Datasheet APM4463KC-TU, APM4463KC-TR Datasheet (ANPEC)

Page 1
APM4463
P-Channel Enhancement Mode MOSFET
-20V/-10A, R
R
••
High Density Cell Design
••
••
Reliable and Rugged
••
••
SO-8 Package
••
=12m(typ.) @ VGS =-4.5V
DS(ON)
=18m(typ.) @ VGS =-2.5V
DS(ON)
Pin Description
Applications
Power Management in Notebook Computer,
Portable Equipment and Battery Powered Systems
Ordering and Marking Information
1
S
S
GD
2
3
45
8S
7
6
D
D
D
SO − 8
SSS
G
D
DDD
P-Channel MOSFET
APM4463
Handling Code Temp. Range Package Cod e
APM 4463 K :
APM4463 XXXXX
Absolute Maximum Ratings (T
Symbol
V
DSS
V
GSS
I
D
I
DM
P
D
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.
Drain-Source Voltage -20 Gate-Source Voltage ±16 Maximum Drain Current – Continuous -10 Maximum Drain Current – P ulse d -50 Maximum Power Dissipation
Parameter Rating Unit
Package Code K : S O -8 Operating Junction Temp. Range C : -5 5 to 1 5 0° C Handling Code TU : T u b e TR : T a p e & Reel
XXXXX - Date Code
= 25°C unless otherwise noted)
A
TA=25°C T
=100°C
A
2.5
1.0
V
A
W
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
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Page 2
APM4463
Thermal Characteristics
Symbol
T
J
T
STG
R
JA
θ
Maximum Junction Temperature 150 Storage Temperature Range -55 to 150 Thermal Resistance - Junction to Ambient 50 °C/W
Parameter Rating Unit
Electrical Characteristics (TA=25°C unless otherwise noted)
Symbol Parameter Test Condition
Static
BV
I
DSS
V
GS(th)
I
GSS
R
DS(ON)
V
Dynamic
Q Q Q
t
d(ON)
t
d(OFF)
C
C
C
Drain-Sour ce Break do w n Voltage
DSS
V
=0V, ID=-250µA
GS
Zero Gate Voltage Drain Current VDS=-16V, VGS=0V 1 uA Gate Threshold Voltage Gate Leakage Current VGS=±16V, V
Drain-Sour ce On-state Resistance
V
DS=VGS
VGS=-4.5V, ID=-10A 12 17
b
, ID=-250µA
=0V ±100 nA
DS
VGS=-2.5V, ID=-8A
Diode Forward Voltage
SD
a
Total Gate Charge 37 45
g
Gate-Source Charge 6.5
gs
Gate-Drain Charge
gd
b
ISD=-2.3A, VGS=0V 0.7 1.1 V
=-10V, VGS=-4.5V,
V
DS
=-10A
I
D
Turn-on Delay Time 40 60
=-10V, RL=-10Ω,
V
t
Turn-on Rise Time 40 60
r
Turn-off Delay Time 170 270
t
Turn-off Fall Time
f
Input Capacitance 4500
iss
Output Cap acita nce 1100
oss
Reverse Transfer Capacitance
rss
DD
=-1A , V
I
D
=6Ω,
R
G
V
=0V, VDS=-15V
GS
GEN
=-4.5V,
Frequency = 1.0 MH Z
Min. Typ
-20 V
0.7 1 1.5 V
APM4463
a
.
18 25
2.5
90 150
810
Max.
°C
Unit
m
nC
ns
pF
Notes
a
: Guaranteed by design, not s u bj ec t to p r oduction testing
b
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
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Page 3
APM4463
Typical Characteristics
Output Characteristics
30
-VGS=3,4,5,6,7,8,9,10V
25
20
15
10
-Drain Current (A)
DS
-I
5
0
0246810
-VDS-Drain-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.75
1.50
-VGS=2V
-IDS=250µA
Transfer Characteristics
40 35 30 25 20 15
-Drain Current (A)
DS
10
-I
5 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
TJ=25°C
TJ=125°C
TJ=-55°C
-VGS-Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.035
0.030
1.25
1.00
0.75
(Normalized)
0.50
0.25
-VGS(th)-Threshold Voltage (V)
0.00
-50 -25 0 25 50 75 100 125 150
Tj-Junction T emperature (°C)
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
0.025
-VGS=-2.5V
0.020
0.015
-On-Resistance (Ω)
0.010
DS(ON)
R
0.005
0.000 0 1020304050
-VGS=-4.5V
-IDS-Drain Current (A)
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Page 4
APM4463
Typical Characteristics (Cont.)
