Datasheet APT100GF60JRD Datasheet (Advanced Power Technology APT)

Page 1
APT100GF60JRD
600V 140A
C
®
E
SOT-227
"UL Recognized"
C
Fast IGBT & FRED
The Fast IGBT™ is a new generation of high voltage power IGBTs. Using Non­Punch Through Technology the Fast IGBT™ combined with an APT free­wheeling ultraFast Recovery Epitaxial Diode (FRED) offers superior ruggedness and fast switching speed.
• Low Forward Voltage Drop • High Freq. Switching to 20KHz
E
G
ISOTOP
• Low Tail Current • Ultra Low Leakage Current
• RBSOA and SCSOA Rated
• Ultrafast Soft Recovery Antiparallel Diode
MAXIMUM RATINGS (IGBT) All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
CES
V
CGR
V
I
C1
I
C2
I
CM1
I
CM2
P
TJ,T
T
Parameter
Collector-Emitter Voltage Collector-Gate Voltage (R Gate-Emitter Voltage
GE
Continuous Collector Current @ T Continuous Collector Current @ T Pulsed Collector Current Pulsed Collector Current Total Power Dissipation
D
Operating and Storage Junction Temperature Range
STG
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
L
= 20K)
GE
= 25°C
C
= 90°C
C
1
@ TC = 25°C
1
@ TC = 90°C
G
APT100GF60JRD
600 600 ±20 140 100 280 200 390
-55 to 150 300
E
UNIT
Volts
Amps
Watts
°C
STATIC ELECTRICAL CHARACTERISTICS (IGBT)
Symbol
BV
VGE(TH)
V
CE
I
CES
I
GES
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 57 9215 15 FAX: (33) 5 56 4797 61
Characteristic / Test Conditions
Collector-Emitter Breakdown Voltage (V
CES
Gate Threshold Voltage (V Collector-Emitter On Voltage (VGE = 15V, IC = 50A, Tj = 25°C)
(ON)
Collector-Emitter On Voltage (VGE = 15V, IC = 50A, Tj = 125°C) Collector Cut-off Current (V Collector Cut-off Current (VCE = V Gate-Emitter Leakage Current (VGE = ±20V, V
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
PRELIMINARY
= VGE, IC = 700µA, Tj = 25°C)
CE
= V
CE
CES
CES
APT Website - http://www.advancedpower.com
= 0V, IC = 0.8mA)
GE
, VGE = 0V, Tj = 25°C) , VGE = 0V, Tj = 125°C)
= 0V)
CE
2
2
MIN TYP MAX
600
4.5 5.5 6.5
2.5 2.7
3.3 3.9
0.8
TBD
±100
UNIT
Volts
mA
nA
052-6255 Rev A
Page 2
DYNAMIC CHARACTERISTICS (IGBT) APT100GF60JRD
Symbol
C
ies
C
oes
C
res
Q
g
Q
ge
Q
gc
td(on)
t
r
td(off)
t
f
td(on)
t
r
td(off)
t
f
E
on
E
off
E
ts
td(on)
t
r
td(off)
t
f
E
ts
gfe
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Emitter Charge Gate-Collector ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy
4
Turn-off Switching Energy Total Switching Losses
4
Turn-on Delay Time Rise Time
PRELIMINARY
Turn-off Delay Time Fall Time Total Switching Losses
4
Forward Transconductance
Test Conditions
Capacitance
= 0V
V
GE
V
= 25V
CE
f = 1 MHz
Gate Charge
V
= 15V
GE
V
= 0.5V
CC
CES
I
= I
C
C2
Resistive Switching (25°C)
= 15V
V
GE
V
= 0.8V
CC
CES
I
= I
C
C2
RG = 5
Inductive Switching (150°C)
V
Inductive Switching (25
V
(Peak) = 0.66V
CLAMP
V
GE
I
R
T
= +150°C
J
(Peak) = 0.66V
CLAMP
V
GE
I
R
T
J
VCE = 20V, I
= 15V
= I
C
C2
= 5
G
= 15V
= I
C
C2
= 5
G
= +25°C
CES
°C)
CES
= I
C
C2
MIN TYP MAX
4400 5900
890 1250 290 435
335
40
195
30 105 145 135
40 200 250 140
7.0
5.6
13.6 40
200 210 115
11.0
6
UNIT
pF
nC
ns
ns
mJ
ns
mJ
S
THERMAL AND MECHANICAL CHARACTERISTICS (IGBT and FRED)
Symbol
R
ΘJC
R
ΘJA
W
Torque
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Leakages include the FRED and IGBT.
