Datasheet APT10050LVFR, APT10050B2VFR Datasheet (Advanced Power Technology APT)

Page 1
APT10050B2VFR
APT10050LVFR
1000V 21A 0.500W
®
B2VR
POWER MOS V
Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Identical Specifications: T-MAX™ or TO-264 Package
• Faster Switching • 100% Avalanche Tested
• Lower Leakage
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E E
Parameter
Drain-Source Voltage Continuous Drain Current @ T
D
Pulsed Drain Current Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient Total Power Dissipation @ TC = 25°C
D
Linear Derating Factor Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
1
1
(Repetitive and Non-Repetitive)
= 25°C
C
1
4
T-MAX
G
APT10050
-55 to 150
1000
21
84 ±30 ±40 520
4.16
300
21
50
2500
TO-264
LVR
D
S
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA EUROPE Chemin de Magret F-33700 Merignac - France Phone: (33)5 579215 15 FAX: (33)5 56 4797 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current Drain-Source On-State Resistance Zero Gate Voltage Drain Current (VDS = V Zero Gate Voltage Drain Current (V Gate-Source Leakage Current (VGS = ±30V, V Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
(V
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
)
MIN TYP MAX
1000
21
24
0.500 250
1000 ±100
UNIT
Volts
Amps Ohms
µA
nA
Volts
050-5591 Rev C 10-2000
Page 2
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
DYNAMIC CHARACTERISTICS
APT10050B2VFR/LVFR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Timexxdx Turn-off Delay Time Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
V
GS
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
RG = 0.6W
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
1
(Body Diode)
2
dt
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µs)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µs) Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µs)
(VGS = 0V, IS = -ID [Cont.])
5
MIN TYP MAX
GS
= 0V
6600 7900
595 830 290 430 335 500
DSS
29 45
165 250
= 15V
DSS
16 32 13 26 59 90
816
MIN TYP MAX
T
= 25°C 300
j
T
= 125°C 600
j
T
= 25°C 1.7
j
T
= 125°C 4.8
j
T
= 25°C 12
j
T
= 125°C 19
j
21 84
1.3 5
UNIT
pF
nC
ns
UNIT
Amps
Volts
V/ns
ns
µC
Amps
050-5591 Rev C 10-2000
THERMAL CHARACTERISTICS
Symbol
R R
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
qJC
Junction to Ambient
qJA
0.3
D=0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
q
Z
0.001
-5
10
0.2
0.1
0.05
0.02
0.01
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-4
10
SINGLE PULSE
10
RECTANGULAR PULSE DURATION (SECONDS)
3
See MIL-STD-750 Method 3471
4
Starting T
5
IS £ -ID [Cont.],
+25°C, L = 11.34mH, R
j
=
di
VR = 200V.
-3
-2
10
10
/
= 100A/µs, V
dt
-1
MIN TYP MAX
0.24 40
25W, Peak IL = 21A
G
=
V
, T
DD
DSS
-
1.0 10
150°C, R
j
-
UNIT
°C/W
= 2.0W,
G
Page 3
APT10050B2VFR/LVFR
50
50
40
30
VGS=5.5V, 10V & 15V
5V
20
4.5V
10
, DRAIN CURRENT (AMPERES)
D
0
0 100 200 300 400 500 0 4 8 12 16 20 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
4V
40
VGS=5.5V, 10V & 15V
30
20
10
, DRAIN CURRENT (AMPERES)
D
0
4.5V
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
50
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST @ <0.5 % DUTY CYCLE
40
1.3
1.2
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
30
1.1
20
10
, DRAIN CURRENT (AMPERES) I
D
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
TJ = +125°C
TJ = +25°C
0
02468 01020304050
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
25
TJ = -55°C
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.9
DS
1.15
VGS=10V
VGS=20V
5V
4V
20
1.10
1.05
15
1.00
10
0.95
5
, DRAIN CURRENT (AMPERES) I
D
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
, DRAIN-TO-SOURCE BREAKDOWN R
0.90
DSS
0.85
1.2
1.1
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (°C) TC, CASE TEMPERATURE (°C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5591 Rev C 10-2000
Page 4
100
OPERATION HERE
50
LIMITED BY RDS (ON)
10
5
1
TC =+25°C
.5
, DRAIN CURRENT (AMPERES)
D
TJ =+150°C SINGLE PULSE
10µS 100µS
1mS
10mS
100mS DC
30,000
10,000
5,000
1,000
500
APT10050B2VFR/LVFR
C
iss
C
oss
C
rss
.1
1 5 10 50 100 5001000 .01 .1 1 10 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
100
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
16
12
8
ID = ID [Cont.]
VDS=100V
VDS=200V
VDS=500V
100
T
50
=+150°C T
J
=+25°C
J
10
5
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 100 200 300 400 500 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
T-MAXTM (B2) Package Outline
TO-264 (L) Package Outline
Drain
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
0.40 (.016)
0.79 (.031)
20.80 (.819)
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate Drain
Drain
4.60 (.181)
5.21 (.205)
1.80 (.071)
2.01 (.079)
25.48 (1.003)
26.49 (1.043)
19.81 (.780)
21.39 (.842)
Source
0.48 (.019)
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC 2-Plcs.
0.84 (.033)
2.59 (.102)
3.00 (.118)
These dimensions are equal to the TO-247 without the mounting hole.
Dimensions in Millimeters and (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5591 Rev C 10-2000
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
Dimensions in Millimeters and (Inches)
5.79 (.228)
6.20 (.244)
2.29 (.090)
2.69 (.106)
0.76 (.030)
1.30 (.051)
2.79 (.110)
3.18 (.125)
5.45 (.215) BSC 2-Plcs.
19.51 (.768)
20.50 (.807)
3.10 (.122)
3.48 (.137)
2.29 (.090)
2.69 (.106)
Gate Drain Source
Loading...