The Fast IGBT™ is a new generation of high voltage power IGBTs. Using NonPunch Through Technology the Fast IGBT™ combined with an APT freewheeling ultraFast Recovery Epitaxial Diode (FRED) offers superior
ruggedness and fast switching speed.
• Low Forward Voltage Drop• High Freq. Switching to 20KHz
E
G
ISOTOP
• Low Tail Current• Ultra Low Leakage Current
• RBSOA and SCSOA Rated
• Ultrafast Soft Recovery Antiparallel Diode
MAXIMUM RATINGS (IGBT)All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
CES
V
CGR
V
I
C1
I
C2
I
CM1
I
CM2
P
TJ,T
T
Parameter
Collector-Emitter Voltage
Collector-Gate Voltage (R
Gate-Emitter Voltage
GE
Continuous Collector Current @ T
Continuous Collector Current @ T
Pulsed Collector Current
Pulsed Collector Current
Total Power Dissipation
D
Operating and Storage Junction Temperature Range
STG
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
L
= 20KΩ)
GE
= 25°C
C
= 90°C
C
1
@ TC = 25°C
1
@ TC = 90°C
G
APT50GF120JRD
1200
1200
±20
75
50
150
100
460
-55 to 150
300
E
UNIT
Volts
Amps
Watts
°C
STATIC ELECTRICAL CHARACTERISTICS (IGBT)
Symbol
BV
VGE(TH)
V
CE
I
CES
I
GES
USA
405 S.W. Columbia StreetBend, Oregon 97702-1035Phone: (541) 382-8028FAX: (541) 388-0364
Gate Threshold Voltage (V
Collector-Emitter On Voltage (VGE = 15V, IC = 40A, Tj = 25°C)
(ON)
Collector-Emitter On Voltage (VGE = 15V, IC = 40A, Tj = 125°C)
Collector Cut-off Current (V
Collector Cut-off Current (VCE = V
Gate-Emitter Leakage Current (VGE = ±20V, V
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
PRELIMINARY
= VGE, IC = 700µA, Tj = 25°C)
CE
= V
CE
CES
CES
APT Website - http://www.advancedpower.com
= 0V, IC = 1.0mA)
GE
, VGE = 0V, Tj = 25°C)
, VGE = 0V, Tj = 125°C)
= 0V)
CE
2
2
MINTYPMAX
1200
4.55.56.5
2.93.4
3.54.1
1.0
TBD
±100
UNIT
Volts
mA
nA
052-6257 Rev A
Page 2
DYNAMIC CHARACTERISTICS (IGBT)APT50GF120JRD
Symbol
C
ies
C
oes
C
res
Q
g
Q
ge
Q
gc
td(on)
t
r
td(off)
t
f
td(on)
t
r
td(off)
t
f
E
on
E
off
E
ts
td(on)
t
r
td(off)
t
f
E
ts
gfe
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Emitter Charge
Gate-Collector ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Switching Energy
4
Turn-off Switching Energy
Total Switching Losses
4
Turn-on Delay Time
Rise Time
PRELIMINARY
Turn-off Delay Time
Fall Time
Total Switching Losses
4
Forward Transconductance
Test Conditions
Capacitance
= 0V
V
GE
V
= 25V
CE
f = 1 MHz
Gate Charge
V
= 15V
GE
V
= 0.5V
CC
CES
I
= I
C
C2
Resistive Switching (25°C)
= 15V
V
GE
V
= 0.8V
CC
CES
I
= I
C
C2
RG = 5Ω
Inductive Switching (150°C)
V
Inductive Switching (25
V
(Peak) = 0.66V
CLAMP
V
GE
I
R
T
= +150°C
J
(Peak) = 0.66V
CLAMP
V
GE
I
R
T
J
VCE = 20V, I
= 15V
= I
C
C2
= 5Ω
G
= 15V
= I
C
C2
= 5Ω
G
= +25°C
CES
°C)
CES
= I
C
C2
MINTYPMAX
55007400
650910
330500
525
45
310
50
160
300
190
45
110
600
150
7
8
15
45
110
500
55
12.5
6
UNIT
pF
nC
ns
ns
mJ
ns
mJ
S
THERMAL AND MECHANICAL CHARACTERISTICS (IGBT and FRED)
Symbol
R
ΘJC
R
ΘJA
W
Torque
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Leakages include the FRED and IGBT.
3
See MIL-STD-750 Method 3471
4
Switching losses include the FRED and IGBT.
