Page 1
APT6035SVR
600V 18A 0.350Ω
POWER MOS V
®
D3PAK
Power MOS V® is a new generation of high voltage N-Channel enhancement
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
also achieves faster switching speeds through optimized gate layout.
• Faster Switching • 100% Avalanche Tested
3
• Lower Leakage • Surface Mount D
MAXIMUM RATINGS All Ratings: T C = 25° C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E
E
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
D
Pulsed Drain Current
Gate-Source Voltage Continuous
GS
1
= 25° C
C
Gate-Source Voltage Transient
Total Power Dissipation @ TC = 25° C
D
Linear Derating Factor
Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
1
Avalanche Current
Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
(Repetitive and Non-Repetitive)
1
4
PAK Package
®
D
G
S
APT6035SVR
600
UNIT
Volts
18
72
Amps
±30
±40
Volts
280
2.24
-55 to 150
Watts
W/° C
° C
300
18
Amps
30
1210
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 579215 15 FAX: (33) 556 47 9761
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2
(V
DS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ± 30V, V
= 0V, ID = 250µ A)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125° C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 1.0mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
600
18
24
0.350
25
250
± 100
UNIT
Volts
Amps
Ohms
µ A
nA
Volts
050-5530 Rev B
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θ JC
+ T
C
t
1
t
2
P
DM
APT6035SVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
V
GS
VDD = 0.5 V
ID = I
D[Cont.]
VGS = 15V
VDD = 0.5 V
ID = I
D[Cont.]
RG = 1.6Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current
Diode Forward Voltage 2 (VGS = 0V, IS = -I
SD
Reverse Recovery Time (IS = -I
rr
Reverse Recovery Charge (I
rr
(Body Diode)
S
= -I
, dlS/dt = 100A/µ s)
D[Cont.]
, dlS/dt = 100A/µ s)
D[Cont.]
D[Cont.]
)
= 0V
GS
= 10V
DSS
@ 25° C
DSS
@ 25° C
MIN TYP MAX
3450 4140
403 565
155 235
140 210
19 30
68 100
12 24
12 24
40 60
81 6
MIN TYP MAX
18
72
1.3
450
8
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µ C
050-5530 Rev B
THERMAL CHARACTERISTICS
Symbol
R
θ JC
R
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µ S, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
Junction to Ambient
θ JA
0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (° C/W)
JC
θ
Z
0.001
-5
10
3
See MIL-STD-750 Method 3471
4
Starting T
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
+25° C, L = 7.47mH, R
j
=
-1
10
MIN TYP MAX
0.45
40
25Ω , Peak IL = 18A
G
=
1.0 10
UNIT
°C/W
Page 3
APT6035SVR
50
VGS=7V, 10V & 15V
40
30
6.5V
6V
50
VGS=10V & 15V
7V
6.5V
40
6V
30
5.5V
20
10
, DRAIN CURRENT (AMPERES)
D
0
0 50 100 150 200 250 300 0 5 10 15 20 25
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
5V
4.5V
20
10
, DRAIN CURRENT (AMPERES)
D
0
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
50
VDS> ID (ON) x RDS (ON)MAX.
250µ SEC. PULSE TEST
40
@ <0.5 % DUTY CYCLE
30
1.4
1.3
1.2
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
VGS=10V
20
1.1
VGS=20V
TJ = +125° C
10
, DRAIN CURRENT (AMPERES) I
D
0
02468 01 02 03 04 0
V
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
TJ = +25° C
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
TJ = -55° C
20
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.9
DS
1.15
5.5V
5V
4.5V
, DRAIN-TO-SOURCE BREAKDOWN R
1.10
1.05
1.00
0.95
DSS
0.90
1.2
1.1
16
12
8
4
, DRAIN CURRENT (AMPERES) I
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (° C) TJ, JUNCTION TEMPERATURE (° C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (° C) TC, CASE TEMPERATURE (° C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5530 Rev B
Page 4
100
OPERATION HERE
50
LIMITED BY RDS (ON)
10
5
1
TC =+25° C
0.5
, DRAIN CURRENT (AMPERES)
D
TJ =+150° C
SINGLE PULSE
10µ S
100µ S
1mS
10mS
100mS
DC
15,000
10,000
5,000
1,000
500
APT6035SVR
C
iss
C
oss
C
rss
0.1
1 5 10 50 100 600 .01 .1 1 10 50
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 50 100 150 200 250 300 0.2 0.4 0.6 0.8 1.0 1.2 1.4
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
Q
VDS=120V
VDS=300V
VDS=480V
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
100
100
50
T
=+150° C T
J
10
5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
=+25° C
J
D3PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
15.95 (.628)
16.05 (.632)
1.04 (.041)
1.15 (.045)
13.41 (.528)
13.51 (.532)
Drain
(Heat Sink)
13.79 (.543)
13.99 (.551)
1.27 (.050)
1.40 (.055)
1.98 (.078)
2.08 (.082)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
Revised
4/18/95
{3 Plcs}
1.22 (.048)
1.32 (.052)
5.45 (.215) BSC
{2 Plcs.}
Source
Drain
Gate
Dimensions in Millimeters (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5530 Rev B
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
Revised
8/29/97
11.51 (.453)
11.61 (.457)
3.81 (.150)
4.06 (.160)
(Base of Lead)
Heat Sink (Drain)
and Leads
are Plated