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APLUS APR9301-V2
Functional Block Diagram
Figure 2 shows the functional block diagram for the APR9301-V2
Figure 2 APR9301 -V2 Functional Block Diagram
V
V
V
CCA
CCD
SSD
V
SSA
OscR
AnaIn
AnaOut
MicIn
MicRef
Internal
Oscillator
Amp
Pre-
Amp
Switched
Capacitor Filter
Automatic G ain
AGC
Control (AGC)
Sample Application
Figure 3 shows the diagram for a single, 20-second message
recordin
device. When pins are connected as shown in this example,
the operating modes are as follows:
Record Mode (Level-Activated)
A sin
The /LED pin will
to provide a visual indication if an LED li
this pin. The chip is in record mode as long as the /RecL pin
sta
20 seconds, recordin
last available memory cell is written. If the message is shorter
than 20 seconds, the recordin
the /RecL pin
tristated during the recording operation.
Messages of up to 30 seconds can be recorded by usin
different OscR resistor values (see Table 1).
and playback application using theAPR9301
le voice message of up to 20 seconds can be recorded.
o low during the actual recording process
ht is connected to
s low (level-activated). If the message lasts longer than
will terminate automatically after the
operation will stop when the
oes high. The speaker driver is automaticall
Power Supplies
Sample & Hold
Circuit
Analog W rite &
Read Circuits
Non-Volatile
Analog Storage
Mem ory Array
Playback Mode (Edge-Activated)
Playback always starts from the beginning of the message.
The chip is in pla
e-activated). Playback will stop immediately when the
E pin pulses low a second time. If the newly recorded
/Pla
messa
the remaining portion of the previous message will not be
pla
amplifier, AGC, and main amplifier circuits are disabled
during playback.
Standby Mode (/CE = "0")
The chip will automaticall
recordin
Power Down Mode (/CE = "1")
The chip is alwa
is allowed. Current consumption is t
e is shorter than the previously recorded message,
ed after the new message is played back. The input pre-
or playback operation is completed.
back mode after the /PlayE pin pulses low
s in standby state. No recording or playback
Switched
Capacitor Filter
Amp
Device Control
/PlayE
/RecL
return to the standby state after
/LED
pically less than 1 uA.
SP+
SP-
Pag
e 2
APLUS APR9301-V2
Figure 3 Sample Application for the APR9301-V2
VCC(6VDC)
For low power applications
use double pole switch.
Notes:
NC = No Connect (must be floating).
Pins 23 and 27 have internal pull-up resistors.
The typical sampling frequency is 6.4 kHz with OscR = 52 k
0.1µF
W. Substrate should be connected to GND.
4.7K
Table 1Typical Dependence of Sampling Frequency and Total Voice Duration on OscR Resistor Value
= V
(V
CCA
Pin 7 - OscRTypical Sampling FrequencyCutoff Frequency (3 dB Point)Typical Total Voice Duration
W
38 k
W
52 k
W
67 k
W
89 k
CCD
= 6V; V
SSA
= V
= 0V; TA = 25oC)
SSD
8 kHz3.4 kHz16 seconds
6.4 kHz2.7 kHz20 seconds
5.3 kHz2.3 kHz24 seconds
4.0 kHz1.7 kHz32 seconds
Page 3
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APLUS APR9301-V2
Figure 4 shows the same application using external
microphone biasing instead of the microphone amplifier on
the APR9301 -V2 , thus b
of the chip function.
Figure 4 Sample Application Using External Microphone Biasing
Notes:
NC = No Connect (must be floating).
Pins 23 and 27 have internal pull-up resistors.
The typical sampling frequency is 6.4 kHz with OscR = 52 kW.
NPN bipolar transistor, T1 model #MPS3904 or equivalent.
R1 and R2 are recommended to be 30 kW and 10 kW, respectively, for typical applications.
Electrical Characteristics
Tables 2 through 4 list Absolute Maximum Ratings,
Recommended DC Characteristics, and recommended
Analog Characteristics for the APR9301 -V2 device.
Absolute Maximum Ratings
Stresses greater than those listed in Table 2 may cause
permanent damage to the device. These specifications
represent a stress ratin
these or any other conditions above those specified in the
recommended DC Characteristics or recommended Analo
Characteristics of this specification is not implied. Operation
of the device at maximum conditions for extended periods
may affect reliability.
only. Operation of the device at
Substrate should be connected to GND.
Page 4
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APLUS APR9301-V2
Table 2Absolute Maximum Ratings.
