Datasheet APS1026EDJ, APS1026EMJ Datasheet (APSemi) [ru]

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APSemi APS1026
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Dual Channel 1.5 MHz, 600mA
Synchronous Step-Down DC-DC Converter
GENERAL DESCRIPTION
2.5V to 5.5V input voltage and is ideal for powering portable equipment that runs from a single cell lithium-Ion (Li+) battery. It can supply 600mA output current for each channel and can also run at 100% duty cycle for low dropout operation, extending battery life in portable system.
User can select between idle mode or power saving mode via Mode/Sync input pin. Idle mode provides low ripple noise at light load while power saving Mode provides high efficiency at light load.
APPLICATIONS
Portable Media Players
Digital Still Cameras
Cellular Telephones
PDAs
Wireless and DSL modems

FEATURES

High Efficiency: Up to 95%
600mA Output Current at Vin=3.0V
1.5MHz Constant Frequency Operation
Very Low Quiescent Current of 40uA
No Schottky Diode Required
Low R
Internal Switches: 0.35Ω
DS(on)
0.6V reference allows low Output Voltage
Current Mode Operation for excellent line
and load transient Response
Short-Circuit & Thermal Fault Protection
<1μA Shut Down Current
Power-On Reset Output
Externally Synchronizable Oscillator
Small Thermally Enhanced MSOP-10 and
DFN-10 Package

EVALUATION BOARD

Board Number Dimensions (Inches)
EV1026EMJ
(MSOP)
EV1026EDJ
(DFN)
2.4”X x 2.4”Y x 0.5”X
2.4”X x 2.4”Y x 0.5”X
Typical Application
Figure 1. Basic Application Circuit
.
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APS1026 Efficiency vs Load Current
100
95
90
85
80
75
70
65
60
EFFICIENCY ( %)
55
50
45
40
35
0.1 1 10 100 1000
1.8V
1.2V
LOAD CURRENT (mA
TA = 25C V
= 3.3V
IN
1.5V
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APSemi APS1026
+0.3V
IN
(Note 1)
Peak SW1, SW2 Sink & Source Current ..... 1.5A
Operating Temperature Range... -40°C to +85°C Junction Temperature
(Note2)
.....................+125°C
Storage Temperature Range .... -65°C to +150°C
Lead Temperature (Soldering, 10s).........+300°C
Absolute Maximum Rating
Input Supply Voltage ...................... -0.3V to +6V
RUN1, RUN2........................... -0.3V to VIN+0.3V
VFB1, VFB2 Voltages ............. -0.3V to VIN+0.3V
SW1, SW2 Voltages................ -0.3V to V
POR Voltages ......................... -0.3V to VIN+0.3V
Package/Order Information
10-Lead (3mm X 3mm) Plastic DFN
Exposed Pad is PGND (Pin 11)
Must be connected to GND.
10-Lead Plastic MSOP
Exposed Pad is PGND (Pin 11)
Must be connected to GND.
Part Number Top Mark Temp Range Part Number Top Mark Temp Range
APS1026EDJ D2XY
(Note4)
-45 to 85
APS1026EMJ D1XY
Thermal Resistance
Package Ө
MSOP-10 (EXPOSE PAD)
DFN-10 (EXPOSE PAD)
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: TJ is calculated from the ambient temperature T
T
Note 3: Thermal Resistance is specified with approximately 1 square of 1 oz copper. Note 4: XY = Manufacturing Date Code. X = Year and Y = Week.
= TA + (PD) x Ө
J
JA
.
(Note 3)
:
JA
Ө
JC
45℃/W 10/W
45/W 10/W
and power dissipation PD according to the following formula:
A
-45 to 85
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APSemi APS1026
Electrical Characteristics
(VIN =V
= 3.6V, TA = 25°C, Test circuit of Figure 3, unless otherwise noted.)
