Datasheet APX9132 Datasheet (ANPEC)

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APX9132

Hall Effect Micro Switch IC

Features General Description

• Micro Power Ope ration for Battery Applications

• Chopper Stabilized Amplifier

• Independent of North or South Pole Magnet,

Ea sy for Manufacture

• Small Size Pa ckage

• Lead Free Available (RoHS Compliant)

Ap plic ations

• Micro Switch

• Ha ndheld Wireless Application Wake Up Switch

• Cla mp Shell Type Application Switch

• Magnet Switch in Low Duty Cycle Applications

The APX9132 integrated circ uit is an ultra-sensit ive, pole independent Hall-effect switch with a latched di gital output . A 2.5 volt to 3.5 volt operation and a uniq ue clocking scheme reduce the average operating power requirements, Either a north or sout h pole of sufficient flux will turn the output on; in the absence of a magnetic field, the out put is off. The polarity i ndependence a nd minimal power requirement allow t his devic e t o be easily repla ced reed switc h for s uperior for signal condit ioning. Advanced CMOS proces sing is used to take advantage of l ow-voltage a nd low-pow er requirements, SOT-23 package provided a optimized pa ckage for most applications.

Pin Description

GND

APX9132

VDD

VOUT

SOT-23

Ordering Information

APX9132

Lead Free Code Handling Code Temp. Range

Package Code

APX9132 A/AT:

No tes : ANPEC lead-free p roducts contain molding compounds/die attach materials and 100% m atte in plate te rminatio n finish ; which are full y compliant with Ro HS and compatibl e with both SnPb an d lead-free soldiering op erations. AN PEC lead-free products meet or exceed the lead -free req uireme nts of IPC/JEDEC J STD-020C

fo r MSL classification at lead-fre e peak reflo w temp erature.

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.

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X32X

Package Code A : SOT-23 AT : SOT-23 Thin Temp. Range I : -40 to 85 C Handling Code TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device

X: Date Code

°

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APX9132

When a magnetic field enters the hall element and exceeds the

) the output turns on (output is

(or

Function Pin Descriptions

No Name Function

1 VDD Power Input

2 V

OUT

operate point B low). When the magnetic field is below the release point BRPS above B

RPN

3 GND Ground Connection

Block Diagram

Hall Plane

VDD

Awake & Sleep

Timing Logic

Cancellation

Dynamic Offset

OPS

(or less than B

OPN

), the output turns off (output is high).

Latch

Circuit

Chopper Amplifier

Hysteresis

Control

VOUT

GND

Typical Applications

V

OUT

APX9132

GND

SOT-23 (Top View)

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V

DD

0.1uF

+

2.5V-3.5V

-

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APX9132

Absolute Maximum Ratings T

= 25°C unless otherwise noted

A

Symbol Parameter Rating Unit

VDD Supply Voltage 5 V

V

Output Voltage 5 V

OUT

I

Output Current

OUT

±

1

TJ Junction Temperature Range 150

T

Storage Temperature Range -65 to +150

STG

Electrical Characteristics T

Symbol

VDD Supply Voltage Range Operating 2.5 3.5 V

IDD Supply Current

I

Output Leakage Current V

OFF

VOH Output High Voltage I VOL Output Low Voltage I

t

Wake up Time

awake

t

Period

period

d.c. Duty Cycle

fc Chopping Frequency

Characteristic Test Condition

Average 5 10 Awake 1.2 2 mA Sleep 2 8

SINK

= 25°C, VDD=3V unless otherwise noted

A

APX9132

Min. Typ. Max.

=3.5V, B

OUT

=-1mA

RPN

<B<B

1.0

RPS

VDD

-0.4

V

=1mA 20 40 mV

180 60 mS

0.3 11 KHz

mA

°

C

Unit

µ

A

µA µ

A

µ

s

%

Magnetic Characteristics T

= 25°C, VDD=3V unless otherwise noted

A

APX9132

Symbol Characteristic Test Condition

Unit

Min. Typ. Max.

