Page 1
APT20M45BVR
200V 56A 0.045Ω
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Faster Switching • 100% Avalanche Tested
• Lower Leakage • Popular TO-247 Package
MAXIMUM RATINGS All Ratings: T C = 25° C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
1
= 25° C
C
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ TC = 25° C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
1
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
4
APT20M45BVR
TO-247
G
200
56
224
±30
±40
300
2.4
-55 to 150
300
56
30
1300
D
S
UNIT
Volts
Amps
Volts
Watts
W/° C
° C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33) 5 579215 15 FAX: (33) 55647 97 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2
(V
DS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ± 30V, V
= 0V, ID = 250µ A)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125° C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 1.0mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
200
56
24
0.045
25
250
± 100
UNIT
Volts
Amps
Ohms
µ A
nA
Volts
050-5514 Rev C
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θ JC
+ T
C
t
1
t
2
P
DM
APT20M45BVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
V
GS
VDD = 0.5 V
ID = I
D[Cont.]
VGS = 15V
VDD = 0.5 V
ID = I
D[Cont.]
RG = 1.6Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current
Diode Forward Voltage 2 (VGS = 0V, IS = -I
SD
Reverse Recovery Time (IS = -I
rr
Reverse Recovery Charge (I
rr
(Body Diode)
S
= -I
, dlS/dt = 100A/µ s)
D[Cont.]
, dlS/dt = 100A/µ s)
D[Cont.]
D[Cont.]
)
= 0V
GS
= 10V
DSS
@ 25° C
DSS
@ 25° C
MIN TYP MAX
4050 4860
980 1375
300 450
130 195
30 45
55 80
12 24
14 28
43 70
71 4
MIN TYP MAX
56
224
1.3
280
3.5
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µ C
050-5514 Rev C
THERMAL CHARACTERISTICS
Symbol
R
θ JC
R
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µ S, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
Junction to Ambient
θ JA
0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (° C/W)
JC
θ
Z
0.001
-5
10
3
See MIL-STD-750 Method 3471
4
Starting T
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
+25° C, L = 0.83mH, R
j
=
-1
10
MIN TYP MAX
0.42
40
25Ω , Peak IL = 56A
G
=
1.0 10
UNIT
°C/W
Page 3
APT20M45BVR
100
80
60
VGS=8V, 9V, 10V & 15V
6.5V
6V
100
80
60
VGS=15V
VGS=8V, 9V & 10V
7V
6.5V
6V
5.5V
40
40
5.5V
5V
20
, DRAIN CURRENT (AMPERES)
D
0
02 04 06 08 01 0 0 0 2 4 6 8 1 0
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
4.5V
4V
20
, DRAIN CURRENT (AMPERES)
D
0
4.5V
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
100
TJ = -55° C
TJ = +25° C
80
VDS> ID (ON) x RDS (ON)MAX.
250µ SEC. PULSE TEST
60
@ <0.5 % DUTY CYCLE
TJ = +125° C
40
TJ = +125° C
20
, DRAIN CURRENT (AMPERES) I
D
TJ = +25° C
TJ = -55° C
0
02468 04 0 8 0 1 2 0 1 6 0 2 0 0
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
60
1.6
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
1.4
1.2
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.8
DS
VGS=10V
VGS=20V
1.15
5V
4V
50
1.10
40
1.05
30
1.00
20
, DRAIN CURRENT (AMPERES) I
10
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (° C) TJ, JUNCTION TEMPERATURE (° C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
, DRAIN-TO-SOURCE BREAKDOWN R
0.95
DSS
0.90
1.2
1.1
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (° C) TC, CASE TEMPERATURE (° C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5514 Rev C
Page 4
300
OPERATION HERE
LIMITED BY RDS (ON)
100
50
10
5
TC =+25° C
, DRAIN CURRENT (AMPERES)
D
TJ =+150° C
SINGLE PULSE
1
1 5 10 50 100 200 .01 .1 1 10 50
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
VDS=40V
VDS=100V
VDS=160V
10µ S
100µ S
1mS
10mS
100mS
DC
10,000
5,000
1,000
500
100
300
100
C
iss
C
oss
C
rss
T
=+150° C T
50
J
=+25° C
J
APT20M45BVR
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 50 100 150 200 250 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
g
10
5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
TO-247 Package Outline
4.69 (.185)
Drain
5.31 (.209)
1.49 (.059)
2.49 (.098)
0.40 (.016)
0.79 (.031)
6.15 (.242) BSC
20.80 (.819)
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5514 Rev C
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058