RUN
(Note 5)
Parameter Conditions MIN TYP MAX Unit
Input Voltage Range 2.5 5.5 V
Input DC Supply Current
Active Mode Sleep Mode Shutdown Mode
Regulated Feedback Voltage
V
= V = V
= 0.5V, MODE = GND
FB2
= 0.63V, MODE = 3.6V
FB2
FB1
V
FB1
RUN = 0V, VIN = 4.2V, MODE = 0V
500
45
0.3
TA = +25°C, Channel 1 or 2 0.5880 0.6000 0.6120 V TA= 0°C TA 85°C, Channel 1 or 2 0.5865 0.6000 0.6135 V T
= -40°C TA 85°C, Channel 1 or 2 0.5850 0.6000 0.6150 V
A
800
60
2
µA µA µA
Feedback Pin Input Current VFB = 0.65V ±30 nA
Reference Voltage Line Regulation
Output Voltage Line Regulation
Output Voltage Load Regulation
= 2.5V to 5.5V, V
V
IN
VIN = 2.5V to 5.5V, V I
= 10mA
OUT
= VFB (R2=0) 0.04 0.40 %/V
OUT
= 1.8V,
OUT
VIN = 3.6V, , I
= 0 to 600mA, Mode = 3.6V or 0V
OUT
0.24 0.40 %/V
0.0015 %/mA
Maximum Output Current V
Oscillator Frequency V
R
R
of P-CH MOSFET VIN = 3.6V, IL = 100mA 0.35 0.45
DS(ON)
of N-CH MOSFET VIN = 3.6V, IL = 100mA 0.28 0.45
DS(ON)
Peak Inductor Current VIN=3V, V
SW Leakage V
Output Over Voltage Lockout
= 3.0V 600 mA
IN
= 0.6V 1.2 1.5 1.8 MHz
FB1/2
= V
FB1
= 0V, VSW= 0V or 5V, VIN = 5V ±0.01 ±1 µA
RUN
V
OVLX
= V
OVLX
= 0V, SW1 or SW2 1.0 A
FB2
– V
20 50 80 mV
FBX
RUN Threshold -40°C TA  85°C 0.3 0.45 1.30 V
RUN Leakage Current ±0.1 ±1 µA
V
Ramping Up, MODE/SYN = 0V 8.5 %
FBX
V
Ramping Down, MODE/SYN =
Power-On Reset Threshold (POR)
FBX
0V Power-On Reset Delay 175 mS
-8.5 %
Power-On Reset On-Resistance 100
Note 5: 100% production test at +25°C. Specifications over the temperature range are guaranteed by design and characterization.
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Typical Performance Characteristics
(Test Figure 1 above unless otherwise specified)
Efficiency vs Load Current
100
Power Saving Mode
90
80
70
60
50
40
EFFICIENCY (%)
30
20
10
0
0.1 1 10 100 1000
Oscillator Frequency vs Supply Voltage
1.8
1.7
Idle Mode
1.6
Pulse Skipping Mode
VIN = 3.6V VOUT = 1.8V TA = 25C NO LOAD ON OTHER CHANNEL
LOAD CURRENT (mA
L = 2.2μH Iload = 150mA Vout = 1.8V
Efficiency vs Input Voltage
100
95
90
85
80
1mA
75
EFFICIENCY (%)
70
TA = 25C
65
VOUT = 1.8V
60
2 3 4 56
4.0
TA = 25C
3.0
2.0 Pulse Skipping Mode
1.0
100mA
10mA
INPUT VOLT AGE (V
Load Regulation
Power Saving Mode
600mA
1.5
1.4
OSCILLATOR FREQUENCY (MHz)
1.3
1.2
2.7 3.15 3.6 4.05 4.5 4.95 5.4
Power Saving Mode
SUPPLY VOLTAGE (V
Power Saving Mode Operation
Efficiency vs Load Current
100
95
90
85
80
75
EFFICIENCY (%)
70
65
2.7V
3.3V
4.2V
TA = 25C VOUT = 1.2V
0.0
ERROR (%)
OUT
-1.0
V
-2.0 VIN = 3.6V
VOUT = 1.8V
-3.0
NO LOAD ON OTHER CHANNEL
-4.0
1 10 100 1000
LOAD CURRENT (mA
Power Saving Mode Operation
Efficiency vs Load Current
100
95
90
85
80
75
EFFICIENCY (%)
70
65
2.7V
3.3V
4.2V
TA = 25C VOUT = 1.5V
60
1 10 100 1000
LOAD CURRENT (mA
Note: No load on the other channel
60
1 10 100 1000
LOAD CURRENT (mA
Note: No load on the other channel
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Power Saving Mode Operation
Efficiency vs Load Current