052-6257 Rev A
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case (IGBT)
Junction to Case (FRED)
Junction to Ambient
Package Weight
T
Mounting Torque (
Mounting = 8-32 or 4mm Machine and Terminals = 4mm Machine)
MINTYPMAX
0.24
0.66
20
1.03
29.2
10
1.1
UNIT
°C/W
oz
gm
lb•in
N•m
Page 3
APT50GF120JRD
ULTRAFAST SOFT RECOVERY PARALLEL DIODE
MAXIMUM RATINGS (FRED)All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
V
RRM
V
RWM
IF(AV)
(RMS)
I
F
I
FSM
Characteristic / Test Conditions
Maximum D.C. Reverse Voltage
R
Maximum Peak Repetitive Reverse Voltage
Maximum Working Peak Reverse Voltage
Maximum Average Forward Current (T
RMS Forward Current
Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3mS)
= 60°C, Duty Cycle = 0.5)
C
STATIC ELECTRICAL CHARACTERISTICS (FRED)
Symbol
V
Characteristic / Test Conditions
Maximum Forward VoltageI
F
IF = 60A
F
IF = 60A, TJ = 150°C
= 120A
APT50GF120JRD
1200
60
100
540
MINTYPMAX
2.5
2.0
2.0
UNIT
Volts
Amps
UNIT
Volts
DYNAMIC CHARACTERISTICS (FRED)
Symbol
t
rr1
t
rr2
t
rr3
t
fr1
t
fr2
I
RRM1
I
RRM2
Q
rr1
Q
rr2
V
fr1
V
fr2
diM/dt
Characteristic
Reverse Recovery Time, I
Reverse Recovery TimeTJ = 25°C
= 60A, diF/dt = -480A/µs, VR = 650VTJ = 100°C
I
F
Forward Recovery TimeTJ = 25°C
= 60A, diF/dt = 480A/µs, VR = 650VTJ = 100°C
I
F
Reverse Recovery CurrentT
I
= 60A, diF/dt = -480A/µs, VR = 650VTJ = 100°C
F
Recovery ChargeT
I
= 60A, diF/dt = -480A/µs, VR = 650VTJ = 100°C
F
Forward Recovery VoltageT
= 60A, diF/dt = 480A/µs, VR = 650VTJ = 100°C
I
F
Rate of Fall of Recovery CurrentT
I
= 60A, diF/dt = -480A/µs, VR =650VTJ = 100°C
F
PRELIMINARY
= 1.0A, diF/dt = -15A/µs, VR = 30V, TJ = 25°C
F
= 25°C
J
= 25°C
J
= 25°C
J
= 25°C
J
MINTYPMAX
7085
70
130
170
170
1830
2940
630
1820
12
12
900
600
UNIT
ns
Amps
nC
Volts
A/µs
052-6257 Rev A
Page 4
30µH
APT50GF120JRD
V
r
D.U.T.
t
Q
/
rr
rr
Waveform
+15v
diF/dt Adjust
0v
-15v
Figure 25, Diode Reverse Recovery Test Circuit and Waveforms
1
- Forward Conduction Current
I
F
di
2
/dt - Current Slew Rate, Rate of Forward
F
Current Change Through Zero Crossing.
1
Zero
3
4
5
6
- Peak Reverse Recovery Current.
I
RRM
trr - Reverse Recovery Time Measured from Point of I
Current Falling Through Zero to a Tangent Line
Extrapolated Through Zero Defined by 0.75 and 0.50 I
Qrr - Area Under the Curve Defined by I
PRELIMINARY
diM/dt - Maximum Rate of Current Change During the Trailing Portion of t
PRELIMINARY
Figure 8, Diode Reverse Recovery Waveform and Definitions
RRM
and trr.
F
6
{
diM/dt
RRM
}
.
PEARSON 411
CURRENT
TRANSFORMER
3
2
rr.
4
6
5
0.5 I
RRM
0.75 I
RRM
Q
rr
= 1/
t
I
(
rr
2
)
RRM
.
r = 4.0 (.157)
(2 places)
052-6257 Rev A
31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
8.9 (.350)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
4.0 (.157)
4.2 (.165)
(2 places)
3.3 (.129)
3.6 (.143)
* Emitter Collector
* Emitter
Dimensions in Millimeters and (Inches)
9.6 (.378)
1.95 (.077)
2.14 (.084)
Hex Nut M4
(4 places)
0.75 (.030)
0.85 (.033)
*
Source terminals are shorted
internally. Current handling
capability is equal for either
Source terminal.
Gate
12.6 (.496)
12.8 (.504)
25.2 (0.992)
25.4 (1.000)
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