B

OPS

B

OPN

B

RPS

B

RPN

B

Operate Points

Release Points

Hysteresis

hys

30 45 G

-45 -30 G 10 20 G

-20 -10 G 10 G

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APX9132

Typical Characteristics

Switching Points vs. Ambient Temperature

40 30 20 10

0

-10

-20

Switching Points (G)

-30

-40

BOPS

BRPS

BRPN

BOPN

-40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

Switching Points vs. Supply Voltage

40 30 20 10

0

-10

-20

Switching Points (G)

-30

-40

2.5 3 3.5 4 4.5 5

BOPS

BRPS

BRPN

BOPN

Supply Voltage (V)

TA=25°C

Average Supply Current vs. Ambient Temperature

10

8

6

4

2

Average Supply Current (uA)

0

-40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

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Average Supply Current vs.Supply Voltage

20 18

16 14 12 10

8 6 4 2

Average Supply Current (uA)

0

2.5 3 3.5 4 4.5 5

TA=25°C

Supply Voltage (V)

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APX9132

Vout (0.5V/div)

Vcc=5V

Vcc=4V

Vcc=3V

Typical Characteristics

Output Source Current vs. Output Voltage

5

4

3

2

1

Output Source Current (mA)

0

0 0.2 0.4 0.6 0.8 1

Output Voltage (V)

Output Sink Current vs. Output Voltage

10

9 8 7 6 5 4 3 2

Output Sink Current (mA)

1

0

0 0.2 0.4 0.6 0.8 1

Vcc=4V

Vcc=5V

Vcc=3V

Output Voltage (V)

Output Switch Waveform

Vcc=3V CL=12pF

Vout (0.5V/div)

Output Sink Voltage (0.5V/div)

Time (50us/div)

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Output Switch Waveform

Vcc=3V CL=12pF

Output Sink Voltage (0.5V/div)

Time (50us/div)

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APX9132

Function Description

Operation

The output of APX9132 switches low (turns on) when in pres ence of strong flux density facing the marked side of package exceeds the operate point B less than B

). After turn-on, the output is capable of

OPN

OPS

(or is

sinking up to 1mA and the output voltage is low (turns on). In absence of flux density below the release point B

(or i ncreased above B

RPS

), the APX9132 output

RPN

switc hes high (turns off). After turn-off, the output is capable of sourcing up to 1mA and the o utput voltage is high (turns off). The difference in the magnetic operated and released point is the hysteresis (B

) of the

hys

device. This b uilt-in hysteresis allows clean switching of the output even in the pres ence of external mecha nical bouncing vibration a nd electrical noise.

5V

MAX

B

OPN

OUTPUT OFF

B

OPS

Pole-independent

The pol e-independent sensing technique allows for operation with either a north or south pole magnet orientation, enhancing t he ma nufacturabilit y of t he device. The stat e-of-the-art technology provides the sa me output polarity for either pole in presence.

Awake & Sleep

Internal awake & sleep timing block circuit activates the sensor for 180 us and deac tivates it for the remainder of the period (60 ms). A short “awake” time all ows for stabilizat ion prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle the output is latched in its previous state.

Chopper Stabilized Technique

The chopper stabiliz ed technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely st able Hall output voltage, therefore the magnetic switch points are stable.

OUTPUT VOLTAGE

B

RPN

0

MAGNETIC FLUX

B

RPS OUTPUT ON

0 +B-B

Application Information

It is strongly recommended that an ex ternal bypass capacit or be connected (in close to the Hall sensor) bet ween the s upply and ground of the devic e to reduce both external noise and noise generated by the chop per-stabilization technique. This is especially true due to the relatively high impedance of battery supplies.

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APX9132

Pac kage Information

SOT-23

D

B

3

E H

2

A

L

Dim

1

e

A1

Millimeters Inches

Min. Max. Min. Max.

A 1.00 1.30 0.039 0.051

A1 0.00 0.10 0.000 0.004

B 0.35 0.51 0.014 0.020 C 0.10 0.25 0.004 0.010 D 2.70 3.10 0.106 0.122 E 1.40 1.80 0.055 0.071

e 1.90/2.1 BSC. 0.075/0.083 BSC.

