Datasheet APM4420 Datasheet (ANPEC)

Page 1
查询APM4420供应商
APM4420
N-Channel Enhancement Mode MOSFET
Features
30V/12.5A, R
R
••
Super High Dense Cell Design for
••
Extremely Low R
••
Reliable and Rugged
••
••
SO-8 Package
••
=6m(typ.) @ VGS=10V
DS(ON)
=10m(typ.) @ VGS=4.5V
DS(ON)
DS(ON)
Pin Description
Applications
Power Management in Notebook Computer ,
Portable Equipment and Battery Powered Systems .
Ordering and Marking Information
APM4420
Package Code K : SO-8 Operating Junction Temp. Range C : -55 to 125°C Handling Code TU : Tube TR : Tape & Reel
1
S
S
GD
2
3
45
8S
7
6
D
D
D
SO 8
D
G
S
N-Channel MOSFET
APM4420 K :
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
I
DM
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
Drain-So urc e Voltage 30 Gate-Source Voltage ±20 Maximum Drain Cu rr e nt – Continuou s 12.5 Maximu m D rain Curre nt – Pulsed 50
APM4420 XXXXX
XXXXX - Date Code
(TA = 25°C unless otherwise noted)
Parameter Rating Unit
V
A
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Page 2
APM4420
Absolute Maximum Ratings Cont. (T
Symbol
P
D
T
J
T
STG
R
θjA
Maximum Power Dissipation
Maximum Junction Temperature 150 Storage Temperature Range -55 to 150
Thermal Resistance – Junction to Ambient 50
Electrical Characteristics (T
Symbol Parameter Test Condition
Static
BV
I
DSS
V
GS(th)
I
GSS
R
DS(ON)
V
Dynamic
Drain-Source Brea k do w n
DSS
Voltage Zero Gate Voltage Drain
Gate Threshold Voltage Gate Leakage Current Drain-Source On-state
a
Resistance
a
Diode Forward Voltage ISD=2.3A, VGS=0V
SD
b
Parameter Rating Unit
= 25°C unless otherwise noted)
A
V
=0V, ID=250µA
GS
VDS=24V , VGS=0V 1 V V
DS=VGS
=
±16
GS
, ID=250µA
V, VDS=0V
VGS=10V, ID=12.5A
=4.5V, ID=7A
V
GS
= 25°C unless otherwise noted)
A
TA=25°C
=100°C
T
A
2.5
1.0
APM4420
Min. Typ. Max.
30 V
13
±
69
10 13
0.6 1.3
100
W
° °
C/W
°
C C
Unit
A
µ
V
nA
m
V
Q Q Q
t
d(ON)
T
t
d(OFF)
T C C C
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
Turn-on Delay Time Turn-on Rise Time
r
Turn-off Delay Time Turn-off Fall Time
f
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
=15V, ID=12.5A
V
DS
V
=5V ,
GS
V
=15V, ID=1A,
DD
V
GEN
VGS=0V
=15V
V
DS
Frequency=1.0MHz
Notes
a
: Guaranteed by design, not subject to production testing
b
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
=10V, RG=6Ω, RL=15
28 36
8
nC
5
13 20
915
43 66
ns
14 28
3200
680
pF
275
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Page 3
APM4420
Typical Characteristics
Output Characteristics
50
VGS=5,6,7,8,9,10V
40
VGS=4V
30
20
-Drain Current (A)
DS
I
10
VGS=3V
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VDS-Drain-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.4
1.2
1.0
IDS=250µA
Transfer Characteristics
50
40
30
20
-Drain Current (A)
DS
I
10
0
0123456
VGS-Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.016
0.014
0.012
0.010
TJ=25°C
TJ=-55°C
TJ=125°C
VGS=4.5V
0.8
(Normalized)
0.6
-Thershold Voltage (V)
GS(th)
0.4
V
0.2
-50 -25 0 25 50 75 100 125 150
Tj-Junction T emperature (°C)
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
0.008
0.006
-On-Resistance (Ω)
0.004
DS(ON)
R
0.002
0.000 0 1020304050
VGS=10V
IDS-Drain Current (A)
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Page 4
APM4420
Typical Characteristics Cont.