On-Resistance vs. Gate-to-Source Voltage
0.050
0.045
0.040
0.035
0.030
0.025
0.020
-On-Resistance (Ω)
0.015
DS (ON)
0.010
R
0.005
0.000 12345678910
-VGS-Gate-Source Voltage (V)
Gate Charge
5
-VDS=10V
-IDS=10A
4
3
-IDS=10A
On-Resistaence vs. Junction T emperature
1.8
-VGS=4.5V
-IDS=10A
1.6
1.4
1.2
1.0
(Normalized)
-On-Resistance (Ω)
0.8
DS(ON)
R
0.6
0.4
-50 -25 0 25 50 75 100 125 150
Tj-Junction T emperature (°C)
Capacitance Characteristics
7000
6000
5000
4000
Frequency=1MHz
Ciss
2
1
-Gate-to-Source Voltage (V)
GS
-V
0
0 1020304050
QG-T otal Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
3000
2000
C-Capacitance (pF)
1000
0
0 5 10 15 20
Coss
Crss
-VDS-Drain-to-Source Voltage (V)
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Page 5
APM4463
Typical Characteristics (Cont.)
Source-Drain Diode Forward Voltage
40
10
1
-Source Current (A)
SD
-I
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2
TJ=150°C
TJ=25°C
-VSD- Source-to-Drain Voltage (V)
Normalized Transient Thermal Transient Impedence, Junction to Ambient
Single Pulse Power
80
60
40
Power (W)
20
0
0.01 0.1 1 10
30
Time (sec)
1
Duty Cycle=0.5
D=0.2
D=0.1
0.1
D=0.05
Thermal Impedance
D=0.02
Normalized Effective Transient
SINGLE PULSE
0.01 1E-4 1E-3 0.01 0.1 1 10
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
Square Wave Pulse Duration (sec)
1. Duty Cycle , D=t1/t2
2. Per Unit Base=R
3. TJM-TA=PDMZ
4. Surface Mounted
thJA
thJA
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=50°C/W
30
Page 6
APM4463
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
HE
0.015X45
e1 e2
D
A1
A
1
L
0.004max.
Dim
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0. 010
D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC
18
φ
Millimeters Inches
Min. Max. Min. Max.
°
8
°
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
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Page 7
APM4463
Physical Specifications
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb). Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Peak temperature
temperature
Pre-heat temperature
°
183 C
Time
Classificatio n R e flo w P r of ile s
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak) 3°C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) Temperature maintained above 183°C Time within 5°C of actual peak temperature Peak temperature range Ramp-down rate Time 25°C to peak temperature
120 seconds max 60 – 150 seconds 10 –20 seconds 60 seconds 220 +5/-0°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C 6 °C /second max. 10 °C /second max. 6 minutes max.
VPR
Package Reflow Conditions
pkg. thickness ≥≥≥ 2.5mm and all bgas
Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
pkg. thickness < 2.5mm and pkg. volume ≥≥≥ 350 mm³
pkg. thickness < 2.5mm and pkg. volume < 350mm³
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Page 8
APM4463
Reliability test program
T est item Method Description
SOLDERABILITY MIL-STD-8 83D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t
W
E
F
Po
A
P
P1
Ao
J
D
Bo
D1
C
Ko
T2
B
T1
Application
SOP-8
Application
SOP-8
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
A B C J T1 T2 W P E
330±1 62 ± 1.5
F D D1 Po P1 Ao Bo Ko t
5.5 ± 0.1 1.55±0.1
12.75 +
0.1 5
1.55+ 0.25
2 + 0.5 12.4 +0.2
4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0.1 2.1± 0.1 0.3±0.013
2± 0.2
12 + 0.3
- 0.1
8± 0.1 1.75± 0.1
(mm)
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Page 9
APM4463
Cover Tape Dimensions
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, T aiwan, R.O.C. T el : 886-3-5642000 Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. T el : 886-2-89191368 Fax : 886-2-89191369
12 9.3 2500
Copyright ANPEC Electronics Corp. Rev. A.1 - Apr., 2003
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