Page 1
APT8030B2VFR
800V 27A 0.300Ω
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement
FREDFET
T-MAX™
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Fast Recovery Body Diode • 100% Avalanche Tested
• Lower Leakage • New T-MAX™ Package
(Clip-mounted TO-247 Package)
G
D
FREDFET
• Faster Switching
S
MAXIMUM RATINGS All Ratings: T C = 25° C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
1
= 25° C
C
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ TC = 25° C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
1
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
4
APT8030B2VFR
800
27
108
±30
±40
520
4.16
-55 to 150
300
27
50
2500
UNIT
Volts
Amps
Volts
Watts
W/° C
° C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 579215 15 FAX: (33) 556 47 9761
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2
(V
DS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ± 30V, V
= 0V, ID = 250µ A)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125° C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
800
27
24
0.300
250
1000
± 100
UNIT
Volts
Amps
Ohms
µ A
nA
Volts
050-5623 Rev A
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θ JC
+ T
C
t
1
t
2
P
DM
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = I
[Cont.] @ 25° C
D
V
GS
VDD = 0.5 V
ID = I
[Cont.] @ 25° C
D
RG = 0.6Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
= 0V
GS
= 15V
DSS
DSS
APT8030B2VFR
MIN TYP MAX
6600 7900
645 900
320 480
340 510
31 47
170 250
16 32
14 28
59 90
81 6
UNIT
pF
nC
ns
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current
Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
1
(Body Diode)
2
dt
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µ s)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µ s)
Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µ s)
(VGS = 0V, IS = -ID [Cont.])
6
T
= 25° C 300
j
T
= 125° C 600
j
T
= 25° C 2.0
j
T
= 125° C 6.7
j
T
= 25° C 13
j
T
= 125° C 22
j
THERMAL CHARACTERISTICS
Symbol
R
R
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µ S, Duty Cycle < 2%
3
See MIL-STD-750 Method 3471 VR = 200V.
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θ JC
Junction to Ambient
θ JA
4
Starting T
5
These dimensions are equal to the TO-247 without mounting hole
6
IS ≤ -ID [Cont.],
+25° C, L = 6.86mH, R
j
=
di
/
dt
MIN TYP MAX
MIN TYP MAX
= 100A/µ s, V
25Ω , Peak IL = 27A
G
=
V
≤
DSS
, T
DD
108
1.3
0.24
150° C, R
j
≤
27
5
40
UNIT
Amps
Volts
V/ns
µ C
Amps
UNIT
° C/W
= 2.0Ω ,
G
ns
050-5623 Rev A
0.3
D=0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (° C/W)
JC
θ
Z
0.001
-5
10
0.2
0.1
0.05
0.02
0.01
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-4
10
SINGLE PULSE
10
RECTANGULAR PULSE DURATION (SECONDS)
-3
-2
10
-1
10
1.0 10
Page 3
APT8030B2VFR
50
40
VGS=5.5V, 6V, 7V, 10V & 15V
5V
50
VGS=15V
VGS=10V
40
VGS=5.5V, 6V & 7V
5V
30
20
4.5V
10
, DRAIN CURRENT (AMPERES)
D
4V
0
0 100 200 300 400 0 4 8 12 16
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
30
20
10
, DRAIN CURRENT (AMPERES)
D
0
4.5V
4V
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
100
80
VDS> ID (ON) x RDS (ON)MAX.
250µ SEC. PULSE TEST
60
@ <0.5 % DUTY CYCLE
TJ = -55° C
TJ = +25° C
TJ = +125° C
1.4
1.3
1.2
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
VGS=10V
40
20
, DRAIN CURRENT (AMPERES) I
D
0
02468 0 1 0 2 0 3 0 4 0 5 0 6 0
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
TJ = +125° C
TJ = +25° C
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
TJ = -55° C
30
1.1
VGS=20V
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.9
DS
1.15
25
1.10
20
1.05
15
1.00
10
, DRAIN CURRENT (AMPERES) I
5
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (° C) TJ, JUNCTION TEMPERATURE (° C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
, DRAIN-TO-SOURCE BREAKDOWN R
0.95
DSS
0.90
1.2
1.1
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (° C) TC, CASE TEMPERATURE (° C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5623 Rev A
Page 4
200
100
OPERATION HERE
50
LIMITED BY RDS (ON)
10
5
1
TC =+25° C
.5
, DRAIN CURRENT (AMPERES)
D
TJ =+150° C
SINGLE PULSE
10µ S
100µ S
1mS
10mS
100mS
DC
30,000
10,000
5,000
1,000
500
APT8030B2VFR
C
iss
C
oss
C
rss
.1
1 5 10 50 100 800 .01 .1 1 10 50
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 100 200 300 400 500 600 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
g
VDS=100V
VDS=250V
VDS=400V
T-MAX™ Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
100
200
100
50
10
5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
5
15.49 (.610)
16.26 (.640)
T
=+150° C T
J
5.38 (.212)
6.20 (.244)
=+25° C
J
20.80 (.819)
21.46 (.845)
Drain
4.50 (.177) Max.
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5623 Rev A
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source