Datasheet APT30M90AVR Datasheet (Advanced Power Technology APT)

Page 1
APT30M90AVR
300V 33A 0.090
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Faster Switching • 100% Avalanche Tested
• Lower Leakage • Popular TO-3 Package
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E E
Parameter
Drain-Source Voltage Continuous Drain Current @ T
D
Pulsed Drain Current Gate-Source Voltage Continuous
GS
1
= 25°C
C
Gate-Source Voltage Transient Total Power Dissipation @ TC = 25°C
D
Linear Derating Factor Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
1
Avalanche Current Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
(Repetitive and Non-Repetitive)
1
4
TO-3
G
APT30M90AVR
300
33
132
±30 ±40
235
1.88
-55 to 150 300
33 30
1300
D
S
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 579215 15 FAX: (33) 556 47 9761
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
(V
DS
Drain-Source On-State Resistance Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V Gate-Source Leakage Current (VGS = ±30V, V
= 0V, ID = 250µA)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 1.0mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
300
33
24
0.090 25
250
±100
UNIT
Volts
Amps Ohms
µA
nA
Volts
050-5822 Rev A
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
APT30M90AVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
V
GS
VDD = 0.5 V
ID = I
D[Cont.]
VGS = 15V
VDD = 0.5 V
ID = I
D[Cont.]
RG = 1.6
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current Diode Forward Voltage 2 (VGS = 0V, IS = -I
SD
Reverse Recovery Time (IS = -I
rr
Reverse Recovery Charge (I
rr
(Body Diode)
S
= -I
, dlS/dt = 100A/µs)
D[Cont.]
, dlS/dt = 100A/µs)
D[Cont.]
D[Cont.]
)
= 0V
GS
= 10V
DSS
@ 25°C
DSS
@ 25°C
MIN TYP MAX
4100 4950
700 980 200 300 130 195
25 37 55 77 12 24 10 20 43 65
714
MIN TYP MAX
33
132
1.3
390
6
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
050-5582 Rev A
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case Junction to Ambient
θJA
0.6
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001
-5
10
3
See MIL-STD-750 Method 3471
4
Starting T
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
+25°C, L = 2.39mH, R
j
=
-1
10
MIN TYP MAX
0.53 30
25, Peak IL = 33A
G
=
1.0 10
UNIT
°C/W
Page 3
APT30M90AVR
60
VGS=6V, 7V, 10V & 15V
50
40
5.5V
60
50
VGS=15V
VGS=10V
VGS=7V
6V
5.5V
40
30
5V
20
, DRAIN CURRENT (AMPERES)
10
D
0
0 30 60 90 120 150 0 1 2 3 4 5 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
4.5V
4V
30
20
, DRAIN CURRENT (AMPERES)
10
D
0
4.5V
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
60
TJ = -55°C
TJ = +25°C
50
40
VDS> ID (ON) x RDS (ON)MAX.
TJ = +125°C
250µSEC. PULSE TEST @ <0.5 % DUTY CYCLE
30
20
, DRAIN CURRENT (AMPERES) I
10
D
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
TJ = +125°C
TJ = +25°C
0
02468 0255075100125150
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
TJ = -55°C
35
2.0
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
1.8
1.6
1.4
1.2
VGS=10V
VGS=20V
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.8
DS
1.20
5V
4V
30
25
1.15
1.10
20
1.05
15
, DRAIN-TO-SOURCE BREAKDOWN R
1.00
0.95
DSS
0.90
1.2
1.1
10
, DRAIN CURRENT (AMPERES) I
5
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (°C) TC, CASE TEMPERATURE (°C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5822 Rev A
Page 4
150 100
50
OPERATION HERE
LIMITED BY RDS (ON)
10µS 100µS
10,000
5,000
APT30M90AVR
C
iss
10
5
1
TC =+25°C
.5
, DRAIN CURRENT (AMPERES)
D
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
TJ =+150°C SINGLE PULSE
.1
1 5 10 50 100 300 .01 .1 1 10 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
8
4
0
0 50 100 150 200 250 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
VDS=60V
VDS=150V
VDS=240V
1mS
10mS
100mS DC
1,000
500
100
200 100
T
50
10
5
1
.5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
.1
I
=+150°C T
J
=+25°C
J
C
oss
C
rss
22.23 (.875) Max.
6.35 (.250)
9.15 (.360)
TO-3 (TO-204AE) Package Outline
3.84 (.151)
4.09 (.161) (2-Places)
Seating Plane
Gate
Source
Drain
(Case)
1.47 (.058)
1.60 (.063) (2-Places)
1.52 (.060)
3.43 (.135)
7.92 (.312)
12.70 (.500)
Dimensions in Millimeters and (Inches)
16.64 (.655)
17.15 (.675)
29.90 (1.177)
30.40 (1.197)
5.21 (.205)
5.72 (.225)
10.67 (.420)
11.18 (.440)
25.15 (0.990)
26.67 (1.050)
38.61 (1.52)
39.12 (1.54)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5822 Rev A
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
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