SPEC NO: CDA0376 REV NO: V.1 DATE: OCT/26/2001 PAGE: 1 OF 4
APPROVED: J.LU CHECKED: DRAWN: Y.F.XU
1.6x1.5mm BI-COLOR SMD CHIP LED LAMP
APTB1615SRPGWPR SUPER BRIGHT RED/PURE GREEN
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Features
!1.6mmx1.5mm SMT LED, 0.7mm THICKNESS.
!BI -COLOR,LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE : 2000PCS / REEL.
Description
The Super Bright Red source color devices are made with
Gallium Aluminum Arsenide Red Light Emitting Diode.
The Pure Green source color devices are made with Gallium
Phosphide Pure Green Light Emitting Diode.
SPEC NO: CDA0376 REV NO: V.1 DATE: OCT/26/2001 PAGE: 2 OF 4
APPROVED: J.LU CHECKED: DRAWN: Y.F.XU
Selection Guide
Electrical / Optical Characteristics at T
)
=25
°°
°°
°C
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T)=25
°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
lobmySlobmyS
lobmyS
lobmySlobmySretemaraPretemaraP
retemaraP
retemaraPretemaraPeciveDeciveD
eciveD
eciveDeciveD.pyT.pyT
.pyT
.pyT.pyT.xaM.xaM
.xaM
.xaM.xaMstinUstinU
stinU
stinUstinUsnoitidnoCtseTsnoitidnoCtseT
snoitidnoCtseT
snoitidnoCtseTsnoitidnoCtseT
λ kaep
htgnelevaWkaeP
deRthgirBrepuS
neerGeruP
066
555
mnAm02=FI
λD
htgnelevaWetanimoD
deRthgirBrepuS
neerGeruP
046
555
mnAm02=FI
λ∆ 2/1
htdiwflaHeniLlartcepS
deRthgirBrepuS
neerGeruP
02
03
mnAm02=FI
CecnaticapaC
deRthgirBrepuS
neerGeruP
54
54
FpzHM1=f;V0=FV
V
F
egatloVdrawroF
deRthgirBrepuS
neerGeruP
58.1
52.2
5.2
5.2
VAm02=FI
I
R
tnerruCesreveRllA01AuV5=RV
retemaraPretemaraP
retemaraP
retemaraPretemaraPdeRthgirBrepuSdeRthgirBrepuS
deRthgirBrepuS
deRthgirBrepuSdeRthgirBrepuSneerGeruPneerGeruP
neerGeruP
neerGeruPneerGeruPstinUstinU
stinU
stinUstinU
noitapissidrewoP001501Wm
tnerruCdrawroFCD0352Am
]1[tnerruCdrawroFkaeP551531Am
egatloVesreveR55V
erutarepmeTegarotS/gnitarepO 04- ° 58+oTC °C
.oNtraP.oNtraP
.oNtraP
.oNtraP.oNtraPeciDeciD
eciD
eciDeciDepyTsneLepyTsneL
epyTsneL
epyTsneLepyTsneL
)dcm(vI)dcm(vI
)dcm(vI
)dcm(vI)dcm(vI
Am02@
gniweiVgniweiV
gniweiV
gniweiVgniweiV
elgnA
.niM.niM
.niM
.niM.niM.pyT.pyT
.pyT
.pyT.pyT
2/1θ22/1θ2
2/1θ2
2/1θ22/1θ2
RPWGPRS5161BTPA
)sAlAaG(DERTHGIRBREPUS
DESUFFIDETIHW
0308
°021
)PaG(NEERGERUP25
SPEC NO: CDA0376 REV NO: V.1 DATE: OCT/26/2001 PAGE: 3 OF 4
APPROVED: J.LU CHECKED: DRAWN: Y.F.XU
Super Bright Red / Pure Green APTB1615SRPGWPR
SPEC NO: CDA0376 REV NO: V.1 DATE: OCT/26/2001 PAGE: 4 OF 4
APPROVED: J.LU CHECKED: DRAWN: Y.F.XU
APTB1615SRPGWPR
SMT Reflow Soldering Instructions
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Loading...