Datasheet APM4427KC-TU, APM4427KC-TR Datasheet (ANPEC)

Page 1
APM4427
P-Channel Enhancement Mode MOSFET
-30V/-4A , R
R
••
Super High Dense Cell Design for Extremely
••
Low R
DS(ON)
••
Reliable and Rugged
••
••
SOP-8 Package
••
=88m(typ.) @ VGS=-10V
DS(ON)
=147m(typ.) @ VGS=-4.5V
DS(ON)
Pin Description
Applications
Power Management in Notebook Computer ,
Portable Equipment and Battery Powered Systems.
Ordering and Marking Information
1
S
S
GD
2
3
45
8S
7
6
D
D
D
SO − 8
SSS
G
D
DDD
P-Channel MOSFET
APM4427
Handling Code Temp. Range Package Cod e
APM 4427 K :
APM4427 XXXXX
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
*
I
D
I
DM
Drain-Source Voltage -30 Gate-Source Voltage ±20 Maximum Drain Current – Continuous -4 Maximum Drain Current – Pulsed -16
Parameter Rating Unit
Package Code K : S O -8 Operating Junction Temp. Range C : -5 5 to 1 5 0° C Handling Code TU : T u b e TR : T a p e & Re e l
XXXXX - Date Code
(TA = 25°C unless otherwise noted)
V
A
* Surface Mounted on FR4 Board, t ≤ 10 sec.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
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Page 2
APM4427
Absolute Maximum Ratings (Cont.) (T
Symbol
P
D
T
J
T
STG
R
jA
θ
Maximum Power Dissipation
Maximum Junction Temperature 150 Storage Temperature Range -55 to 150
Thermal Resistance – Junction to Ambient 50
Electrical Characteristics (T
Symbol Parameter Test Condition
Static
BV
I
DSS
V
GS(th)
I
GSS
R
DS(ON)
V
Dynamic
Q Q Q
t
d(ON)
T
t
d(OFF)
T
C
C
C
Drain-Source Breakd o w n
DSS
Voltage Zero Gate Voltage Drain
Current Gate Threshold Voltage
Gate Leakage Current Drain-Source On-state
a
Resistance
a
Diode Forward Voltage ISD=-1.25A , VGS=0V
SD
b
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
Turn-on Delay Time Turn-on Rise Time
r
Turn-off Delay Time Turn-off Fall Time
f
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
Parameter Rating Unit
TA=25°C T
=100°C
A
= 25°C unless otherwise noted)
A
V
=0V , IDS=-250µA
GS
V
=-24V , VGS=0V -1
DS
V V
, IDS=-250µA
DS=VGS
=±20V , VDS=0V
GS
VGS=-10V , IDS=-4A
=-4.5V , IDS=-2.3A
V
GS
=-15V , IDS=-2A
V
DS
=-10V
V
GS
=-15V , IDS=-1A ,
V
DD
=-10V , RG=6
V
GEN
R
=15
L
VGS=0V
=-25V
V
DS
Frequency=1.0MHz
= 25°C unless otherwise noted)
A
2.5
1.0
°
APM4427
Min. Typ. Max.
-30 V
-1 -1.5 -2 100
±
88 115
147 185
-0.7 -1.3
12.3 15
3.5
1.1 10 20 10 25 25 55
515 550 100
60
W
C
°
C
°
C/W
Unit
A
µ
V
nA
m
V
nC
ns
pF
Notes
a
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
b
: Guaranteed by design, not subject to production testing
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
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Page 3
APM4427
Typical Characteristics
Output Characteristics
20
-VGS=6,7,8,9,10V
16
-VGS=5V
12
8
-ID-Drain Current (A)
4
0
0246810
-VGS=4V
-VGS=3V
-VDS - Drain-to-Source V oltage (V)
Threshold Voltage vs. Junction Temperature
1.75
1.50
-IDS=250uA
Transfer Characteristics
20
16
12
8
-ID-Drain Current (A)
4
0
01234567
-VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.30
0.25
TJ=125°C
TJ=25°C
TJ=-55°C
1.25
1.00
0.75
(Normalized)
0.50
0.25
-VGS(th)-Threshold Voltage (V)
0.00
-50 -25 0 25 50 75 100 125 150
Tj - Junction T emperature (°C)
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
0.20
-VGS=4.5V
0.15
0.10
0.05
RDS(ON)-On-Resistance ()
0.00 012345678
-VGS=10V
-ID - Drain Current (A)
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Page 4
APM4427
Typical Characteristics (Cont.)
