R type offers greatly reduced onresistance.
C type offers lower output capacitance.
Ω
AQY221N2S
(C type)
9.5
AQY221R2S
(R type)
Output
capacitance: C
On resistance: R0.8
13pF1pF
2. High speed switching
Turn on time: 30µs (AQY221N2S)
Turn off time: 30µs (AQY221N2S)
3. Super miniature design
SOP 4-pin type.
4. Low-level off state leakage current
of 10pA
The SSR has an off state leakage current
of several milliamperes, where as this
PhotoMOS relay has only 10pA (typical)
even with the rated load voltage
(AQY221N2S)
PhotoMOS
RELAYS
TYPICAL
APPLICATIONS
Measuring and testing equipment
1. Testing equipment for
semiconductor performance
IC tester, Liquid crystal driver tester , semiconductor performance tester
2. Board tester
Ω
Bare board tester, In-circuit tester, function tester
3. Medical equipment
Ultrasonic wave diagnostic machine
4. Multi-point recorder
Warping, thermo couple
TYPES
Circuit
arrangement
1 Form A
Type
R type40 V250 mAAQY221R2SXAQY221R2SZ
C type40 V120 mAAQY221N2SXAQY221N2SZ
* Indicate the peak AC and DC values.
Notes:
(1) Tape package is the standard packing style. Also available in tube.
(Part No. suffix "X" or "Z" is not needed when ordering; Tube: 100 pcs.; Case: 2,000 pcs.)
(2) For space reasons, the initial letters of the product number "AQY and S", the package type indicator "X" and "Z" are omitted from the seal.
Output rating*Tape and reel packing style
Load voltageLoad currentPicked from the 1/2-pin side Picked from the 3/4-pin side
Packing quantity
Tape and reel: 1,000 pcs.
RATING
1. Absolute maximum ratings (Ambient temperature: 25°C 77°F)
Item
LED forward currentI
Input
Output
Total power dissipationP
I/O isolation voltageV
Temperature limits
LED reverse voltageV
Peak forward currentI
Power dissipationP
Load voltage (peak AC)V
Continuous load currentI
Peak load currentI
Power dissipationP
OperatingT
StorageT
Symbol
peak
AQY221R2S
(R type)
F
R
FP
in
L
L
out
T
iso
opr
stg
0.25A0.12APeak AC,DC
0.75A0.30A100 ms (1 shot), VL= DC
500V AC1,500V AC
–40°C to +85°C –40°F to +185°FNon-condensing at low temperatures
Terminal thickness = 0.15 .006
General tolerance: ±0.1 ±.004
Recommended mounting pad (TOP VIEW)
6.0
.236
1.2
.047
0.8
.032
2.54
.100
Tolerance:±0.1 ±.004
mm inch
5
Page 5
AQY221❍2S
SCHEMATIC AND WIRING DIAGRAMS
• E1: Power source at input side; VIN: Input voltage; IF: LED forward current; IIN: Input current; VL: Load voltage; IL: Load current
Output
configuration
1
Schematic
4
1aAC/DC
2
3
CAUTIONS FOR USE
1. Short across terminals
Do not short circuit between terminals
when relay is energized. There is possibility of breaking the internal IC.
2. Surge voltages at the input
If reverse surge voltages are present at
the input terminals, connect a diode in reverse parallel across the input terminals
and keep the reverse voltages below the
reverse breakdown voltage.
1
2
3. Recommended LED forwar d current
(I
F
)
It is recommended that the LED forward
current (IF) be kept at 5mA.
4. Ripple in the input power supply
If ripple is present in the input power supply, observe the following:
1) For LED operate current at E
tain the value mentioned in the table of
“Note 3. Recommended LED forward current (I
F
).”
2) Keep the LED operate current at 50
mA or less at E
max.
Emin.Emax.
min,
4
3
main-
LoadWiring diagram
1
E1
I
F
2
5. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute maximum rating, the spike voltage must be
4
I
VL (AC,DC)
3
L
Load
Cleaning solvent
Chlorine
base
limited.
Typical circuits are shown below.
1
2
1
4
3
4
Load
Add a clamp diode
to the load
Adueous
Alcohol
base
Others
7. Input wiring pattern
This relays, avoid installing the input
(LED side) wiring pattern to the bottom
side of the package if you require the
specified I/O isolation voltage (V
2
3
Load
Add a CR snubber
circuit to the load
mounting the PC board. Since part of the
frame on the output side is exposed, it
may cause fluctuations in the I/O isolation
voltage.
