Datasheet APT5010JVFR Datasheet (Advanced Power Technology APT)

Page 1
APT5010JVFR
500V 44A 0.100
POWER MOS V
®
FREDFET
Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V
also achieves faster switching speeds through optimized gate layout.
• Fast Recovery Body Diode • 100% Avalanche Tested
S
G
®
ISOTOP
D
®
FREDFET
S
SOT-227
"UL Recognized"
D
• Lower Leakage • Popular SOT-227 Package
G
• Faster Switching
S
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage Continuous Drain Current @ T Pulsed Drain Current
1
= 25°C
C
Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ TC = 25°C Linear Derating Factor Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec.
1
Avalanche Current Repetitive Avalanche Energy Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
4
APT5010JVFR
500
44
176
±30 ±40
450
3.6
-55 to 150 300
44 50
2500
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 57 9215 15 FAX: (33) 5 56 47 97 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
(V
DS
Drain-Source On-State Resistance Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V Gate-Source Leakage Current (VGS = ±30V, V
= 0V, ID = 250µA)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
500
44
24
0.100 250
1000 ±100
UNIT
Volts
Amps Ohms
µA
nA
Volts
050-5597 Rev B
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
V
GS
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
RG = 0.6
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
= 0V
GS
= 15V
DSS
DSS
APT5010JVFR
MIN TYP MAX
7400 8900 1000 1400
380 570 312 470
50 75
127 190
14 30 16 32 54 80
510
UNIT
pF
nC
ns
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
1
(Body Diode)
2
dt
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µs)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µs) Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µs)
(VGS = 0V, IS = -ID [Cont.])
5
T
= 25°C 250
j
T
= 125°C 500
j
T
= 25°C 1.6
j
T
= 125°C 5.5
j
T
= 25°C 15
j
T
= 125°C 27
j
THERMAL/PACKAGE CHARACTERISTICS
Symbol
R R
V
Isolation
Torque
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θJC
Junction to Ambient
θJA
RMS Voltage
(50-60 Hz Sinusoidal Waveform From Terminals to Mounting Base for 1 Min.)
Maximum Torque for Device Mounting Screws and Electrical Terminations.
3
See MIL-STD-750 Method 3471
4
Starting T
5
IS -ID [Cont.], VR = 200V
0.3 D=0.5
0.1
0.05
0.2
0.1
+25°C, L = 2.58mH, R
j
=
di
/
dt
MIN TYP MAX
MIN TYP MAX
2500
= 100A/µs, V
25, Peak IL = 44A
G
=
V
DSS
, T
DD
176
0.28
150°C, R
j
44
1.3 5
40
13
UNIT
Amps
Volts
V/ns
µC
Amps
UNIT
°C/W
Volts
lb•in
= 2.0,
G
ns
050-5597 Rev B
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001 10
0.02
0.01
-5
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
SINGLE PULSE
-4
10
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
-1
10
1.0 10
Page 3
APT5010JVFR
100
80
VGS=7V, 8V, 10V & 15V
6V
100
80
VGS=7V, 8V & 10V
VGS=15V
6V
60
40
20
, DRAIN CURRENT (AMPERES)
D
0
050100150200250 024681012 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
5.5V
5V
4.5V 4V
60
40
20
, DRAIN CURRENT (AMPERES)
D
0
5.5V
4.5V
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
100
80
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST
60
@ <0.5 % DUTY CYCLE
TJ = -55°C
TJ = +25°C
TJ = +125°C
40
20
, DRAIN CURRENT (AMPERES) I
D
0
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
TJ = +125°C
TJ = +25°C
02468 020406080100120
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
TJ = -55°C
50
1.5
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
1.4
1.3
1.2 VGS=10V
1.1
VGS=20V
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.9
DS
1.15
5V
4V
40
30
20
10
, DRAIN CURRENT (AMPERES) I
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
, DRAIN-TO-SOURCE BREAKDOWN R
1.10
1.05
1.00
0.95
DSS
0.90
1.2
1.1
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (°C) TC, CASE TEMPERATURE (°C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5597 Rev B
Page 4
200
OPERATION HERE
100
LIMITED BY RDS (ON)
50
10
5
1
TC =+25°C
.5
, DRAIN CURRENT (AMPERES)
D
TJ =+150°C SINGLE PULSE
10µS
100µS
1mS
10mS
100mS DC
30,000
10,000
5,000
1,000
500
APT5010JVFR
C
iss
C
oss
C
rss
.1
1 5 10 50 100 500 .01 .1 1 10 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 100 200 300 400 500 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
g
VDS=100V
VDS=250V
VDS=400V
100
200
100
50
10
5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
T
=+150°C T
J
=+25°C
J
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
W=4.1 (.161) W=4.3 (.169)
H=4.8 (.187) H=4.9 (.193)
(4 places)
12.2 (.480)
8.9 (.350)
9.6 (.378) Hex Nut M4
(4 places)
r = 4.0 (.157)
(2 places)
14.9 (.587)
15.1 (.594)
4.0 (.157)
4.2 (.165) (2 places)
3.3 (.129)
3.6 (.143)
* Source Drain
0.75 (.030)
0.85 (.033)
1.95 (.077)
2.14 (.084)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
* Source
Gate
Dimensions in Millimeters and (Inches)
®
ISOTOP
is a Registered Trademark of SGS Thomson.
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5597 Rev B
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
25.2 (0.992)
12.6 (.496)
25.4 (1.000)
12.8 (.504)
*
Source terminals are shorted internally. Current handling capability is equal for either Source terminal.
"UL Recognized" File No. E145592
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