Datasheet APT10M25SVR Datasheet (Advanced Power Technology APT)

Page 1
APT10M25SVR
100V 75A 0.025
POWER MOS V
®
D3PAK
Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V also achieves faster switching speeds through optimized gate layout.
• Faster Switching • 100% Avalanche Tested
• Lower Leakage • Surface Mount D
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E E
Parameter
Drain-Source Voltage Continuous Drain Current @ T
D
Pulsed Drain Current Gate-Source Voltage Continuous
GS
1 5
= 25°C
C
Gate-Source Voltage Transient Total Power Dissipation @ T
D
Linear Derating Factor Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
1 5
= 25°C
C
(Repetitive and Non-Repetitive)
1
4
5
3
PAK Package
®
D
G
S
APT10M25SVR
100
UNIT
Volts
75
300
Amps
±30 ±40
Volts
300
2.4
-55 to 150
Watts
W/°C
°C
300
75
Amps
30
1500
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2 5
(V
Drain-Source On-State Resistance Zero Gate Voltage Drain Current (V
Zero Gate Voltage Drain Current (V Gate-Source Leakage Current (V Gate Threshold Voltage (V
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
= VGS, ID = 1.0mA)
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
> I
DS
D(on)
2
(VGS = 10V, 0.5 I
= V
DS
= 0.8 V
DS
= ±30V, V
GS
x R
DS(on)
, VGS = 0V)
DSS
DSS
DS
Max, VGS = 10V)
)
D[Cont.]
, VGS = 0V, TC = 125°C) = 0V)
MIN TYP MAX
100
75
0.025 250
1000 ±100
24
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33) 557921515 FAX: (33) 5 56 47 9761
UNIT
Volts
Amps Ohms
µA
nA
Volts
050-5518 Rev A
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
APT10M25SVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
Test Conditions
V
V
DS
f = 1 MHz
VGS = 10V
V
= 0.5 V
DD
ID = 0.5 I
V
GS
V
= 0.5 V
DD
ID = I
D[Cont.]
R
G
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current Diode Forward Voltage
SD
Reverse Recovery Time (I
rr
Reverse Recovery Charge (I
rr
1 5 2
(VGS = 0V, IS = -I
S
5
(Body Diode)
= -I
S
= -I
, dlS/dt = 100A/µs)
D[Cont.]
, dlS/dt = 100A/µs)
D[Cont.]
D[Cont.]
)
= 0V
GS
= 25V
D[Cont.]
= 15V
= 1.6
DSS
@ 25°C
DSS
@ 25°C
MIN TYP MAX
4300 5160 1600 2240
650 975 150 225
28 42 75 115
13 26 22 44 40 60 10 20
MIN TYP MAX
75
300
1.3
150
1.0
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
050-5518 Rev A
THERMAL CHARACTERISTICS
Symbol
R R
1
Repetitive Rating: Pulse width limited by maximum T
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
3
See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θJC
Junction to Ambient
θJA
0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001
-5
10
4
j
D=0.5
0.2
0.1
0.05
0.02
0.01 SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
Starting Tj = +25°C, L = 0.53mH, RG = 25, Peak IL = 75A
5
The maximum current is limited by lead temperature.
-2
10
-1
10
MIN TYP MAX
0.42 40
1.0 10
UNIT
°C/W
Page 3
APT10M25SVR
150
125
100
VGS=10V & 15V
7V
6.5V
150
125
100
VGS=15V
10V
7V
6.5V
75
50
, DRAIN CURRENT (AMPERES)
25
D
0
01020304050 0 1 2 3 4 5 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
6V
5.5V
5V
4.5V 4V
75
50
, DRAIN CURRENT (AMPERES)
25
D
0
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
150
125
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST @ <0.5 % DUTY CYCLE
100
75
TJ = -55°C
TJ = +25°C
TJ = +125°C
1.2
1.1
1.0
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
VGS=10V
50
0.9
, DRAIN CURRENT (AMPERES) I
25
D
TJ = +125°C
TJ = +25°C
0
0 2 4 6 8 10 0 25 50 75 100 125 150
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
V
GS
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, R
80
TJ = -55°C
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.8
DS
1.15
VGS=20V
(ON) vs DRAIN CURRENT
DS
6V
5.5V
5V
4.5V 4V
60
1.10
1.05
40
1.00
20
, DRAIN CURRENT (AMPERES) I
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TC, CASE TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
, DRAIN-TO-SOURCE BREAKDOWN R
0.95
DSS
0.90
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.00
ID = 0.5 ID [Cont.]
VGS = 10V
1.75
1.50
1.25
1.00
(NORMALIZED)
0.75
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.50
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
, JUNCTION TEMPERATURE (°C) TC, CASE TEMPERATURE (°C)
T
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
1.2
1.1
1.0
0.9
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5518 Rev A
Page 4
400
OPERATION HERE
LIMITED BY RDS (ON)
100
50
10
5
TC =+25°C
, DRAIN CURRENT (AMPERES)
D
TJ =+150°C SINGLE PULSE
100µS
1mS
10mS
100mS DC
15,000 10,000
5,000
1,000
500
APT10M25SVR
C
oss
C
iss
C
iss
C
oss
C
rss
1
1 5 10 50 100 .01 .1 1 10 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 50 100 150 200 250 300 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
g
VDS=20V
VDS=50V
VDS=80V
100
200
100
50
10
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
I
T
=+150°C T
J
5
1
=+25°C
J
D3PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
15.95 (.628)
16.05 (.632)
1.04 (.041)
1.15 (.045)
13.41 (.528)
13.51 (.532)
Drain
(Heat Sink)
13.79 (.543)
13.99 (.551)
1.27 (.050)
1.40 (.055)
1.98 (.078)
2.08 (.082)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
Revised
4/18/95
{3 Plcs}
1.22 (.048)
1.32 (.052)
5.45 (.215) BSC {2 Plcs.}
Source
Drain
Gate
Dimensions in Millimeters (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5518 Rev A
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
Revised 8/29/97
11.51 (.453)
11.61 (.457)
3.81 (.150)
4.06 (.160) (Base of Lead)
Heat Sink (Drain) and Leads are Plated
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