3
See MIL-STD-750 Method 3471
4
Switching losses include the FRED and IGBT.
052-6255 Rev A
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case (IGBT) Junction to Case (FRED) Junction to Ambient
Package Weight
T
Mounting Torque (
Mounting = 8-32 or 4mm Machine and Terminals = 4mm Machine)
MIN TYP MAX
0.32
0.42 40
1.03
29.2 10
1.1
UNIT
°C/W
oz
gm lb•in N•m
Page 3
APT100GF60JRD
ULTRAFAST SOFT RECOVERY PARALLEL DIODE
MAXIMUM RATINGS (FRED) All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
V
RRM
V
RWM
IF(AV)
(RMS)
I
F
I
FSM
Characteristic / Test Conditions
Maximum D.C. Reverse Voltage
R
Maximum Peak Repetitive Reverse Voltage Maximum Working Peak Reverse Voltage Maximum Average Forward Current (T RMS Forward Current Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3ms)
= 60°C, Duty Cycle = 0.5)
C
STATIC ELECTRICAL CHARACTERISTICS (FRED)
Symbol
V
Characteristic / Test Conditions
Maximum Forward Voltage I
F
I
F
F
IF = 100A, TJ = 150°C
= 100A = 200A
APT100GF60JRD
600
100 170
1000
MIN TYP MAX
2.0
1.7
1.7
UNIT
Volts
Amps
UNIT
Volts
DYNAMIC CHARACTERISTICS (FRED)
Symbol
t
rr1
t
rr2
t
rr3
t
fr1
t
fr2
I
RRM1
I
RRM2
Q
rr1
Q
rr2
V
fr1
V
fr2
diM/dt
Characteristic
Reverse Recovery Time, I Reverse Recovery Time TJ = 25°C
= 100A, diF/dt = -800A/µs, VR = 350V TJ = 100°C
I
F
Forward Recovery Time TJ = 25°C
= 100A, diF/dt = 800A/µs, VR = 350V TJ = 100°C
I
F
Reverse Recovery Current TJ = 25°C
= 100A, diF/dt = -800A/µs, VR = 350V TJ = 100°C
I
F
Recovery Charge T IF = 100A, diF/dt = -800A/µs, VR = 350V TJ = 100°C Forward Recovery Voltage T
= 100A, diF/dt = 800A/µs, VR = 350V TJ = 100°C
I
F
Rate of Fall of Recovery Current TJ = 25°C
= 100A, diF/dt = -800A/µs, VR = 350V (See Figure 10) TJ = 100°C
I
F
PRELIMINARY
= 1.0A, diF/dt = -15A/µs, VR = 30V, TJ = 25°C
F
= 25°C
J
= 25°C
J
MIN TYP MAX
60 75 60
92 185 185
27 38
42 54 810
1930
10.2
10.2 600 400
UNIT
ns
Amps
nC
Volts
A/µs
052-6255 Rev A
Page 4
300
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
240
180
120
TJ = 150°C
TJ = 100°C
TJ = 25°C
4000
3000
2000
TJ=100°C
VR=350V
APT100GF60JRD
200A
100A
, FORWARD CURRENT
F
60
0
0 1 2 3 4 10 50 100 500 1000
VF, ANODE-TO-CATHODE VOLTAGE (VOLTS) diF/dt, CURRENT SLEW RATE (AMPERES/µSEC)
TJ = -55°C
1000
, REVERSE RECOVERY CHARGE
rr
0
50A
Figure 1, Forward Voltage Drop vs Forward Current Figure 2, Reverse Recovery Charge vs Current Slew Rate
1.6
Q
1.2
t
0.8
0.4
, DYNAMIC PARAMETERS Q
f
I
rr
RRM
rr
t
rr
Q
rr
0.0
, REVERSE RECOVERY CURRENT I
RRM
60
TJ=100°C VR=350V
50
40
200A
100A