2) If spike voltages generated at the load
are limited with a clamp diode and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short
as possible to minimize inductance.
6. Cleaning solvents compatibility
Dip cleaning with an organic solvent is
recommended for removal of solder flux,
dust, etc. Select a cleaning solvent from
the following table. If ultrasonic cleaning
is used, the severity of factors such as
frequency, output power and cleaning
solvent selected may cause loose wires
and other defects. Make sure these conditions are correct before use. F or details,
please consult us.
Load
4
VL (AC,DC)
I
3
L
Compatibility
(❍: Yes ✕: No)
• T richlene
• Chloroethlene
❍
• Indusco
• Hollis
❍
• Lonco Terg
• IPA
• Ethanol
• Thinner
• Gasoline
Portion of output side frame
(Output
terminal side)
Input wiring
pattem
May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
(Input terminal
side)
❍
✕
) after
iso
6
Page 6
AQY221❍2S
21±0.8
.827±.031
80±1 dia.
3.150±.039 dia.
2±0.5
.079±.020
13±0.5 dia.
.512±.020 dia.
14±1.5
.551±.059
2±0.5
.079±.020
250±2 dia.
9.843±.079 dia.
80±1 dia.
3.150±.039 dia.
8. Soldering
When soldering this terminals, the following conditions are recommended.
(1) IR (Infrared reflow) soldering method(2) Vapor phase soldering method(3) Double wave soldering method
T3
T2
T1
T2
T1
T2
T1
t1t2
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
(4) Soldering iron method
Tip temperature: 280 to 300°C 536 to
572 °F
Wattage: 30 to 60 W
Soldering time: within 5 s
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
t1t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 40 s or less
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
9. The following shows the packaging format
1) Tape and reel
TypeTape dimensionsDimensions of paper tape reel
Direction of picking
12±0.3
.472±.012
7.2±0.1
.284±.004
4±0.1
.157±.004
2±0.1
.079±.004
❍❍❍
1.75±0.1
.069±.004
5.5±0.1
±
.004
.217
±
0.1
4.7
12±0.1
±
.004
.185
.472±.004
1.55±0.1 dia.
.061±.004 dia.
SX (Shown adove)
❍❍❍
SZ
SO package
4-pin type
Tractor feed holes
0.3±0.05
.012±.002
Device mounted
on tape
2.8±0.3
.110±.012
(1)
When picked from 1/2-pin side: Part No.AQY
(2) When picked from 3/4-pin side: Part No. AQY
1.55±0.05 dia.
.061±.002 dia.
t1t2 t3
mm inch
2) T ube
(1) Devices are packaged in a tube so pin
No. 1 is on the stopper B side.
Observe correct orientation when mounting them on PC boards.
(SOP type)
StopperB (green)StopperA (gray)
2) Storage
PhotoMOS relays implemented in SO
packages are sensitive to moisture and
come in sealed moisture-proof packages.
Observe the following cautions on storage.
• After the moisture-proof package is unsealed, take the devices out of storage as
soon as possible (within 1 month at the
most).
• If the devices are to be left in storage for
a considerable period after the moistureproof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
10. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay. Han-
dle the outer and inner boxes with care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
11. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive v oltage or
current. In extreme cases, wiring may
melt, or silicon P/N junctions may be destroyed.
As a result, the design should ensure that
the absolute maximum ratings will never
be exceeded, even momentarily.
(Use at 15 VDC or lower and 9 VAC or
lower is recommended.)
12. Deterioration and destruction
caused by discharge of static electricity
This phenomenon is generally called static
electricity destruction. This occurs when
static electricity generated by various factors is discharged while the relay terminals
are in contact. The result can produce internal destruction of the element.
T o pre vent problems from static electricity ,
the following precautions and measures
should be taken when using your device.
1) Employees handling relays should
wear anti-static clothing and should be
grounded through protective resistance
of 500 kΩ to 1 MΩ.
2) A conductive metal sheet should be
placed over the work table. Measuring instruments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of lowvoltage soldering irons is also recommended.)
4) Devices and equipment used in assembly should also be grounded.
5) When packing printed circuit boards
and equipment, avoid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an electrostatic charge.
6) When storing or transporting relays, the
environment should not be conducive to
generating static electricity (for instance,
the humidity should be between 45 and
60%). Relays should always be protected
by using non-conductive packing materials.