On-Resistance vs. Gate-to-Source Voltage
0.050
0.045
0.040
0.035
0.030
0.025
0.020
-On-Resistance (Ω)
0.015
DS (ON)
0.010
R
0.005
0.000 345678910
Gate Voltage (V)
Gate Charge
10
VDS=15V
IDS = 12.5A
8
IDS=12.5A
On-Resistaence vs. Junction T emperature
1.8
VGS=10V IDS=12.5A
1.6
1.4
1.2
1.0
(Normalized)
-On-Resistance (Ω)
0.8
DS(ON)
R
0.6
0.4
-50-250 255075100125150
Tj-Junction T emperature (°C)
Capacitance Characteristics
5000
4000
6
4
-Gate-to-Source Voltage (V)
2
GS
V
0
0 102030405060708090
QG-T otal Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
Ciss
3000
2000
C-Capacitance (pF)
1000
0
0 5 10 15 20 25 30
Coss
Crss
VDS-Drain-to-Source Voltage (V)
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Page 5
APM4420
Typical Characteristics Cont.
Source-Drain Diode Forward Voltage
50
10
TJ=150°C
-Source Current (A)
SD
I
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
TJ=25°C
VSD-Source to Drain Voltage
Normalized Transient Thermal Transient Impedence, Junction to Ambient
Single Pulse Power
60
50
40
30
Power (W)
20
10
0
-2
10
-1
10
0
10
Time (sec)
1
10
2
10
1
Duty Cycle=0.5
D=0.2
D=0.1
0.1
D=0.05
Thermal Impedance
D=0.02
Normalized Effective Transient
0.01 1E-4 1E-3 0.01 0.1 1 10
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
SINGLE PULSE
Square Wave Pulse Duration (sec)
1. Duty Cycle , D=t1/t2
2. Per Unit Base=R
3. TJM-TA=PDMZ
4. Surface Mounted
thJA
thJA
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=50°C/W
Page 6
APM4420
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
HE
0.015X45
e1 e2
D
A1
A
1
L
0.004max.
Dim
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0. 010
D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC
18
φ
Millimeters Inches
Min. Max. Min. Max.
°
8
°
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
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Page 7
APM4420
Physical Specifications
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, A NSI/J-STD-002 C a te g ory 3 .
Reflow Condition (IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
Peak temperature
temperature
Pre-heat temperature
°
183 C
Time
Clas sific atio n R e flow Pro file s
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak ) 3°C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) Tem perature maintained above 183°C Time within 5°C of actual peak temperature Peak temperature range Ramp-down ra te Time 2 5°C to peak temperature
120 seconds max 60 – 150 seconds 10 –20 seconds 60 seconds 220 +5/-0°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C 6 °C /second max. 10 °C /second max. 6 minutes max.
VPR
Pac k age Reflow Conditions
pkg. thickness ≥≥≥ 2.5m m and all bgas
Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
pkg. thickness < 2.5mm an d pkg. volume ≥≥≥ 350 mm³
pkg. thickness < 2.5mm and pkg. volume < 350m m³
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Page 8
APM4420
Reliability test program
T est item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t
W
E
F
Po
A
P
P1
Ao
J
D
Bo
D1
C
Ko
T2
B
T1
Application
SOP-8
Application
SOP-8
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
A B C J T1 T2 W P E
330±1 62 ± 1.5
F D D1 Po P1 Ao Bo Ko t
5.5 ± 0.1 1.55±0.1
12.75 +
0.1 5
1.55+ 0.25
2 + 0.5 12.4 +0.2
4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0.1 2.1± 0.1 0.3±0.013
2± 0.2
12 + 0.3
- 0.1
8± 0.1 1.75± 0.1
(mm)
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Page 9
APM4420
Cover Tape Dimensions
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, T aiwan, R.O.C. T el : 886-3-5642000 Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. T el : 886-2-89191368 Fax : 886-2-89191369
12 9.3 2500
Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2002
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