ItemSymbolConditionMinMaxUnit
OH
OL
IH
IL
OZ
CC
TA = 25 oC
o
TA = 25
C
|IIN| < 20 mA
--65150
--65125
<10s-300
5.56.5V
-0.3
-1.0
CC
VCC +0.3
VCC +1.0
V
V
o
C
o
C
o
C
IOH = -1.6mA2.4--V
IOL = 4.0mA--0.45V
VIH = V
VIL = VSS
V
= V
OUT
or
V
OUT
CC
Note 2
CC
= VSS
--1.0
-1.0 - -
-1.0
- 1.0
Internal Clock, No Load-25-mA
No Load - 1.0 -
V
uA
uA
uA
uA
T
V
V
V
STG
T
T
CC
IN1
IN2
BS
LD
Note 1
Power Supply Voltage
Input Voltage
Input Volta
Stora
e
e Temperature
Temperature Under Bias
Lead Temperature
Table 3DC Characteristics
ItemSymbolConditionMinTypMaxUnit
Input High VoltageVIH-0.8 x-V
Input Low Volta
Output Hi
Output Low Volta
Input Leaka
Input Leakage CurrentI
Output Tristate Leakage Current I
Operating Current ConsumptionI
Standby Current Consumption I
eVIL---0.8V
h VoltageV
eV
e CurrentI
CCS
Table 4Analog Characteristics
Note 1
ItemSymbolConditionMinTypMaxUnit
MicIn Input VoltageVMI---20mV
MicIn Input ResistanceR
MicIn Amp Gain (1)G
MicIn Amp Gain (2)G
AnaIn Input VoltageV
AnaIn Input ResistanceR
AnaIn Amp GainG
AGC Output ResistanceR
SP+/- Output PowerP
Voltage Amplitude Across SP+/-V
MI
MI1
MI2
ANI
ANI
ANI
AGC
SP
SP
--10-k
AGC < 2.2V-24-dB
AGC > 3.0V--45-15dB
---50mV
--10-k
AnaIn to SP+/--22-dB
--1-k
= 16
> 16
W
W
-12.2-mW
-1.25-V
R
R
SP+/-
SP+/-
Total Harmonic DistrotionTHD@ 1kHz & 20mVp-p input1%
Note 1: Typical Values: V
CCD
= V
CCA
= 6V; V
SSD
= V
SSA
= 0V; T
= 25oC
A
Note 2: Except pins 23 and 27 which have internal pull-up resistors.
P-P
W
P-P
W
W
P-P
Page 5
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APLUS APR9301-V2
Bonding Pad Diagram & Description of Bonding Pad Coordinates
Figure 5 APR9301-V2 Die Bonding Pad Diagram
/C
E
OscR
N
CNC
N
C
NC
C
V
C
C
D
V
CC
D
ecL
R
/
N
NC
APR9301-V2
C
N
NC
NC
1
U
N
A
S
S
D
V
S
S
V
+
P
A
S
S
S
V
Table 5 APR9301 -V2 Bonding Pad Coordinates
Pin Pin Name X Axis
/CEChip Enable-2496.201565.80
OscROscillator Fre
NU1Connect to Ground-1808.45-1496.10
V
V
V
SSD
SSA
SSA
Digital Ground Suppl
Analog Ground Suppl
Analog Ground Suppl
SP+Non-Inverting Speaker Output-707.15-1390.00
SP-Inverting Speaker Output479.15-1389.90
V
V
CCA
CCA
Analog Power Suppl
Analog Power Suppl
MicInMicrophone Input1619.45-1551.40
uency-Setting Resistor-2459.55729.80
Notes:
2
D
U
N
NC
E
L
/
E
ay
l
/P
C
N
Die diagram is with respect to die
center
µ
m).
Die Dimensions:
x = 214 + 1 mils
= 144 + 1 mils
Die Thickness:
13.8 + 1.0 mils
AnaOut
S
V
P
V
-
C
C
C
C
A
A
AnaIn
M
M
A
ic
ic
G
R
C
e
I
n
f
350 + 25 µm
Pad Openin
110 µm
4.3 mils
:
Connect substrate to ground.
(Note)
Y Axis
(Note)
-1564.05-1572.00
-1384.05-1548.70
-1204.35-1477.10
976.45-1492.00
1190.40-1523.70
MicRefMicrophone Reference Input2035.45-1551.40
AGCAutomatic Gain Control2487.45-1551.40
AnaInAnalog Signal Input2487.45-1049.90
AnaOutAnalog Signal Output2487.45-648.90
/PlayEEd
e-Activated Playback2493.651371.10
/LEDLED Output1430.701565.80
NU2Connect to Ground865.751565.80
/RecLLevel-Activated Record258.151565.80
V
CCD
V
CCD
Note: With respect to die center
Page 6
Digital Power Suppl
Digital Power Suppl
µ
m
-229.401579.05
-510.801541.60
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