On-Resistance vs. Gate-to-Source Voltage
0.40
0.35
0.30
0.25
0.20
0.15
0.10
RDS(ON)-On-Resistance ()
0.05
0.00 2345678910
-VGS - Gate-to-Source Voltage (V)
Gate Charge
10
-VDS=15V
-ID=2A
8
-ID=4A
On-Resistance vs. Junction T emperature
2.00
-VGS=10V
-I
D=4A
1.75
1.50
1.25
1.00
0.75
(Normalized)
0.50
RDS(ON)-On-Resistance ()
0.25
0.00
-50 -25 0 25 50 75 100 125 1 50
TJ - Junction Temperature (°C)
Capacitance
800 700 600
Frequency=1MHz
Ciss
6
4
2
-VGS-Gate-Source Voltage (V)
0
02468101214
Q
G - Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
500 400 300
Capacitance (pF)
200 100
0
0 5 10 15 20 25 30
Coss
Crss
-VDS - Drain-to-Source Voltage (V)
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Page 5
APM4427
Typical Characteristics (Cont.)
Source-Drain Diode Forward Voltage
20 10
1
TJ=150°C
TJ=25°C
-IS-Source Current (A)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
-VSD -Source-to-Drain Voltage (V)
Normalized Thermal Transient Impedence, Junction to Ambient
Single Pulse Power
80 70 60 50 40 30
Power (W)
20 10
0
0.01 0.1 1 10 100
Time (sec)
1
Duty Cycle=0.5
D=0.2 D=0.1
0.1
D=0.05
Thermal Impedance
D=0.02
Normalized Effective Transient
0.01 1E-4 1E-3 0.01 0.1 1 10 100
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
SINGLE PULSE
Square Wave Pulse Duration (sec)
1.Duty Cycle, D=t1/t2
2.Per Unit Base=RthJA=50°C/W
3.TJM-TA=PDMZthJA
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Page 6
APM4427
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
HE
0.015X45
e1 e2
D
A1
A
1
L
0.004max.
Dim
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0. 010
D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC
18
φ
Millimeters Inches
Min. Max. Min. Max.
°
8
°
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
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Page 7
APM4427
Physical Specifications
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow C ond itio n
(IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature
Pre-heat temperature
°
183 C
Classificatio n R e flow Profiles
Peak temperature
Time
Convection or IR/ Convection VPR
Average ramp-up rate(183°C to Peak) 3°C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) Temperature maintained above 183°C Time within 5°C of actual peak
temperature Peak temperature range Ramp-down rate
Time 25°C to peak temperature
120 seconds max. 60 ~ 150 seconds 10 ~ 20 seconds 60 seconds
220 +5/-0°C or 235 +5/-0°C 215~ 2 19°C or 235 +5/-0°C 6 °C /second max. 10 °C /second max. 6 minutes max.
Package Reflow Conditions
pkg. thickness ≥≥≥ 2.5mm and all bags
Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
pkg. thickness < 2.5mm and pkg. volume ≥≥≥ 350 mm³
pkg. thickness < 2.5mm and p kg . volume < 350mm³
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Page 8
APM4427
Reliability test program
T est item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t
W
E
F
Po
A
P
P1
Ao
J
D
Bo
D1
C
Ko
T2
B
T1
Application
SOP-8
Application
SOP-8
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
A B C J T1 T2 W P E
330±1 62 ± 1.5
F D D1 Po P1 Ao Bo Ko t
5.5 ± 0.1 1.55±0.1
12.75 +
0.1 5
1.55+ 0.25
2 + 0.5 12.4 +0.2
4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0.1 2.1± 0.1 0.3±0.013
2± 0.2
12 + 0.3
- 0.1
8± 0.1 1.75± 0.1
(mm)
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Page 9
APM4427
Cover Tape Dimensions
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, T aiwan, R.O.C. T el : 886-3-5642000 Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. T el : 886-2-89191368 Fax : 886-2-89191369
12 9.3 2500
Copyright ANPEC Electronics Corp. Rev. A.1 - Mar., 2003
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