100
95
2.7V
Power Saving Mode Operation
Efficiency vs Load Current
100
2.7V
95
90
85
EFFICIENCY
80
75
70
1 10 100 1000
LOAD CURRENT (mA
4.2V
3.3V
TA = 25C VOUT = 1.8V
Note: No load on the other channel
Idle Mode Operation
Efficiency vs Load Current
100%
90%
3.3V
80%
70%
EFFICIENCY (%)
60%
2.7V
50%
40%
1 10 100 1000
LOAD CURRENT (mA
4.2V
TA = 25C VOUT = 1.8V
Note: No load on the other channel
Oscillator Frequency vs Temperature
1.800
1.700
1.600
1.500
1.400
FREQUENCY (MHz)
1.300
1.200
-48 -32 -16 0 16 32 48 64 80 96
TEMPERATURE (C
90
3.3V
85
EFFICIENCY (%)
80
75
70
1 10 100 1000
LOAD CURRENT (mA
4.2
TA = 25C VOUT = 2.5V
Note: No load on the other channel
Idle Mode Operation
Efficiency vs Load Current
100%
90%
2.7V
80%
4.2V
3.3V
TA = 25C VOUT = 1.5V
70%
EFFICIENCY (%)
60%
50%
40%
1 10 100 1000
LOAD CURRENT (mA
Note: No load on the other channel
VFB vs Temperature
0.612
0.610
0.608
0.605
0.602
0.600
0.598
VOLTAGE (C)
0.595
0.592
0.590
0.588
Vin = 3.6V Vout = 1.8V Iload = 0mA
-50 -30 -10 10 30 50 70 90
TEMPERATURE (C
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Rds(on) vs Input Voltage
0.4
0.38
0.36
0.34
0.32
0.3
0.28
RDS(ON) (Ω)
0.26
0.24
0.22
0.2 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 6
Synchr onous Switc h
INPUT VOLT AGE (V
TA = 25C
Main Switch
Load Transient Response
Power Saving Mode to PWM mode
Load Transient Response
PWM Mode Only
Load Transient Response
Idle Mode to PWM mode
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Pin Description
PIN NAME FUNCTION & Description
1 VFB1
2 RUN1 Channel 1 Enable 3 VIN Power Supply 4 SW1 Channel 1 power switch output 5 GND Ground
6 MODE/SYNC
7 SW2 Channel 2 power switch output. 8 POR Power On Reset. 9 RUN2 Enable pin of Channel 2.
10 VFB2
11 EXPOSED PAD Power Ground. It must be connect to ground properly.
Functional Block Diagram
Channel 1 output feedback. It receives the feedback voltage from the external resistive divider across the output.
Combination Mode selection and Oscillator Synchronization. When MODE/SYNC = High, the circuit is in Idle mode operation; When MODE/SYNC = High, the circuit is in power saving mode operation.
Channel 2 output feedback.
resistive divider across the output.
It receives the feedback voltage from the external
Figure 2. APS1026 Block Diagram
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Operation
The APS1026 is a monolithic switching mode Step-Down DC-DC converter. It utilizes internal MOSEFETs to achieve high efficiency and can generate very low output voltage by using internal reference at 0.6V. It operates at a fixed switching frequency, and uses the slope compensated current mode architecture. This Step-Down DC-DC Converter supplies 600mA output current at VIN = 3V with input voltage range from 2.5V to 5.5V. With the mode selection pin, users may select the Power Saving Mode, optimizing efficiency at light load (Mode=Vin) or the Idle Mode, optimizing ripple at light load (Mode=GND).