H 2.40 3.00 0.094 0.118

L 0.37 0.015

C

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APX9132

Pac kage Information

SOT-23 Thin

D

b

3

E1 E

1

2

e

e1

L1

R

A

A2

θ

L

c

A1

Dim

A 0.75 0.80 0.028 0.031 A1 0.025 0.05 0.001 0.002 A2 0.75 0.775 0.029 0.030

b 0.35 0.51 0.014 0.020

c 0.10 0.20 0.004 0.008

D 2.80 3.00 0.109 0.117

E 2.60 3.00 0.101 0.117 E1 1.50 1.70 0.059 0.066

e 0.95 BSC 0.037 BSC

e1 1.90 BSC 0.074 BSC

L 0.37 0.60 0.014 0.023

L1 0.60 REF 0.0234 REF

R 0.10 - 0.004 -

θ 0° 8° 0° 8°

Min. Max. Min. Max.

Millimeters Inches

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APX9132

Physic al Specifications

Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Packaging 3000 devices per reel

Reflow Condition (IR/Convection or VPR Reflow)

T

P

Ramp-up

T

L

Tsmax

Tsmin

Temperature

ts

Preheat

25

°

t 25 C to Peak

Classificatin Reflow Profiles

tp

Ramp-down

Time

Critical Zone

TL to T

P

t

L

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp -up rate (TL to TP) Preheat

-

Temperature Min (Tsmin)

-

Temperature Max (Tsmax)

-

Time (min to max) (ts)

Time maintained above:

-

Temperature (TL)

-

Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5°C of actual

Peak Temperature (tp) Ramp-down Rate

Time 25°C to Peak Temperature

3°C/second max. 3°C/second max.

100°C 150°C

60-120 seconds

183°C

60-150 seconds

150°C 200°C

60-180 seconds

217°C

60-150 seconds

See table 1 See table 2

10-30 seconds 20-40 seconds

6°C/second max. 6°C/second max.

6 minutes max. 8 minutes max.

Notes: All temperatures refer to topside of the package .Measured on the body surface.

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APX9132

Classificatin Reflow Profiles(Cont.)

Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm

<350

<2.5 mm

≥

2.5 mm 225 +0/-5°C 225 +0/-5°C

240 +0/-5°C 225 +0/-5°C

3

Volume mm

≥

350

3

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3

<350

<1.6 mm

1.6 mm – 2.5 mm

≥

2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

260 +0°C* 260 +0°C* 260 +0°C* 260 +0°C* 250 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier

shall

Volume mm3

350 -2000

Volume mm3

>2000

assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Reliability test program

Test item Method Description

SOLDERABILITY MIL-STD-883D-2003 HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @ 125 °C PCT JESD-22-B, A102 TST MIL-STD-883D-1011.9 ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms , Itr > 100mA

245°C , 5 SEC

168 Hrs, 100 % RH , 121°C

-65°C ~ 150°C, 200 Cycles

Car rier Tape & Reel Dimensions

E

F

W

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Po

P

Ao

t

D

P1

Bo

Ko

D1

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APX9132

Carrier Tape & Reel Dimensions(Cont.)

J

C

A

T2

B

T1

Application

SOT-23

Application

SOT-23 Thin

A B C J T1 T2 W P E

178±1 60 ± 1.0 12.0 2.5 ± 0.15 9.0 ± 0.5

F D D1 Po P1 Ao Bo Ko t

φ

3.5 ± 0.05 1.5 +0.1

A B C J T1 T2 W P E

178±1 60 ± 1.0 12.0 2.5 ± 0.15 9.0 ± 0.5

F D D1 Po P1 Ao Bo Ko t

φ

3.5 ± 0.05

1.55+

0.05

0.1MIN

φ

1.1±0.1 4.0±0.1 2.0 ± 0.05 3.3±0.1 3.2±0.1 1.1±0.1 0.25±0.05

4.0 2.0 ± 0.05

1.4

3.1 3.0 1.3 0.2±0.03

1.4

8.0+ 0.3

- 0.3

8.0+ 0. 2

4.0 1.75

4.0±0.1 1.75±0.1

Cov er Tape Dimensions

Application Carrier Width Cover Tape Width Devices Per Reel

SOT- 23 8 5.3 3000

SOT- 23 Thin 8 5.3 3000

(mm)

Cus tomer Service

Anpec Electronics Corp.

Head Office :

No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050

(mm)

Taipei Branch :

7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwa n, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369

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