N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
MAXIMUM RATINGSAll Ratings: TC = 25°C unless otherwise specified.
APT
Symbol
V
DSS
I
D
IDM, l
LM
V
GS
P
D
TJ,T
STG
T
L
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
Gate-Source Voltage
Total Power Dissipation @ T
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
1
= 25°C
C
and Inductive Current Clamped
= 25°C
C
8018JN
800
40
160
±30
690
5.52
-55 to 150
300
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
ID(ON)
R
DS
I
DSS
I
GSS
VGS(TH)
Characteristic / Test Conditions / Part Number
Drain-Source Breakdown Voltage
DSS
(V
= 0V, ID = 250 µA)
GS
On State Drain Current
(V
> ID(ON) x RDS(ON) Max, VGS = 10V)
DS
Drain-Source On-State Resistance
(ON)
(VGS = 10V, 0.5 ID [Cont.])
Zero Gate Voltage Drain Current (V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (V
Gate Threshold Voltage (V
2
= VGS, ID = 5.0mA)
DS
2
= V
DS
= 0.8 V
DS
= ±30V, V
GS
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
MINTYPMAX
APT8018JN
APT8018JN40
APT8018JN0.18
800
250
1000
±100
24
UNIT
Volts
Amps
Ohms
µA
nA
Volts
THERMAL CHARACTERISTICS
Symbol
R
R
USA
405 S.W. Columbia StreetBend, Oregon 97702-1035Phone: (541) 382-8028FAX: (541) 388-0364
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
(Use High Efficiency Thermal Joint Compound and Planer Heat Sink Surface.)
MINTYPMAX
0.05
UNIT
0.18
°C/W
050-8038 Rev E
Page 2
DYNAMIC CHARACTERISTICS
APT8018JN
Symbol
C
C
C
Q
Q
Q
td(on)
td(off)
Characteristic
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain ("Miller") Charge
gd
Turn-on Delay Time
t
Rise Time
r
Turn-off Delay Time
t
Fall Time
f
Test Conditions
V
VDS = 25V
f = 1 MHz
3
V
GS
VDD = 0.5 V
ID = ID [Cont.] @ 25°C
V
GS
VDD = 0.5 V
ID = ID [Cont.] @ 25°C
RG = 0.6Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
I
SM
Characteristic / Test Conditions
Continuous Source Current
S
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
SD
Reverse Recovery Time (I
rr
Reverse Recovery Charge (I
rr
1
2
(VGS = 0V, IS = -ID [Cont.])
= -ID [Cont.], dlS/dt = 100A/µs)
S
= -ID [Cont.], dlS/dt = 100A/µs)
S
Symbol
I
V
t
Q
MINTYPMAX
GS
= 0V
11715 14000
14302000
460690
= 10V
DSS
468700
72110
176265
= 15V
DSS
2140
1940
70105
1325
MINTYPMAX
APT8018JN
APT8018JN160
9451800
3660
40
1.8
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
PACKAGE CHARACTERISTICS
L
L
Characteristic / Test Conditions
Internal Drain Inductance
D
Internal Source Inductance (Measured From Source Terminals to Source Bond Pads)
S
(Measured From Drain Terminal to Center of Die.)
RMS Voltage (50-60 Hz Sinusoidal Waveform From Terminals to Mounting Base for 1 Min.)
Drain-to-Mounting Base Capacitance (f = 1MHz)
Maximum Torque for Device Mounting Screws and Electrical Terminations.
0.2
D=0.5
0.1
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.05
0.01
0.005
0.001
0.0005
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-5
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-4
10
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
MINTYPMAX
2500
Note:
DM
P
Duty Factor D =
Peak TJ = PDM x Z
-1
10
1.010
Symbol
V
Isolation
C
Isolation
Torque
1
Repetitive Rating: Pulse width limited by maximum junction temperature. See Transient Thermal Impedance Curve. (Fig.1)
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
3
See MIL-STD-750 Method 3471
050-8038 Rev E
UNIT
3
nH
5
Volts
70
13
t
1
t
2
t
1
/
t
2
+ T
θJC
C
pF
in-lbs
Page 3
APT8018JN
100
80
60
VGS=6, 8, 10 & 15V
5.5V
100
VGS=10 & 15V
8V
80
6V
5.5V
60
40
20
, DRAIN CURRENT (AMPERES)
D
4.5V
40
20
, DRAIN CURRENT (AMPERES)
D
4V
5V
0
01002003004000510152025
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)