Current Mode PWM Control
Slope compensated current mode PWM control provides stable switching and cycle-by-cycle current limit for excellent load and line responses and protection of the internal main switch (P-Ch MOSFET) and synchronous rectifier (N-CH MOSFET). During normal operation, the internal P-Ch MOSFET is turned on for a certain time to ramp the inductor current at each rising edge of the internal oscillator, and switched off when the peak inductor current is above the error voltage. The current comparator, I current. When the main switch is off, the synchronous rectifier will be turned on immediately and stay on until either the inductor current starts to reverse, as indicated by the current reversal comparator, I beginning of the next clock cycle. The OVDET comparator controls output transient overshoots by turning the main switch off and keeping it off until the fault is no longer present.
limits the peak inductor
COMP,
, or the
ZERO
Idle Operation
Two modes, the power saving mode and idle mode, are available to control the operation of the APS1026 at low currents. Both modes automatically switch from continuous operation to the selected mode when the load current is low.
The APS1026 may be selected to enter Idle operation (Mode=Vin) at light load. In the pulsing skipping mode, the inductor current may reach zero or reverse on each pulse. The PWM control loop will automatically skip pulses to maintain
output regulation. The bottom MOSFET is turned off by the current reversal comparator,
and the switch voltage will ring. This is
I
ZERO,
discontinuous mode operation, and is normal behavior for the switching regulator.
Power Saving Operation
The APS1026 may be selected to enter Power Saving Mode (Mode=GND) at light load. In power saving mode at light load, a control circuit puts most of the circuit into sleep in order to reduce quiescent current and improve efficiency at light load. When the output voltage drops to certain threshold, the control circuit turns back on the oscillator and the PWM control loop, boosting output backup. When an upper threshold is reached, the control circuit again puts most of circuit into sleep, reducing quiescent current. While the power saving mode improves light load efficiency, however, with the turning on and off, the noise or ripple voltage is larger than that in the pulse skiing mode.
Dropout Operation
When the input voltage decreases toward the value of the output voltage, the APS1026 allows the main switch to remain on for more than one switching cycle and increases the duty cycle until it reaches 100%. The duty cycle D of a step-down converter is defined as:
V
fTD
OSCON
Where T oscillator frequency.
The output voltage then is the input voltage minus the voltage drop across the main switch and the inductor. At low input supply voltage, the R increases, and the efficiency of the converter decreases. Caution must be exercised to ensure the heat dissipated not to exceed the maximum junction temperature of the IC.
is the main switch on time and f
ON
DS(ON)
of the P-Channel MOSFET
V
OUT
IN
OSC
%100%100 ×××=
is the
Maximum Load Current
The APS1026 will operate with input supply voltage as low as 2.5V, however, the maximum load current decreases at lower input due to large IR drop on the main switch and synchronous rectifier. The slope compensation
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signal reduces the peak inductor current as a function of the duty cycle to prevent sub­harmonic oscillations at duty cycles greater than 50%. Conversely the current limit increases as the duty cycle decreases.
Layout Guidance
When laying out the PC board, the following suggestions should be taken to ensure proper operation of the APS1026. These items are also illustrated graphically in Figure 3 and 4.
1. The power traces, including the GND trace, the SW trace and the VIN trace should be kept short, direct and wide.
2. The VFB pin should be connected directly to the feedback resistor. The resistive divider R1/R2 must be connected between the (+) plate of COUT and ground.
3. Connect the (+) plate of CIN to the VIN pin as closely as possible. This capacitor provides the AC current to internal power MOSFET.
4. Keep the switching node, SW, away from the sensitive VFB node.
5. Keep the (-) plates of CIN and COUT as close as possible.
Figure 3. APS1026 Typical Application Circuit
Figure 4. APS1026 Typical Application Circuit Layout
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APPLICATIONS INFORMATION
Setting the Output Voltage
Figure 3 above shows the basic application circuit for the APS1026. The external resistor sets the output voltage according to the following equation:
R
VV
OUT
Table 1 – Resistor select for output voltage setting
V
OUT
1.2V 316k 316k
1.5V 316k 474k
1.8V 316k 632k
2.5V 316k 1001k
⎜ ⎝
R1(R3) R2(R4)
Inductor Selection
For most designs, the APS1026 operates with inductors of 1µH to 4.7µH. Low inductance values are physically smaller but require faster switching, which results in some efficiency loss. The inductor value can be derived from the following equation:
()
=
IΔ
=210mA.