50A
30
20
10
0
0 200 400 600 800 1000 -50 -25 0 25 50 75 100 125 150
diF/dt, CURRENT SLEW RATE (AMPERES/µSEC) TJ, JUNCTION TEMPERATURE (°C)
Figure 3, Reverse Recovery Current vs Current Slew Rate Figure 4, Dynamic Parameters vs Junction Temperature
400
300
TJ=100°C VR=350V
200A
3000
2500
2000
TJ=100°C VR=350V
IF=100A
V
fr
15
12.5
10
100A
200
50A
PRELIMINARY
1500
1000
(nano-SECONDS) (NORMALIZED) (nano-COULOMBS)
7.5
5
100
, REVERSE RECOVERY TIME I
rr
0
0 200 400 600 800 1000 0 200 400 600 800 1000
/dt, CURRENT SLEW RATE (AMPERES/µSEC) diF/dt, CURRENT SLEW RATE (AMPERES/µSEC)
di
Figure 5, Reverse Recovery Time vs Current Slew Rate Figure 6, Forward Recovery Voltage/Time vs Current Slew Rate
F
, FORWARD RECOVERY TIME K
500
fr
t
t
fr
0
2.5
0
0.5 D=0.5
(VOLTS)
, FORWARD RECOVERY VOLTAGE
fr
V
052-6255 Rev A
0.1
0.05
0.2
0.1
0.05
(°C/W) (nano-SECONDS) (AMPERES) (AMPERES)
0.01
, THERMAL IMPEDANCE t
0.005
ΘJC
Z
0.001
-5
10
Figure 7, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration
0.02
0.01 SINGLE PULSE
-4
10
-3
10
V
RECTANGULAR PULSE DURATION (SECONDS)
, REVERSE VOLTAGE (VOLTS)
R
-2
10
-1
10
1.0 10
Page 5
30µH
APT100GF60JRD
V
r
D.U.T.
t
Q
/
rr
rr
Waveform
+15v
diF/dt Adjust
0v
-15v
Figure 25, Diode Reverse Recovery Test Circuit and Waveforms
1
- Forward Conduction Current
I
F
di
2
/dt - Current Slew Rate, Rate of Forward
F
Current Change Through Zero Crossing.
1
Zero
3
4
5 6
- Peak Reverse Recovery Current.
I
RRM
trr - Reverse Recovery Time Measured from Point of I
Current Falling Through Zero to a Tangent Line
Extrapolated Through Zero Defined by 0.75 and 0.50 I
Qrr - Area Under the Curve Defined by I
PRELIMINARY
diM/dt - Maximum Rate of Current Change During the Trailing Portion of t
PRELIMINARY
Figure 8, Diode Reverse Recovery Waveform and Definitions
RRM
and trr.
F
6
{ diM/dt}
.
RRM
PEARSON 411
CURRENT
TRANSFORMER
3
2
rr.
4
6
5
0.5 I
RRM
0.75 I
RRM
Q
rr
= 1/
t
I
(
rr
2
)
RRM
.
r = 4.0 (.157) (2 places)
052-6255 Rev A
31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
8.9 (.350)
W=4.1 (.161) W=4.3 (.169)
H=4.8 (.187) H=4.9 (.193)
(4 places)
4.0 (.157)
4.2 (.165) (2 places)
3.3 (.129)
3.6 (.143)
* Emitter Collector
* Emitter
Dimensions in Millimeters and (Inches)
9.6 (.378)
1.95 (.077)
2.14 (.084)
Hex Nut M4 (4 places)
0.75 (.030)
0.85 (.033)
*
Source terminals are shorted internally. Current handling capability is equal for either Source terminal.
Gate
12.6 (.496)
12.8 (.504)
25.2 (0.992)
25.4 (1.000)
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