Reel Specifications in mm ( inch )

( SOIC, SOT-89, SOT-23 )

P2

K

B1

Tape

Size (W) D E P0 T (Max)

8, 12, 16,

24mm

1.55±0.05

(.061±.002)

T

Ko

D

Bo

Ao

User direction of feed

1.75±0.10

(.069±.004)

4.0±0.10

(.157±.004)

Po

P

0.400

(.016)

E

F

Ejector Hole for Components 20mm X 12mm and larger

Embossment

A0, B0, K0

See Note 0.100

W

T1

(Max)

(.004)

Constant

Dimensions

Tape

Size (W)

4.2

8 mm

12 mm

Max.

(.165)

8.2

B1

D1

Min.

1.0

(.039)

1.5

(.059)(.323)

F

3.5±0.05

(.138±.002)

5.5±0.05

(.217±.002)

K

Max.

2.4

(.094) 2.0±.05

4.5

(.177)

P2

.079±.002

Variable

Dimensions

Per Package Requirement

Components

SOIC 8L 12 8 - 2500

SOT-23 3L 8 4 SOT-89 3L 12 8

Note: Ao Bo Ko are determined by component size. The cleareance between the component and the cavity must be within 0.05

[.002] min. to 0.50 [.020] max. for 8mm tape, 0.05 [.002] min to 0.65 [.026] max for 12mm tape.

Tape Width Cavity Pitch

(W) mm (P) mm 7” Reel 13” Reel

Devices per Reel

3000

-

2500

-

Silicon Link, Inc www.silicon-link.com

September 2013 Rev. 3

T

11

SOIC DEVICES

SOT 23 3L DEVICE

SOT 89 DEVICE

Precision Adjustable Shunt Reference

AS1431

Tape Size

8mm 330

12mm 330

A

Max.

(12.992)

40 (1.575) Min.

C

N

G

D* +

Full Radius

Access Hole at slot location

B

Tape slot in core for tape start

2.5 (.098) Min. Width 10 (.394) Min. Depth

REEL DIMENSIONS

A

B

Min.

1.5

(.059)

1.5

(.059)

MECHANICAL POLARIZATION

C D*

Min.

13.0±0.20

(.152±.008)

13.0±0.20

(.152±.008)

20.2

(.795)

20.2

(.795)

N

Min.

50

(1.973)

50

(1.973)

G T

8.4±1.5

0.0

(.331±.059 )

0.0

12.4±2.0

0.0

(.488±.078)

0.0

Max.

14.4

(.567)

14.4

(.567)

Silicon Link, Inc www.silicon-link.com

User direction of feed

September 2013 Rev. 3

TO-92 Ammo Pack Specifications

12

Precision Adjustable Shunt Reference

AS1431

SYM DESCRIPTION NOMINAL TOLERANCES

BOL VALUE min max

mm inch mm inch mm inch

D Feed Hole Diameter 4.0 0.157 3.8 0.150 4.2 0.165

T1 (POD) Component Lead Thickness 0.405 0.016 0.36 0.014 0.45 0.018

F1/F2 Lead Pitch ( Left / Right) 2.54 0.100 2.4 0.094 2.8 0.110

C Bottom of Component to Seating Plane 2.50 0.098 1.50 0.059 4.00 0.157

W1 Edge to Sprocket Hole Center 9.0 0.354 8.50 0.335 9.50 0.374 H2A Deflection (Left or Right) 0.50 0.020 0 0 0.50 0.020 H2B Deflection (Front or Rear) 1.0 0.039 0 0 1.0 0.039

H2 (H +C) Feed Hole to Bottom of Component 18.5 0.728 17.00 0.669 20.50 0.087

H Height of Seating Plane 16 0.630 15.5 0.610 16.5 0.650

H3 Feed Hole Center to Overall Transistor Height 27.75 1.092 23.5 0.925 32.0 1.260

L Defective Unit Clipped Dimension - - - - 11.0 0.433

L1 Leadwire Enclosure 2.50 0.098 2.50 0.09 8 - -

P Feed Hole Pitch 12.7 0.500 12.40 0.488 13.0 0.512

P2 Center of Feed Hole to Center Lead 6.35 0.250 6.0 0.234 6.75 0.266

P3 (P2-F1) First Lead Spacing Dimension 3.75 0.148 3.6 0.142 3.95 0.156

P1 Center Lead to Center Lead 12.7 0.500 12.2 0.500 13.2 0.520

t1 Adhesive Tape Thickness 0.18 0.007 0.16 0.006 0.20 0.008

T (t+t1+T1) Overall Taped Package Thickness - - - - 1.55 0.061

t Carrier Strip Thickness 0.37 0.015 0.27 0.011 0.47 0.018

W Carrier Strip Width (18mm) 18.00 0.709 17.5 0.689 19.0 0.748 W3 Adhesive Tape Width (6mm) 6.00 0.236 5.5 0.217 6.3 0.248 W2 Adhesive Tape Position 0.25 0.010 0 0 0.50 0.020

Silicon Link, Inc www.silicon-link.com

TO-92 Ammo Pack Requirement

Components

TO-92 18

3L

Tape Width

(W) mm

Fan Fold Box

2000

September 2013 Rev. 3