L
L
IΔ
L
Where is inductor Ripple Current. Large value inductors lower ripple current and small
value inductors result in high ripple currents. Choose inductor ripple current approximately 35% of the maximum load current 600mA, or
For output voltages above 2.0V, when light-load efficiency is important, the minimum recommended inductor is 2.2µH. For optimum voltage-positioning load transients, choose an inductor with DC series resistance in the 50m to 150m range. For higher efficiency at heavy loads (above 200mA), or minimal load regulation (but some transient overshoot), the resistance should be kept below 100m. The DC current
2
16.0
+=
R
1
×
VVV
OUTINOUT
×Δ×
fIV
OSCLIN
rating of the inductor should be at least equal to the maximum load current plus half the ripple current to prevent core saturation (600mA+105mA). Table 1 lists some typical surface mount inductors that meet target applications for the APS1026.
Part #
Sumida
CR43
Sumida
CDRH4D18
Toko
D312C
L
(µH)
1.4
2.2
3.3
4.7
1.5
2.2
3.3
4.7
1.5
2.2
3.3
4.7
Max
DCR
(m)
56.2
71.2
86.2
108.7
75 110 162
120 140 180 240
Rated
D.C.
Current
(A)
2.52
1.75
1.44
1.15
1.32
1.04
0.84
1.29
1.14
0.98
0.79
Size
WxLxH
(mm)
4.5x4.0x3.5
4.7x4.7x2.0
3.6x3.6x1.2
Input Capacitor Selection
The input capacitor reduces the surge current drawn from the input and switching noise from the device. The input capacitor impedance at the switching frequency shall be less than input source impedance to prevent high frequency switching current passing to the input. A low ESR input capacitor sized for maximum RMS current must be used. Ceramic capacitors with X5R or X7R dielectrics are highly recommended because of their low ESR and small temperature coefficients. A 4.7µF ceramic capacitor for most applications is sufficient.
Output Capacitor Selection
The output capacitor is required to keep the output voltage ripple small and to ensure regulation loop stability. The output capacitor must have low impedance at the switching frequency. Ceramic capacitors with X5R or X7R dielectrics are recommended due to their low ESR and high ripple current. The output ripple
is determined by:
V
OUT
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Package Description
MSOP-10
Figure 5 Package Dimensions of 10-lead Plastic MSOP
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DFN-10
Dimension: mm
A 0.75 A1 0.02 A3 0.20 ref
aaa 0.15 bbb 0.10
ccc 0.10 ddd 0.05 eee 0.08 ggg 0.10
D BSC 3.00 E BSC 3.00
D2 2.20-2.70
E2 1.40-1.75
L 0.40
N 10
ND 5
Figure 6 Package Dimensions of 10-lead Plastic DFN (3mmX3mm)
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IMPORTANT NOTICE
Analog Power Semiconductor (ShangHai) Co., Ltd. reserves the right to make changes without further notice to any products or specifications herein. Analog Power Semiconductor (ShangHai) Co., Ltd. does not assume any responsibility for use of any its products for any particular purpose, nor does Analog Power Semiconductor (ShangHai) Co., Ltd assume any liability arising out of the application or use of any its products or circuits. Analog Power Semiconductor (ShangHai) Co., Ltd does not convey any license under its patent rights or other rights nor the rights of others.
Analog Power Semiconductor IPCore Technologies (Shanghai) Co., Ltd. 11 Floor, Block B, Hi-Tech Building, 900 Yishan Road, Shanghai, 200233, P.R. China Tel: (8621) 5423-5088 Fax: (8621) 5423-5090
http://www.apsemi.com; http://www.ipcoreinc.com
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