Page 1
APT20M38BVFR
200V 67A 0.038Ω
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement
FREDFET
TO-247
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Fast Recovery Body Diode • 100% Avalanche Tested
• Lower Leakage • Popular TO-247 Package
• Faster Switching
G
D
FREDFET
S
MAXIMUM RATINGS All Ratings: T C = 25° C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
1
= 25° C
C
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ TC = 25° C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
1
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
4
APT20M38BVFR
200
67
268
±30
±40
370
2.96
-55 to 150
300
67
30
1300
UNIT
Volts
Amps
Volts
Watts
W/° C
° C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 579215 15 FAX: (33) 556 47 9761
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2
(V
DS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ± 30V, V
= 0V, ID = 250µ A)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125° C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 1.0mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
200
67
24
0.038
250
1000
± 100
UNIT
Volts
Amps
Ohms
µ A
nA
Volts
050-5602 Rev B
Page 2
DYNAMIC CHARACTERISTICS APT20M38BVFR
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θ JC
+ T
C
t
1
t
2
P
DM
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = I
[Cont.] @ 25° C
D
V
GS
VDD = 0.5 V
ID = I
[Cont.] @ 25° C
D
RG = 1.6Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current
Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
1
(Body Diode)
2
dt
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µ s)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µ s)
Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µ s)
(VGS = 0V, IS = -ID [Cont.])
5
MIN TYP MAX
GS
= 0V
5100 6120
1145 1600
390 585
148 225
DSS
47 75
75 110
= 15V
DSS
14 28
21 42
48 75
10 20
MIN TYP MAX
T
= 25° C 240
j
T
= 125° C 420
j
T
= 25° C 1
j
T
= 125° C 2
j
T
= 25° C 10
j
T
= 125° C 16
j
67
268
1.3
8
UNIT
pF
nC
ns
UNIT
Amps
Volts
V/ns
ns
µ C
Amps
050-5602 Rev B
THERMAL CHARACTERISTICS
Symbol
R
R
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µ S, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θ JC
Junction to Ambient
θ JA
0.4
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (° C/W)
JC
θ
Z
0.001
-5
10
3
See MIL-STD-750 Method 3471
4
Starting T
5
IS ≤ -ID [Cont.],
+25° C, L = 0.58mH, R
j
=
di
VR = 200V.
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
10
/
= 100A/µ s, V
dt
-1
MIN TYP MAX
0.34
40
25Ω , Peak IL = 67A
G
=
V
, T
DD
DSS
≤
1.0 10
150° C, R
j
≤
UNIT
° C/W
= 2.0Ω ,
G
Page 3
APT20M38BVFR
150
VGS=10V & 15V
150
VGS=15V
10V
120
7V
90
6.5V
120
90
6V
60
60
5.5V
30
, DRAIN CURRENT (AMPERES)
D
5V
30
, DRAIN CURRENT (AMPERES)
D
4.5V
0
0 2 04 06 08 01 0 0 0123456
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
0
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
150
TJ = -55° C
TJ = +25° C
120
VDS> ID (ON) x RDS (ON)MAX.
250µ SEC. PULSE TEST
90
@ <0.5 % DUTY CYCLE
TJ = +125° C
60
30
, DRAIN CURRENT (AMPERES) I
D
TJ = +125° C
TJ = +25° C
TJ = -55° C
0
0 2 4 6 8 10 0 40 80 120 160 200
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
70
1.3
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
1.2
1.1
VGS=10V
1.0
VGS=20V
0.9
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.8
DS
1.15
7V
6.5V
6V
5.5V
5V
4.5V
60
1.10
50
40
30
1.05
1.00
20
, DRAIN CURRENT (AMPERES) I
10
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (° C) TJ, JUNCTION TEMPERATURE (° C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
, DRAIN-TO-SOURCE BREAKDOWN R
0.95
DSS
0.90
1.2
1.1
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (° C) TC, CASE TEMPERATURE (° C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5602 Rev B
Page 4
300
OPERATION HERE
LIMITED BY RDS (ON)
100
50
10
5
TC =+25° C
, DRAIN CURRENT (AMPERES)
D
TJ =+150° C
SINGLE PULSE
1
1 5 10 50 100 200 .01 .1 1 10 50
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
VDS=40V
VDS=100V
VDS=160V
10µ S
100µ S
1mS
10mS
100mS
DC
15,000
10,000
5,000
1,000
500
100
300
100
C
iss
C
oss
C
rss
T
=+150° C T
50
J
=+25° C
J
APT20M38BVFR
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 50 100 150 200 250 300 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
g
10
5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
TO-247 Package Outline
4.69 (.185)
Drain
5.31 (.209)
1.49 (.059)
2.49 (.098)
0.40 (.016)
0.79 (.031)
6.15 (.242) BSC
20.80 (.819)
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5602 Rev B
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058